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Organic solar cells and OLEDs - A comparison of two competing approaches Martin Pfeiffer, Heliatek Two basic, yet different, approaches are available for fabricating elements such as OLEDs or solar cells from thin layers of organic materials with semiconductor properties: namely, (a) the use of polymers, i.e., long-chain molecules that consist of a large number of identical repeating units (monomers) ... Read more IGBT Modules: Data Sheet Comparisons and the Pitfalls of such Comparisons Dr. Arendt Wintrich, Semikron Comparing IGBT modules on the basis of data sheets is not as easy is it may seem. This is because IGBT manufacturers have always used different measurement methods for identical parameters. In real applications, this can lead to surprises such as far higher switching losses. This article takes a close ... Read more 3D-IC Testing with the Mentor Graphics Tessent Platform Steve Pateras, Mentor Graphics Three-dimensional stacked integrated circuits (3D-ICs) are composed of multiple stacked die, and are viewed as critical in helping the semiconductor industry keep pace with Moore's Law. Current integration and interconnect methods include wirebond and flip-chip and have been in production for some time. ... Read more Using Tessent Low Power Test to Manage Switching Activity Giri Podichetty, Mentor Graphics Today's advanced integrated circuit (IC) designs are increasing in complexity, with their seemingly endless progression to smaller geometries, ever increasing integration between analog and digital blocks, and diminishing supply voltages. Both this complexity and the need for energy efficiency in portable ... Read more Addressing 32/28-nm IC Implementation Challenges with Talus Vortex and Talus Vortex FX Magma Design Automation This paper describes the technical and business challenges of implementing designs at the 32/28-nm node. Topics include low-power design, crosstalk effects, process variability, and the dramatic increase in the number of operating modes and corners. Also discussed are the related issues regarding engineering ... Read more Silicon Enabling In A Modular Architecture Intel Corporation This article explores the use of the UEFI Platform Initialization (PI) specifications as a framework for silicon enabling. We will examine the building block elements provided for by the specification as well as the platform boot process, unique modes, and common uses. Additionally, it examines drivers ... Read more Internet of Things: Drawing Charts using the Cloud Services Openpicus Internet of things is one of the most important technological advances of the 21st century. Internet of Things becomes more and more powerful. At present, there are 9 billion connected devices, and by 2020, there will be 24 billion devices (according to the Global Mobile Industry Trade Group, GSMA). ... Read more UEFI Networking And Pre-OS Security Intel Corporation This article discusses the scope and objective of the Unified Extensible Firmware Interface (UEFI) specification and the UEFI technology’s role as a foundation for pre-OS security and networking, including the platform boot process from local and remote media, assets to be protected, threats against ... Read more Debugging Firmware Based on The Unified Extensible Firmware Interface Intel Corporation This article provides an overview of common debug solutions including hardware based debugging, system checkpoints, and source-level debugging. Firmware specific concepts such as status codes, DEBUG/ASSERT macros, and the UEFI debug protocol are introduced. This article also demonstrates source-level ... Read more Booting In An Instant Intel Corporation This article discusses the many elements associated with boot performance and methods for measuring boot performance. It also covers how the evolution of standards (such as UEFI) resulted in boot performance enhancements, and examples of how these technology elements were incorporated into products to ... Read more
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Organic photovoltaics offer greener benefits to provide solar cell In this news analysis article EE Times Europe Power Management's editor, Paul Buckley quizzes Dr. Martin Pfeiffer, co-founder and CTO of Heliatek GmbH, a global leader and Heliatek's CEO, Thibaud Le Seguillon, ...
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READER OFFER

This month Keithley Instruments is giving away two of its Model 2200 power supplies, worth 735 Euros each, for EETimes Europe's readers to win. The Model 2200-20-5: 20V, 5A, 100W on offer is one of five general-purpose programmable DC power supplies recently launched by the company, designed for source measurement instruments for component, module, and device characterization and test applications.

Part of the Series 2200 family, the unit’s voltage output accuracy is specified at 0.03% and its current output accuracy is 0.05%. The supply’s high output (1mV) and measurement (0.1mA) resolution makes it well-suited for characterizing low power circuits and devices in applications such as measuring idle mode and sleep mode currents to confirm devices can meet today’s ever-more-challenging goals for energy efficiency.

And the winners are:

In our previous reader offer, EPC was giving away ten of its EPC9002 development board kits, worth USD 95 each.
Lucky winners include  I. Blythe and C. Hardman from the UK, M. Casartelli and D. Cogliati from Italy, C. Cossio from Spain, W. Milarch from Germany, r. Milewicz from Poland, M. Prascak from Slovakia, A. Raidl from Austria and M. Taslakov from Bulgaria.
All should be receiving their kits soon. Let's wish them some interesting findings with their projects.
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