Even with advanced DFT (design for test) architectures, vendors are only able to identify existing faults. Stress testing like burn-in provides a long term predictive stress simulation environment but these tests are also only limited to a few years due to high test costs involved. There are often some critical elements (like register values) within designs that need a higher degree of robustness signoff than those offered by burn-in.
In order to meet these safety or reliability signoffs multi-modular redundancy like a triple voting flip-flop is a very common practice that offers the desired reliability with a minimal cost. Nevertheless, even with additional modular redundancy, designers still end up with blind spots for failures that become a major concern for safety compliant architectures.
This paper proposes a TVF (triple voting flip-flop) architecture that provides a more robust solution against data failures with increased fault coverage. The proposed design also offers a lower rate of failure than conventional TVF designs without any increase in the modular redundancy of existing flip-flops.