3D packaging takes a key step forward as TSMC tapes out CoWoS chips
October 12, 2012 // Nick Flaherty
Fabless chip companies will have more design options for 3D integration and smaller footprint packaging as TSMC tapes out its first CoWoS (Chip on Wafer on Substrate) test chips using the JEDEC Wide I/O mobile DRAM interface.
The milestone demonstrates the industry’s system integration trend to achieve increased bandwidth, higher performance and superior energy efficiency by mounting the DRAM directly on the logic chip as a substrate using the Wide I/O interface.
TSMC’s CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component. Along with Wide I/O mobile DRAM, the integrated chips provide optimized system performance and a smaller form factor with significantly improved die-to-die connectivity bandwidth.
CoWoS is an integrated process technology that attaches silicon chips to a wafer through chip on wafer (CoW) bonding process. The CoW chip is attached to the substrate (CoW-On-Substrate) to form the final component and the technology has now entered the pilot production stage.
Key to the tapeout is the ecosystem with Wide I/O DRAM coming from SK Hynix, Wide I/O mobile DRAM IP from Cadence Design Systems and EDA tools from Cadence and Mentor Graphics.
The design flow includes the management of placement and routing of bumps, pads, interconnections, and C4 bumps; innovative combo-bump structure; accurate extraction and signal integrity analysis of high-speed interconnects between dies; thermal analysis from chip to package to system; and an integrated 3D testing methodology for die-level and stacking-level tests.
“Silicon validation is a critical step in the development of a highly advanced and complete CoWoS design solution,” said Cliff Hou, Vice President of Research and Development at TSMC. “The successful demonstration of the JEDEC Wide I/O mobile DRAM interface highlights the significant progress TSMC and its ecosystem partners have made to capitalize on the performance, energy efficiency and form factor advantages of CoWoS technology.”
”TSMC and Cadence have worked together to validate the industry’s first design IP for Wide I/O in TSMC’s CoWoS process,” said Martin Lund, Senior VP of Research and Development for the SoC Realization Group at Cadence. “Our design IP is capable of over 100Gbit/sec of DRAM bandwidth at very low power when connected to Wide I/O devices meeting the JEDEC JESD229 Standard.”
German company wins bid to crash cars in China
September 02, 2014
Numerous developments in the area of vehicle safety are significantly influenced as a result of current NCAP or NHTSA regulations ...
European semiconductors sales up 14.9% this year
EE Times' annual salary & opinion survey report
Toshiba announces image sensor strategy
DelfMEMS promotes CFO to CEO
Sensata to pay $1-bn for tire pressure sensor leader
September 01, 2014
Sensata Technologies Holding NV (Almelo, Netherlands) has announced it has reached an agreement to acquire the Schrader group ...
ADCs for high dynamic range – successive-approximation or sigma-delta?
Microchip in Pursuit of CSR
Samsung Funds III-V FinFETs in US Lab
- Power Modules: The New Super Power
- Flexible Performance for Network Security Appliances
- Digital Power Management Reduces Energy Costs While Improving System Performance
- Using RF Recording Techniques to Resolve Interference Problems
InterviewA question of Europe
Sir Peter Bonfield sits on the board and has advisory roles in many international companies and universities. With more than 45 years of experience in electronics, computers and communications, here he ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.