3D TSV chip market to grow more than 10 times faster than the global semiconductor industry, says Yole Développement
July 26, 2012 // Julien Happich
In its 3DIC & TSV Interconnects 2012 Business Update report, Yole Développement provides an update of the 3DIC & TSV technology market and define the market forecast for the next 5 years, providing a deeper understanding of the supply chain challenges and moves that are currently happening in this “middle-end” industry space.
Last year, the market value of all the devices using TSV packaged in 3D in the 3DIC or 3D-WLCSP platforms (CMOS image sensors, Ambient light sensors, Power Amplifiers, RF and inertial MEMS) was worth $2.7B. It will represent 9% of the total semiconductor value by 2017, hitting almost $40B, explains Lionel Cadix, Market & Technology Analyst, Advanced Packaging at Yole Dveloppement. 3DIC which typically uses TSV 'via middle' for memory and logic IC stacking is expected to grow the fastest in wafers as well as in overall value, whereas 3D WLCSP will continue growing at a 18% CAGR.
3D WLCSP is the preferred solution today for the efficient assembly of small-size optoelectronic chip like CMOS image sensors. It is also the most mature 3D TSV platform at the moment as Yole Dveloppement estimates the market to be about $270M in 2011 for the middle-end processing factories serving this specific market. More than 90% of the revenues in this area come from low-end and low resolution CMOS image sensors manufacturing (typically CIF, VGA, 1MPx and 2MPx sensors). Xintec in Taiwan is the leader for 3D WLCSP packaging today, followed by China WLCSP, Toshiba and JCAP.
Most of the players provide 3D WLCSP services based on a 200mm wafer-level-packaging industrial infrastructure. Important investments are still expected from major companies to move to 300mm. Indeed, this trend will be necessary to move to the high-end CMOS image sensors market (> 8MPx resolution) where sensors are today on the transition from backside illumination to real 3DIC packaging architecture. This latest architecture will be soon called " 3D BSI ", where photodiodes will be vertically stacked directly onto the DSP / ROIC wafer and connected by the mean of TSVs.All news
Photographic method to survey magnetic field
July 23, 2014
A new technique enables users to display magnetic fields as a 2D colour photography. Thus uses can acquire, visualise and ...
Failed merger talks won't stop Dialog
XCore architecture attracts Bosch investment
Steep growth for thermoelectric energy harvesting, says Infinergia Consulting
AMS, Dialog merger talks fail
MIT wrist-robot adds extra fingers
July 22, 2014
Ever try to get the lid off a jar with one hand, or open an envelope, or 1,000 other two-handed tasks? Well now you can, ...
Li-ion batteries market for EVs to quadruple in a decade
Monolithic Power Systems signs with Avnet Memec
Thoughts on energy harvesting for wearable equipment
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
- Exploring the Business Model Evolution of High-Tech Equipment Manufacturers
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.