2-mm x 2-mm MOSFETs with tin-plated solderable side pads
June 14, 2012 // Paul Buckley
NXP Semiconductors has introduced what the company claims is the industry’s first MOSFETs in a 2-mm x 2-mm low-profile DFN (discrete flat no-leads) package with tin-plated, solderable side pads.
The unique side pads offer the advantage of optical soldering inspection, as well as a better quality of solder connection compared to conventional leadless packages.
Available immediately, the new PMPB11EN and PMPB20EN 30V N-Channel MOSFETs are the first of more than 20 devices housed in the DFN2020MD-6 (SOT1220) package from NXP. Both MOSFETs have a maximum drain current (ID) of >10 A, and very low Rds(on) values of 12 mOhm typ and 16.5 mOhm typ at 10 V respectively for reduced conduction losses, which enable lower power consumption and longer battery life.
Only 0.6 mm in height, the new DFN2020 MOSFETs are also thinner than most 2-mm x 2-mm products on the market today, making them ideal for ultra-small load switches, power converters, and charger switches in portable applications such as smartphones and tablets. The MOSFETs are also well suited for other space-constrained applications including DC motors, server and network communications, as well as LED lighting, where power density and efficiency are critical. Eight times smaller than standard SO8 packages, DFN2020 offers comparable thermal resistance, and can replace many larger MOSFET packages such as SO8, 3x3 or TSSOP8 with the same Rds(on) value range.
The new MOSFETs enhance NXP’s ultra-small leadless MOSFET line-up which will include more than 60 types in 2-mm x 2-mm and 1-mm x 0.6-mm package sizes by the end of this year. NXP is now a major player in low Rds(on) MOSFETs in small sizes, offering both FET and bipolar transistor technologies.
More information about the DFN2020 MOSFETs at
PMPB11EN - Nch 30 V VDS, 20 V VGS, 12 mOhm typ RDSon at 10 V: www.nxp.com/pip/PMPB11EN
PMPB20EN - Nch 30 V VDS, 20 V VGS, 16.5 mOhm typ RDSon at 10 V: www.nxp.com/pip/PMPB20EN
DFN2020MD-6 package at: www.nxp.com/packages/SOT1220.html
Structural electronics - the next big thing in smart cars?
September 18, 2014
Electronic circuits embedded in vehicles, aircraft and more have the potential to be a $60 billion market by 2025, says technology ...
Elastomeric camouflage switches texture and colour
Solar microinverter to break USD1bn barrier in 2018
7nm EUV could ease 10nm squeeze, says ASML
Europeans flex skills to commercialize OLED and OPV devices
Freescale opens Discovery Lab in Toulouse to foster innovation
September 17, 2014
Shortly after the company celebrated the first year of existence of its Austin-based Freescale Discovery Lab, an incubator ...
Can a large-area flexible OLED have reliable contacts?
Lemoptix pico-projector excels
Building ARM-based Bluetooth-enabled wearables
- Putting FPGAs to Work in Software Radio Systems Handbook
- Flexible and Low Power Driving of Solenoid Coils
- How to Protect & Monetize Android Apps
- Power Modules: The New Super Power
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.