20-nm ready for tape out in 2012, says ST
June 07, 2010 // Peter Clarke
STMicroelectronics NV will be ready to tape out designs using a 20-nm CMOS low power process technology in the fourth quarter of 2012, according to Jean-Marc Chery, the company's chief technology officer.
However, ST is not indicating it will ready to make those designs itself, which raises questions about how long ST can rely on its 300-mm wafer fab in Crolles, near Grenoble, France to be its leading-edge R&D and production site.
Chery was speaking at ST's annual analysts's day held here. The company's executives said the company was aiming at 5 to 7 percent capex to sales ratio as part of the "asset lighter" strategy the company is pursuing. It achieved 5.3 percent in 2009. However, that appears to leave no room for ST to ever lay down the several billions of dollars needed to wholly-own a new leading-edge fab.
Whatever does get taped out in a 20-nm design in 2012 is likely to be manufactured first at GlobalFoundries wafer fab in Dresden, Germany or another foundry that is also in the International Semiconductor Development Alliance (ISDA) based around IBM Microelectronics. It could even be one of the first designs to be made at a newly-opened GlobalFoundries fab in New York.
GlobalFoundries is known to be working on a 22-nm process at Dresden which will be used to start operations at the Albany fab that is underconstruction.
"I am very confident we will be able to tape out 20-nm LP in Q4 2012," said Chery. His slide showed that while work on 20-nm is for delivery to ST through an ISDA fab is beginning now in the second quarter of 2010, the same work for delivery through an STMicroelectronics fab is not due to start until Q1 2012.
ST has some processes on its roadmap including general purpose 40-nm and 28-nm that it does not intend to be able to manufacture itself, according to Chery's presentation.
"Beyond 20-nm we will have to change the transistor architecture. Planar will be unable to sustain [suitable operation] below 20-nm." Chery said ST faces a choice between fully depeleted silicon-on-insulator (FD-SOI) and FinFETs. Of course ST will only be a participant in those decisions, which are likely to be taken among the lead manufacturing partners within ISDA.
"Unfortunately you must use double-patterning, which affects productivity." Chery said he expects cost of ownership issues around extreme ultraviolet lithography to be "confirmed" in the third or fourth quarter of this year allowing decisions about a move to EUV lithography to be taken thereafter.
Switch to LED lighting cuts cruising energy costs by 60 percent
February 27, 2015
Europe’s leading holiday cruise company, Costa Cruises has upgraded ten of the company's fleet of cruise liners with more ...
Semitrex' ultimate goal: "one size fits all" power conversion
Porsche rainmaker advocates platooning
Radar-based sensor network helps drivers finding a parking spot
Xilinx flexes its muscles in the ADAS arena
The future of custom ASICs
February 26, 2015
With the prevailing view that Moore's Law is slowing Donnacha O’Riordan, director of services strategy for S3 Group, gives ...
Dual nanowire structure absorbs light efficiently
5 trends to watch at Mobile World Congress
Infineon: CAN FD success goes at the expense of FlexRay
- Software-Defined Radio Handbook
- A Four-Quadrant DC/DC Switching Regulator Smoothly Transitions from Positive to Negative Output Voltages for FPGA and Other Applications
- LED Driver with Integrated Spread Spectrum Reduces EMI without Adding Flicker
- Accelerate SDN and NFV with Off-the-Shelf Software
InterviewInfineon: CAN FD success goes at the expense of FlexRay
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay. ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
To ensure you have a good start in 2015, Freescale is giving away five of its QorIQ TWR-LS1021A Tower system modules, worth USD269 each, for EETimes Europe's readers to win.
The module is the most feature-rich and high-performance Tower system offered by Freescale, enabling compatibility and interoperability with the growing list of Tower expansion modules, offering an easily accessible...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.