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					<title><![CDATA[News]]></title>
					<description></description>
					<link>http://www.electronics-eetimes.com/en/News/full-news.html</link>
					
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									<title><![CDATA[UL-certified software streamlines development for consumer functional safety]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916932&news_id=222916932&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916932&news_id=222916932&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-ti.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;New UL-certified software packages from Texas Instruments are helping make designing functional safety consumer applications using C2000 real-time control microcontrollers (MCUs) easier and faster. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 15:23:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 15:23:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 15:23:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 15:23:00 +0200]]></eventEndDate>
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									<title><![CDATA[Floating surge stopper provides unlimited overvoltage protection]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916803&news_id=222916803&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916803&news_id=222916803&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-07-ltc4366.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Protecting sensitive electronic circuitry from voltage transients is an essential part of any system be it automotive, industrial, avionics or even battery-powered consumer applications.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 15:20:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 15:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 13:20:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 13:20:00 +0200]]></eventEndDate>
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									<title><![CDATA[Obsolescence groups tackles long term supply and conflict minerals challenges]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916931&news_id=222916931&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916931&news_id=222916931&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-cog.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The increasing use of off the shelf commercial equipment and conflict minerals are two key risks facing designers of long term systems says the outgoing chairman of the UK's Component Obsolescence Group (COG).]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 15:13:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 15:13:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 15:13:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 15:13:00 +0200]]></eventEndDate>
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									<title><![CDATA[Cadence launches massively parallel timing tool to speed SoC design]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916930&news_id=222916930&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916930&news_id=222916930&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/design-cad.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems has launched a new static timing analysis and closure tool designed to run on passively parallel hardware and enable System-on-Chip (SoC) developers to speed timing closure and move chip designs to fabrication quickly.   ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 14:51:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 14:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 14:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 14:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/design-cad.jpg' type='image/jpeg' length='865007'/>
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									<title><![CDATA[Rugged SBC offers flexible I/O for data processing in compact displays]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916929&news_id=222916929&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916929&news_id=222916929&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-men.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;MEN Micro has launched a low power, rugged single board computer (SBC) with a 1.6GHz Atom processor that incorporates flexible I/O for demanding graphics environments.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 12:48:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 12:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 12:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 12:48:00 +0200]]></eventEndDate>
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									<title><![CDATA[First 45nm embedded flash logic test chips sample]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916928&news_id=222916928&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916928&news_id=222916928&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/silicon-wafer-3d.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Samsung Electronics has sampled the first devices from its 45nm embedded flash (eFlash) logic process development which it claims is the industry's first.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 12:41:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 12:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 12:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 12:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/silicon-wafer-3d.jpg' type='image/jpeg' length='2437255'/>
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									<title><![CDATA[Wolfson to move integrated MEMS microphones to 8in wafers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916927&news_id=222916927&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916927&news_id=222916927&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-wolfson.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Wolfson Microelectronics is integrating digital signal processing on the same die as its MEMS microphones and moving production to 8in (200mm) wafers in the first to make the move.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 12:29:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 12:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 12:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 12:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-wolfson.jpg' type='image/jpeg' length='1812'/>
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									<title><![CDATA[MLCC types address automotive and industrial markets]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916933&news_id=222916933&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916933&news_id=222916933&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/20130516_02.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;TDK Corporation has expanded its portfolio of automotive-grade multi-layer ceramic capacitors (MLCCs) with new mid-voltage types featuring C0G temperature characteristics and rated voltages from 100 V to 630 V. Typical applications include EV/HEV inverters and DC/DC converters, resonance circuits for wireless power transmission or general-purpose power supplies. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 10:40:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 10:40:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:40:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:40:00 +0200]]></eventEndDate>
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									<title><![CDATA[ZigBee single-chip solution connects smart lighting to infrastructure]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916934&news_id=222916934&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916934&news_id=222916934&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/14may13_cc2538_pr_low.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;To simplify the development of ZigBee wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Incorporated announced the availability of the CC2538 system-on-chip (SoC). The industry's most integrated ZigBee solution, the CC2538 is cost-efficient with an ARM  Cortex-M3 MCU, memory and hardware accelerators on one piece of silicon. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 10:20:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 10:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:20:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:20:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/14may13_cc2538_pr_low.jpg' type='image/jpeg' length='78306'/>
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									<title><![CDATA[Exploiting depth sensing for 3D interfaces and complex image analysis]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916661&news_id=222916661&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916661&news_id=222916661&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/hapticsbluetechnix-fig1.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Nowadays intelligent sensor networks have entered many application fields ranging from building and industrial automation to traffic management or medical applications. Intelligent sensors are able to process the sensor inputs on the sensor node and trigger actions autonomously. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 09:21:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 09:21:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:21:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:21:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/hapticsbluetechnix-fig1.jpg' type='image/jpeg' length='72701'/>
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									<title><![CDATA[Altera to integrate Enpirion power interfaces into its FPGAs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916921&news_id=222916921&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916921&news_id=222916921&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Altera is planning to develop IP blocks for its FPGAs optimized for the Enpirion power management devices following the $141m acquisition this week. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 12:35:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 12:35:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 12:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 12:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' type='image/jpeg' length='838746'/>
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									<title><![CDATA[Automation CAN group plans permanent interoperability test capability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916920&news_id=222916920&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916920&news_id=222916920&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eete-nf-canfd.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The group promoting the use of the CAN networking standard in automation is planning a permanent interoperability test capability following its first plugfest in Nuremberg, Germany.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 11:54:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 11:54:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 11:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 11:54:00 +0200]]></eventEndDate>
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									<title><![CDATA[u-blox to develop 3G HSPA module based on Intel's XMM 6255 HSPA platform]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916918&news_id=222916918&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916918&news_id=222916918&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-ublox.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Swiss-based u-blox announced it is collaborating with Intel to bring a small, cost-effective 3G-only HSPA module to the market. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 10:06:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 10:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 10:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 10:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-ublox.jpg' type='image/jpeg' length='11663'/>
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									<title><![CDATA[High density optical fiber enables stress analysis over large areas]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916917&news_id=222916917&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916917&news_id=222916917&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-jonson.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The ability to measure multiple sensing points over large intricate surfaces can be a difficult task. Traditionally engineers have used electrical strain gauges to monitor many points over a structure such as an aircraft wing or large composite component. However applying many individual gauges is both time consuming and adds significant weight to the structure in the form of cabling.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 09:44:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 09:44:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 09:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 09:44:00 +0200]]></eventEndDate>
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									<title><![CDATA[Opening up new user-interaction scenarios with Time-of-Flight measurements]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916660&news_id=222916660&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916660&news_id=222916660&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/haptics-stmicro-fig3.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;STMicroelectronics recently unveiled an all-in-one module embedding both a wide dynamic ambient light sensor and a robust ranging sensor along with an infra-red light emitter. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 09:16:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 09:16:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:16:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:16:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/haptics-stmicro-fig3.jpg' type='image/jpeg' length='70784'/>
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									<title><![CDATA[Goepel electronic initiates Cooperation Network with EMS companies]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916915&news_id=222916915&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916915&news_id=222916915&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-strategy.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Goepel electronic has initiated a comprehensive cooperation network with contract manufacturers, the EMS Partner Program, as a global alliance program focused on joint activities for the knowledge transfer of test methods and strategies.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 09:11:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 09:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 16:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 16:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-strategy.jpg' type='image/jpeg' length='446483'/>
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									<title><![CDATA[8.5x8.5x5.91mm CMOS camera module features 8 megapixels]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916914&news_id=222916914&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916914&news_id=222916914&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-suyin.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Suyin Optronics' CM 8013 AF05 OV01 miniaturized camera module features a maximum resolution of 8 megapixels in a 8.5x8.5x5.91mm footprint, it also combines autofocus capabilities with a high-performance lens consisting of five plastic elements for sharp imaging.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 08:07:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 08:07:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 15:57:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 15:57:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-suyin.jpg' type='image/jpeg' length='363662'/>
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									<title><![CDATA[The number of charging stations for electrical vehicles is expected to soar by 2020, study says]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916916&news_id=222916916&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916916&news_id=222916916&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/car-electric-connector.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The number of electric vehicle charging stations is set to soar globally by 2020, supporting a shift in driving away from traditional petrol and diesel-fuelled vehicles, says a report from market research company IHS. The market watchers strongly advocate a unified charging system. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 00:00:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 00:00:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 00:00:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 00:00:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/car-electric-connector.jpg' type='image/jpeg' length='466080'/>
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									<title><![CDATA[High-precision dual Op Amp operates from -55 up to +225°C]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916913&news_id=222916913&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916913&news_id=222916913&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-cissoid.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;CISSOID's high-precision dual Op Amp OPAL remains operational at temperatures from -55°C up to +225°C and is specifically designed to meet the toughest environmental constraints of sensors in automotive, industrial and general high reliability applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 12:24:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 12:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 12:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 12:24:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-cissoid.jpg' type='image/jpeg' length='752490'/>
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									<title><![CDATA[In automotive lighting, LEDs still lacks of horsepower, study says]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916911&news_id=222916911&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916911&news_id=222916911&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Despite the impression some LED manufacturers and carmakers are trying to create, in automotive lighting LED is still far from displacing conventional lighting technologies. A market study from Marketsandmarkets provides insights into a market segment that moves ahead only slowly.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:58:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:58:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:58:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:58:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[Web JTAG tool supports innovative fast board failure test]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916909&news_id=222916909&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916909&news_id=222916909&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eete-nf-jtag.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A suite of JTAG tools that is downloadable from the Web is supporting an innovative technique to quickly check the failure of components on a board.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eete-nf-jtag.jpg' type='image/jpeg' length='1790586'/>
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									<title><![CDATA[Ultra-low-power SoC supports world's smallest Bluetooth location stickers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916910&news_id=222916910&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916910&news_id=222916910&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-nordic.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Nordic Semiconductor ASA's nRF51822 SoC has been specified into the world's smallest Bluetooth low energy coin-sized location stickers.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-nordic.jpg' type='image/jpeg' length='15184'/>
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									<title><![CDATA[High temperature multilayer stacked capacitors offer high temperature reliability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916912&news_id=222916912&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916912&news_id=222916912&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-16-eeteu-pb-kemet.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;KEMET has introduced the company's new KEMET Power Solutions High Temperature (KPS HT) multilayer stacked capacitors.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:10:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:10:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-16-eeteu-pb-kemet.jpg' type='image/jpeg' length='85485'/>
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									<title><![CDATA[Imec and Renesas collaborate on ultra-low power short range radios]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916908&news_id=222916908&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916908&news_id=222916908&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Imec and Renesas Electronics have entered into a new strategic research collaboration at Holst Centre to enhance ultra-low power (ULP) wireless technologies for short range communication, targeting sensor networks for automotive and industrial purposes.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 10:54:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 10:54:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:54:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[Triplexer LC filter supports PMR communications between emergency services]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916907&news_id=222916907&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916907&news_id=222916907&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-microtek.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;New from RF and microwave specialist Link Microtek is the LF9287 triplexer LC filter, which has been designed to support private mobile radio (PMR) real-time communications between different branches of the emergency services.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 10:46:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 10:46:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:46:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:46:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-microtek.jpg' type='image/jpeg' length='657166'/>
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									<title><![CDATA[European Semiconductor Distribution Market shows sequential recovery in Q1/CY13]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916906&news_id=222916906&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916906&news_id=222916906&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The European Semiconductor Distribution Market currently looks at a sequential recovery. Although Q1/CY13 ended 5% lower than the comparable quarter last year, the sequential development is extremely promising  plus 16% compared to Q4/CY12. Q1 ended with sales of 1.48 Billion Euro, according to DMASS (Distributors' and Manufacturers' Association of Semiconductor Specialists).]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 10:43:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 10:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis.jpg' type='image/jpeg' length='191112'/>
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									<title><![CDATA[Omron appoints TME to strengthen presence in Eastern Europe]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916905&news_id=222916905&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916905&news_id=222916905&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Omron Electronic Components bv has appointed leading Eastern Europe catalog supplier TME as franchised distributor for Poland, the Czech Republic, Slovakia, Hungary and Romania.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:45:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:45:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 09:45:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 09:45:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[LVDT/RVDT signal conditioner with analog and RS485 outputs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916900&news_id=222916900&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916900&news_id=222916900&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-macrosensors.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Macro Sensors's Eazy-Cal LVC 4000 signal conditioner features analogue (4-20mA or user selectable voltage) and RS-485 outputs, it is compatible with most LVDT and RVDT linear position sensors, including half bridge, and can communicates digitally with up to 16 devices simultaneously. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:37:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:37:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:37:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:37:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-macrosensors.jpg' type='image/jpeg' length='58886'/>
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									<title><![CDATA['The Economics of Automatic Testing' now in electronic versions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916892&news_id=222916892&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916892&news_id=222916892&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-ebook.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Brendan Davis' book The Economics of Automatic Testing, originally published by McGraw-Hill in 1982, and followed by a highly expanded second edition in 1994, is now available in e-book versions.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:15:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:15:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 11:15:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 11:15:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-ebook.jpg' type='image/jpeg' length='71935'/>
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									<title><![CDATA[USB data acquisition unit offers four differential inputs for thermocouples]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916902&news_id=222916902&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916902&news_id=222916902&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-datatranslation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The DT9828E thermocouple measurement module from Data Translation is designed for users looking for a very cost-effective module, with all the basic features for temperature measurements and analyses without galvanic isolation and four instead of eight differential inputs for thermocouples. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:14:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:44:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-datatranslation.jpg' type='image/jpeg' length='1953969'/>
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									<title><![CDATA[Avnet Supply Chain Solutions launches RaBET Tool in Europe]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916899&news_id=222916899&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916899&news_id=222916899&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-avnet.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Avnet Supply Chain Solutions has launched the Rapid Benefit Estimation Tool (RaBET) for European customers looking to reduce their supply chain costs. This free, supply chain diagnostic tool enables customers to model the potential benefits and savings they will experience by adding Avnet as their supply chain partner. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:08:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:28:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-avnet.jpg' type='image/jpeg' length='42191'/>
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									<title><![CDATA[Miniature Rogowski coils enable accurate non-contact current measurement]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916890&news_id=222916890&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916890&news_id=222916890&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-pem.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Power Electronic Measurements' latest generation of Rogowski coils for non-contact current measurement, is designed specifically for monitoring today's most advanced power systems and semiconductors.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:06:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-pem.jpg' type='image/jpeg' length='1181192'/>
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									<title><![CDATA[3D motion development kit targets wireless orientation tracking]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916903&news_id=222916903&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916903&news_id=222916903&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-xsens.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Xsens has released a new development kit specifically for system integrators with a need for wireless orientation tracking, the MTw, suitable in markets which require wireless communication, like training and simulation, pedestrian navigation, test and measurement and robotics.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 17:48:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 17:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-xsens.jpg' type='image/jpeg' length='2434397'/>
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									<title><![CDATA[sureCore receives £250K SMART Award to prototype its low power SRAM technology]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916901&news_id=222916901&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916901&news_id=222916901&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;sureCore Ltd has secured a Technology Strategy Board SMART award of £250K to help realise the company's low power SRAM technology in a leading edge next generation silicon process node. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 17:40:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 17:40:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:40:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:40:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[Amantys partners Fuji Electric to launch IGBT gate drivers for wind and solar markets]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916898&news_id=222916898&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916898&news_id=222916898&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/energy-renewable.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Amantys collaborates with Fuji Electric to introduce Amantys Power Insight enabled gate drivers for the growing market for PrimePACK compatible IGBT modules.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 12:14:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 12:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 12:14:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 12:14:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/energy-renewable.jpg' type='image/jpeg' length='54877'/>
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									<title><![CDATA[Cambridge Nanotherm starts mass manufacturing of thermal management substrate]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916897&news_id=222916897&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916897&news_id=222916897&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-15-eeteu-pb-led_exploded_nobg.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;UK-based electronics thermal management innovator Cambridge Nanotherm plans to build the company&rsquo;s first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB).]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 12:04:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 12:04:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 12:04:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 12:04:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-15-eeteu-pb-led_exploded_nobg.png' type='image/png' length='416082'/>
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									<title><![CDATA[Redux Labs spins out from HiWave to develop new haptics and embedded audio]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916894&news_id=222916894&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916894&news_id=222916894&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-redux.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Led by HiWave's former CEO and CTO, James Lewis and Chris Travis, start-up Redux Labs has been spun out to advance its Surface Sensation technology for third generation haptic and embedded audio technology. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 11:47:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 11:47:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 11:47:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 11:47:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-redux.jpg' type='image/jpeg' length='160439'/>
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									<title><![CDATA[Heatsink housings avoid LEDs overheating]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916889&news_id=222916889&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916889&news_id=222916889&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-fischer.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Fischer Elektronik has expanded its product range of heat discharge housings by adding an additional housing series, the G LED range of U-shaped housing profiles, which are open on one side with integrated guide grooves to take LED line modules and slot-in cover plates or plexiglass discs.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:53:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-fischer.jpg' type='image/jpeg' length='773989'/>
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									<title><![CDATA[New generation of thermal sensor arrays overcome the limitations in single-element sensors]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916891&news_id=222916891&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916891&news_id=222916891&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/power-switch-button.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ULIS is concluding the first of two phases in the MIRTIC (Micro Retina Thermal Infrared) project with the launch of the Micro80P thermal sensor array.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/power-switch-button.jpg' type='image/jpeg' length='184397'/>
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									<title><![CDATA[Freeform packaging technology flexibly encapsulates semiconductor sensors or MEMS]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916887&news_id=222916887&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916887&news_id=222916887&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-sencio.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Independent package development and assembly specialists Sencio BV is bringing an extra dimension to sensor and MEMS encapsulation with the launch of its nCapsulate freeform packaging technology. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:38:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-sencio.jpg' type='image/jpeg' length='77861'/>
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									<title><![CDATA[850 and 940nm IR emitters and package-matched Silicon PIN photodiode target IR touch panels]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916886&news_id=222916886&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916886&news_id=222916886&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-vishay.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Vishay Intertechnology has introduced two high-speed 850 and 940nm infrared emitters and a package-matched high-speed silicon PIN photodiode with high radiant sensitivity from 780nm to 1050nm. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:33:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:33:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:33:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:33:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-vishay.jpg' type='image/jpeg' length='966283'/>
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									<title><![CDATA[EU antidumping duties could block Chinese modules out of the European Market]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916884&news_id=222916884&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916884&news_id=222916884&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Average pricing for Chinese-manufactured photovoltaic (PV) solar modules could surge by 45 percent in June, cutting some solar project IRRs to below 7 percent and further dampen demand in Europe as a result of the preliminary antidumping duties imposed in the European Union, says market analysis firm IHS.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:22:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:22:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:22:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:22:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[VDSL chipset supports data rates of 200 Mbits]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916877&news_id=222916877&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916877&news_id=222916877&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-lantiq.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Lantiq has launched what the company claims to be the industry's most integrated and highest performance VDSL chipset family, the XWAY VRX300. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 09:27:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 09:27:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:27:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:27:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-lantiq.jpg' type='image/jpeg' length='842017'/>
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									<title><![CDATA[Critical factors in air-mouse system design]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916659&news_id=222916659&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916659&news_id=222916659&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-03-march/haptics-hillcrest-fig2.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Motion control is coming to Smart TVs in the form of in-air mice. MEMS sensors and sensor fusion algorithms provide the foundation for wireless, 3D cursor control, which bring exciting new interaction opportunities to the TV. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 09:13:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 09:13:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:13:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:13:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/haptics-hillcrest-fig2.png' type='image/png' length='31811'/>
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									<title><![CDATA[The OSPT Alliance and UK-Based ITSO join efforts on smart ticketing standardization]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916878&news_id=222916878&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916878&news_id=222916878&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The Open Standard for Public Transport (OSPT) Alliance and ITSO Ltd., the organization responsible for the UK national specification for smart ticketing, have agreed to participate as members in each other's organizations and to explore ways they can work together to promote the use of open security standards in public transit for smart ticketing and electronic fare collection systems. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 09:02:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 09:02:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:42:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[Altera acquires power technology innovator Enpirion]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916883&news_id=222916883&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916883&news_id=222916883&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-acquisition.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Altera Corporation has signed a definitive merger agreement to acquire Enpirion, Inc., the industry&rsquo;s leading provider of high-efficiency, integrated power conversion products known as PowerSoCs (power system-on-chip). ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 08:00:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 08:00:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 08:00:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 08:00:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-acquisition.jpg' type='image/jpeg' length='392863'/>
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									<title><![CDATA[Industry's first all SiC three-phase power module offers lower cost power conversion]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916882&news_id=222916882&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916882&news_id=222916882&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-15-eeteu-pb-crc030-1200v-50a-6-pack-module-pr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cree, Inc. has introduced the industry&rsquo;s first commercially available silicon carbide (SiC) six-pack power module in an industry standard 45 mm package. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 07:12:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 07:12:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 20:12:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 20:12:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-15-eeteu-pb-crc030-1200v-50a-6-pack-module-pr.jpg' type='image/jpeg' length='376105'/>
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									<title><![CDATA[Brake resistor passes salt water spray challenge]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916862&news_id=222916862&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916862&news_id=222916862&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-13-eeteu-pb-reo49.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;REO UK's BW155 range of braking resistors has been validated for corrosion resistance against salt mist and water spray as well as dust Ingress protection to IP65 by the Rail System Testing Laboratory at Hennigsdorf, Germany.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 06:24:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 06:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 20:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 20:24:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-13-eeteu-pb-reo49.jpg' type='image/jpeg' length='430230'/>
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									<title><![CDATA[In vivo tests show EnerChip batteries are biologically safe for all applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916875&news_id=222916875&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916875&news_id=222916875&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/energy-battery.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;At the PCIM Europe exhibition Cymbet Corporation has revealed successful results of in vivo biocompatibility feasibility studies that were conducted to evaluate the biological safety of the EnerChip Rechargeable Solid State Battery.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 06:02:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 06:02:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 13:02:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 13:02:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/energy-battery.jpg' type='image/jpeg' length='938550'/>
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									<title><![CDATA[Nokia claims best camera features with the newly launched Lumia 925]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916881&news_id=222916881&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916881&news_id=222916881&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-nokiajpg.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Introduced in a metal design, Nokia has unveiled the Nokia Lumia 925 as an upgrade to its Lumia 920, featuring the company's latest PureView camera innovation, new features and third party applications.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 15:42:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 15:42:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 15:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 15:42:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-nokiajpg.jpg' type='image/jpeg' length='43369'/>
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									<title><![CDATA[Altera buys power management chip specialist]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916880&news_id=222916880&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916880&news_id=222916880&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;FPGA designer Altera has signed a definitive merger agreement to acquire Enpirion which develops high-efficiency, integrated power conversion PowerSoCs (power system-on-chip) in a deal worth $141m.    ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 14:59:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 14:59:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:59:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:59:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' type='image/jpeg' length='838746'/>
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									<title><![CDATA[element14 adds image and video capture with Raspberry Pi eye accessory]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916879&news_id=222916879&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916879&news_id=222916879&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-element14.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The eagerly anticipated Raspberry Pi camera board launched by element14 enables pictures and video to be taken with the Raspberry Pi which can be used for security and VoIP projects as well as image and video capture.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 14:48:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 14:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-element14.jpg' type='image/jpeg' length='948217'/>
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									<title><![CDATA[ARM teams with LogMeIn to drive M2M in the cloud]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916876&news_id=222916876&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916876&news_id=222916876&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/cloud-computing.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Processor core designer ARM has teamed with US remote access specialist LogMeIn to simplify and accelerate commercial development on the Internet of Things (IoT). ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 14:19:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 14:19:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:19:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:19:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/cloud-computing.jpg' type='image/jpeg' length='57121'/>
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									<title><![CDATA[Force monitoring enables reliable manual press-insertion processes]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916872&news_id=222916872&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916872&news_id=222916872&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-burster.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The ForceMaster 9110 from burster enables continuous monitoring of force/time or force/displacement/time curves to ensure that even simple manual press-insertion processes are reliable. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:48:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-burster.jpg' type='image/jpeg' length='1747359'/>
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									<title><![CDATA[Dual-band Ethernet port adapter with external stub antenna]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916871&news_id=222916871&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916871&news_id=222916871&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-connectblue.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;connectBlue's Ethernet port adapter RWE251s features Wireless LAN (WLAN) dual-band functionality and an omnidirectional external stub antenna, making the unit suitable for use in both the 2.4GHz and the 5GHz ISM bands with no restrictions as to its position.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:23:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:23:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:23:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:23:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-connectblue.jpg' type='image/jpeg' length='1598076'/>
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									<title><![CDATA[Power Modules excel through high power density and reliability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916870&news_id=222916870&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916870&news_id=222916870&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/ff600r12me4_b11_medium.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;At PCIM Europe 2013 in Nuremberg, Infineon launches EconoDUAL 3 IGBT modules, which are fully qualified according to automotive standards. The offering addresses demanding applications in commercial, construction or agricultural vehicles where extended reliability is a key. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:17:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:17:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/ff600r12me4_b11_medium.jpg' type='image/jpeg' length='216766'/>
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									<title><![CDATA[Configurable digital sensor output driver delivers stable 3.3V sensor supply]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916869&news_id=222916869&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916869&news_id=222916869&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-ichaus.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The universal digital output driver iC-DX3/DXC3 from iC-Haus enables compact sensors to be equipped with NPN, PNP, push-pull, and IO link-compatible output driver options. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:16:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:16:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:16:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:16:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-ichaus.jpg' type='image/jpeg' length='489014'/>
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									<title><![CDATA[AndersDX launches new range of commercial grade Android tablets scalable to 21.5]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916868&news_id=222916868&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916868&news_id=222916868&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-andersdx.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;AndersDX has released the iDISPLAY Tablets range of touch screen platforms, sized from 7 to 21.5 and operating on Android 4.0.4. OS, designed with intelligent features specifically created for commercial environments.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:05:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-andersdx.jpg' type='image/jpeg' length='543154'/>
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									<title><![CDATA[Rutronik joins the China Electronics Distributor Alliance]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916867&news_id=222916867&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916867&news_id=222916867&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/distributors-logistics.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Rutronik Elektronische Bauelemente GmbH has officially joined the China Electronics Distributor Alliance (CEDA) after approval by the CEDA executive board members. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:03:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/distributors-logistics.jpg' type='image/jpeg' length='184204'/>
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									<title><![CDATA[ETSI publishes first specification for Ultra Low Energy DECT aimed at the M2M market]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916866&news_id=222916866&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916866&news_id=222916866&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-etsi.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ETSI has published the first Technical Specification (TS 102 939-1) on DECT ULE (Ultra Low Energy), a low power consumption radio technology intended for home automation and other Machine-to-Machine (M2M) applications.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:53:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 09:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 09:53:00 +0200]]></eventEndDate>
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									<title><![CDATA[Autoliv provides the "eyes" for driver assistance systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916865&news_id=222916865&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916865&news_id=222916865&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/a54d2e05cd90e387_org.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;All scenarios around automatic driving require a number of sophisticated sensors inside the cars. This scenario is what supplier Autoliv is aiming at with its Stereo Vision Sensing System (SVS) it rolls out these days. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:51:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 09:28:00 +0200]]></eventEndDate>
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									<title><![CDATA[MEMS-based micro mirror laser projector can be integrated into cell phones]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916861&news_id=222916861&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916861&news_id=222916861&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-fraunhofer2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;For years, Fraunhofer IPMS has been working on scanning mirrors for light deflection in one and two dimensions. Alongside resonant scanners with constant sinusoidal movement, a quasi-static variation has also been available for a while, which serves to make linear movement or static orientation in a specified position possible.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:36:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:36:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:46:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:46:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-fraunhofer2.jpg' type='image/jpeg' length='6964184'/>
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									<title><![CDATA[Industry's smallest 18-Bit Successive Approximation Register ADC saves 70% board space]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916853&news_id=222916853&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916853&news_id=222916853&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-maxim.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Maxim Integrated Products has introduced the industry's smallest 12-pin, 18-bit successive approximation register (SAR) analog-to-digital converter (ADC). ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:30:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:30:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 15:30:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 15:30:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-maxim.jpg' type='image/jpeg' length='621603'/>
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									<title><![CDATA[Characterization tools reduce power by ten percent for mobile applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916864&news_id=222916864&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916864&news_id=222916864&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/design-flow-chart.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems has helped Yamaha Corporation to reduce power consumption for the company's mobile consumer chips with characterization tools that delivered a 10 percent reduction in dynamic power to the clock network required for Yamaha ASICs. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 09:28:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/design-flow-chart.jpg' type='image/jpeg' length='181892'/>
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									<title><![CDATA[Understanding onboard flash programming]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916860&news_id=222916860&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916860&news_id=222916860&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/electronic-components-pcb2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Firmware often is preprogrammed into flash memory devices prior to the printed-circuit board's (PCB) manufacture to maintain high throughput and avoid slowing the manufacturing beat rate. Yet there are advantages to programming the flash memory after it has been soldered to the PCB. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:17:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:17:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/electronic-components-pcb2.jpg' type='image/jpeg' length='814262'/>
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									<title><![CDATA[Shunt-based management system targets lithium-ion batteries]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916857&news_id=222916857&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916857&news_id=222916857&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-isabelle.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The "IB4" battery management system from Isabellenhütte is designed for four-cell lithium ion batteries with individual cell voltages of up to 5V, and was developed in cooperation with the company's Braunschweig-based development partner I+ME Actia.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 16:49:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 16:49:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-isabelle.jpg' type='image/jpeg' length='1953863'/>
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									<title><![CDATA[Dimming PC prospects initiate inventory reduction in the computer supply chain, notes IHS iSupply]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916859&news_id=222916859&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916859&news_id=222916859&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-down.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the outlook for the PC market growing increasingly uncertain because of rising consumer interest in smartphones and tablets, computer manufacturers and distributors are striving to keep their inventories to a minimum. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:09:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:09:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-down.jpg' type='image/jpeg' length='743206'/>
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									<title><![CDATA[Ismosys to represent Amulet Technologies throughout Europe]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916856&news_id=222916856&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916856&news_id=222916856&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-imosys.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Amulet Technologies, a provider of high-performance embedded graphical user interface (GUI) processors, modules and development tools, has appointed the Ismosys (International Sales, Marketing and Operations System) division of the Spectrum Electronics Group as its sales & marketing representative in all the key European territories.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:08:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 16:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 16:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-imosys.jpg' type='image/jpeg' length='136890'/>
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									<title><![CDATA[PCI Express protocol analyzer with interchangeable interposers for probing]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916855&news_id=222916855&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916855&news_id=222916855&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-teledyne.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Teledyne LeCroy has released its most cost-effective PCI Express protocol analyzer with interchangeable interposers for probing. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 16:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 16:35:00 +0200]]></eventEndDate>
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									<title><![CDATA[EBV Elektronik releases the 'SoCrates' board]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916858&news_id=222916858&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916858&news_id=222916858&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/design-cad.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Aimed at Altera's NewSoC families, the SoCrates' development board from EBV Elektronik simplifies the integration and design convergence towards FPGAs.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 08:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 08:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:05:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/design-cad.jpg' type='image/jpeg' length='865007'/>
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									<title><![CDATA[Advanced microcontroller combines floating point and low leakage technology]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916852&news_id=222916852&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916852&news_id=222916852&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-13-eeteu-pb-em129-1wglaunchpr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Energy Micro has begun shipping the company's most advanced microcontroller yet, the EFM32 Wonder Gecko, with devices and development kits available immediately. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 13:10:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 13:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 13:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 13:10:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-13-eeteu-pb-em129-1wglaunchpr.jpg' type='image/jpeg' length='604278'/>
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									<title><![CDATA[First universal multicore debug IP delivered to PMC-Sierra]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916851&news_id=222916851&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916851&news_id=222916851&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;UK startup UltraSoC has delivered the first version of its universal multicore debug IP for PMC-Sierra's next generation of storage controllers. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 11:51:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 11:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 11:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 11:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[Rotary encoder offers 360º endless rotation]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916850&news_id=222916850&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916850&news_id=222916850&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-piher.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Piher's 360º version of the PT15 rotary encoder adds endless clockwise (CW or CCW) rotation to its already highly configurable mechanical and electrical specifications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 11:08:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 11:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 11:08:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 11:08:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-piher.jpg' type='image/jpeg' length='138721'/>
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									<title><![CDATA[J1-Series power modules feature compact 6-in-1 package for use in electric and hybrid vehicles]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916849&news_id=222916849&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916849&news_id=222916849&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mitsubishi.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mitsubishi Electric has announced the J1-Series power modules featuring a compact 6-in-1 package mainly for use in electric and hybrid vehicles. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:53:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mitsubishi.jpg' type='image/jpeg' length='615115'/>
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									<title><![CDATA[Sentrollers' taking over from People' as the majority population on the Internet, says GreenPeak Technologies]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916848&news_id=222916848&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916848&news_id=222916848&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-greenpeak.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;GreenPeak Technologies has released a white paper called Sentrollers and the Internet of Things where it defines Sentrollers as a new, all-encompassing term for sensors, actuators and controllers  the various devices that make up the new Internet of Things.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:43:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:43:00 +0200]]></eventEndDate>
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									<title><![CDATA[Fast axis collimators can be optimally used with monolithically integrated reference surfaces]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916847&news_id=222916847&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916847&news_id=222916847&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-limo.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;LIMO's fast axis collimators can be optimally used with monolithically integrated reference surfaces or adjustment grooves for automatic adjustment.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:39:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:39:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-limo.jpg' type='image/jpeg' length='997851'/>
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									<title><![CDATA[Piezoelectric taxels made up of zinc oxide nanowires convert motion to electronic signals]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916846&news_id=222916846&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916846&news_id=222916846&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-taxels.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Using bundles of vertical zinc oxide nanowires, researchers of the Georgia Institute of Technology have fabricated arrays of piezotronic transistors capable of converting mechanical motion directly into electronic controlling signals.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:31:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-taxels.jpg' type='image/jpeg' length='47877'/>
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									<title><![CDATA[Wireless data logger connects to the cloud through Bluetooth LE]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916845&news_id=222916845&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916845&news_id=222916845&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-msr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;MSR Electronics has unveiled the universal MSR145 mini data logger, a wireless unit able to connect via Bluetooth Low Energy and a smartphone, a PC or the BLE receiver box, to the manufacturer's web-based "MSR SmartCloud" service for mobile data monitoring. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:29:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-msr.jpg' type='image/jpeg' length='592109'/>
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									<title><![CDATA[Magnetic sensor guides robotic vehicles along magnetic tracks]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916843&news_id=222916843&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916843&news_id=222916843&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-robotek.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Roboteq has released a new magnetic guide sensor capable of detecting and reporting the position of a magnetic field along its horizontal axis. The sensor is intended for line following robotic applications, using adhesive magnetic tape to form a track guide on the floor.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:13:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:13:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:13:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:13:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-robotek.jpg' type='image/jpeg' length='227090'/>
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									<title><![CDATA[Mouser launches dedicated MEMS technology site]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916842&news_id=222916842&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916842&news_id=222916842&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mouser.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mouser Electronics has launched a new technology site on Mouser.com, covering Microelectromechanical Systems (MEMS) Technology and designed to help design engineers find the latest in MEMS products by application.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 09:49:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 09:49:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 09:49:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 09:49:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mouser.jpg' type='image/jpeg' length='181446'/>
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									<title><![CDATA[Ultra-sensitive touch sensor operates through glass or steel sheet]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916834&news_id=222916834&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916834&news_id=222916834&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eete-nf-peratech.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Peratech has developed an ultra-sensitive sensor using its QTC nano-scale technology that it aims to license for domestic, industrial and automotive applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 09:35:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 09:35:00 +0200]]></date>
									<eventStartDate><![CDATA[Sat, 11 May 2013 18:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sun, 12 May 2013 18:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eete-nf-peratech.jpg' type='image/jpeg' length='3229279'/>
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									<title><![CDATA[Identifying the best power supply for your test application]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916658&news_id=222916658&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916658&news_id=222916658&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/power-test-keithleyfig2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Most electrical engineers believe they have a good understanding of power supplies because they are relatively simple, single-function DC devices designed to output controlled voltages. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 09:11:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 09:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/power-test-keithleyfig2.jpg' type='image/jpeg' length='53305'/>
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									<title><![CDATA[Select resolution from 8 to 16 bits in a USB oscilloscope]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916841&news_id=222916841&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916841&news_id=222916841&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-04-15-edne-gp-pico.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Pico Technology has used reconfigurable ADC technology to offer a choice of resolutions from 8 to 16 bits in a single product; the company says this is the first time this facility has been popssible in an oscilloscope.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 07:30:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 07:30:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 15 Apr 2013 09:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 16 Apr 2013 09:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-04-15-edne-gp-pico.jpg' type='image/jpeg' length='2894806'/>
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									<title><![CDATA[How to do functional tests on I2C and SPI monitors with JTAG]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916840&news_id=222916840&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916840&news_id=222916840&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-edne-gp-asset_block-diagram.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;An eBook from Asset InterTech explains how the structural test methodology based on the IEEE 1149.1 boundary scan standard, known as JTAG, can apply functional tests to I2C and SPI system monitors during prototype board bring-up and later during production of the circuit board.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 13:51:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 13:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 13:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 13:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-edne-gp-asset_block-diagram.png' type='image/png' length='75982'/>
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									<title><![CDATA[High precision foil resistors]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916838&news_id=222916838&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916838&news_id=222916838&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-edne-gp-riedon.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Ultra-high precision resistances come in leaded and surface mount packages.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 13:34:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 13:34:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 13:34:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 13:34:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-edne-gp-riedon.jpg' type='image/jpeg' length='19164'/>
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									<title><![CDATA[Multi-connector range for CoaXPress applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916839&news_id=222916839&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916839&news_id=222916839&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-10-edne-gp-cambridgeconnectors_coaxpress_multiconnector.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cambridge Connectors's CXP-Multi-Connector is a precision 6-GHz 1.0/2.3 Stackable Multiport Connector system that meets the requirements of the newly JIIA ratified CoaXPress (CXP) specification for use in High Speed Image and Data Transmission.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 12:15:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 12:15:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 12:15:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 12:15:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-edne-gp-cambridgeconnectors_coaxpress_multiconnector.jpg' type='image/jpeg' length='123231'/>
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									<title><![CDATA[Varied data output formats expand digital temperature sensor options]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916837&news_id=222916837&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916837&news_id=222916837&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-10-edne-gp-meas_spec_digital-temperature-sensor-tsys02.3327.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Measurement Specialties has released a family of compact digital temperature sensors that easily integrates into a variety of industrial control, HVAC/R and heating/cooling systems. TSYS02 combines low power, high accuracy in an ultra-small TDFN8 package.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 10:29:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 10:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 10:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 10:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-edne-gp-meas_spec_digital-temperature-sensor-tsys02.3327.jpg' type='image/jpeg' length='1071934'/>
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									<title><![CDATA[Solar PV wafer production to grow 19 percent in 2013, forecasts NPD Solarbuzz]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916833&news_id=222916833&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916833&news_id=222916833&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-analysis.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Solar photovoltaic wafer production is forecast to grow 19% in 2013, passing 30 GW and recovering to the 2011 level, according to the latest NPD Solarbuzz Polysilicon and Wafer Supply Chain Quarterly.  The market fell 15% in 2012.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 10:17:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 10:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 10:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 10:17:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-analysis.jpg' type='image/jpeg' length='191112'/>
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									<title><![CDATA[Single-phase bridge rectifiers target smartphone chargers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916835&news_id=222916835&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916835&news_id=222916835&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-eeteu-pb-vish8696379045_d27c3ea6bf.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Vishay Intertechnology, Inc. has released four new 1 A miniature glass passivated single-phase bridge rectifiers in the surface-mount MBLS package featuring a low typical height of 1.4 mm.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:39:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:39:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 09:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 09:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-eeteu-pb-vish8696379045_d27c3ea6bf.jpg' type='image/jpeg' length='668044'/>
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									<title><![CDATA[Bosch tests automatic driving on the Autobahn]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916836&news_id=222916836&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916836&news_id=222916836&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/1-cc-19152.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;If you happen to see a driver on the German Autobahn these days with no hands at the wheel, don't panic: Automotive electronics supplier Bosch is currently conducting extensive tests of automated vehicles on public roads in Germany. The purpose of these tests is assessing and further improving the technology for automatic driving in everyday driving situations.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:38:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 09:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 09:38:00 +0200]]></eventEndDate>
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									<title><![CDATA[Swindon Silicon Systems signs technology partnership deal with ZPower]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916832&news_id=222916832&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916832&news_id=222916832&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-eeteu-pb-agzn-cell-zinc-air-cells.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ZPower turns to Swindon for power management solution that allows hearing aid manufacturers to use silver-zinc batteries without modifying their existing DSP systems.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:27:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:27:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 09:27:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 09:27:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-eeteu-pb-agzn-cell-zinc-air-cells.jpg' type='image/jpeg' length='69448'/>
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									<title><![CDATA[Space-grade 32Mb PROM memory has 20 years of garanteed life data retention]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916754&news_id=222916754&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916754&news_id=222916754&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-3dplus-prom.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;3D Plus has released a space-grade 32Mb PROM memory chip, the 3DPO32M08VS1419 One-Time-Programmable (OTP) Rom memory designed to store configuration bit streams for FPGA devices, such as Xilinx Virtex FPGAs. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:17:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:47:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:47:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-3dplus-prom.jpg' type='image/jpeg' length='60355'/>
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									<title><![CDATA[Growth of motion sensing IC market slowing]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916831&news_id=222916831&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916831&news_id=222916831&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The market for acceleration and yaw sensors grew 7 percent in 2012, the lowest percentage increase for motion-sensing semiconductors since 2005, according to market research firm IC Insights Inc.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 08:26:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 08:26:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 08:26:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 08:26:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[IBM analytics solving cancer]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916830&news_id=222916830&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916830&news_id=222916830&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/medical-electronics.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;IBM's medical diagnostics analytics are not exactly a 'cure' for cancer, but they are aiming to lower the cost of a promising new remedy for destroying existing tumors.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 08:16:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 08:16:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 08:16:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 08:16:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/medical-electronics.jpg' type='image/jpeg' length='204727'/>
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									<title><![CDATA[Students build electric racing car]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916829&news_id=222916829&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916829&news_id=222916829&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/rennbolide.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Students and scientists have developed an electrically driven racing car that goes from rest to 100 km/h in 3.6 seconds. That is only slightly slower than a McLaren Formula 1 car or a Porsche 911 Turbo. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 21:54:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 21:54:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 21:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 21:54:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/rennbolide.jpg' type='image/jpeg' length='30037'/>
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									<title><![CDATA[Digi-Key rounds out LED portfolio with Philips Lumileds distribution agreement]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916825&news_id=222916825&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916825&news_id=222916825&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/led-cluster.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Electronic components distributor Digi-Key Corp. announced the signing of a global distribution agreement with Philips Lumileds. The move expands the company's LED portfolio and strengthens their position as one of the largest distributors of LED products and suppliers.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 19:09:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 19:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 19:09:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 19:09:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/led-cluster.jpg' type='image/jpeg' length='106766'/>
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									<title><![CDATA[Switching matrix enables high-throughput test applications at high package density]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916823&news_id=222916823&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916823&news_id=222916823&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/40-568series_press_release.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;For test applications in the automotive and in the electronics industry in general, signal condition devices manufacturer Pickering Interfaces has developed two new switching modules - one based on solid-state switching elements and one based on electromechanical relays. Both enable very high package density in switching matrixes. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 12:59:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 12:59:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 9 May 2013 12:59:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 10 May 2013 12:59:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/40-568series_press_release.jpg' type='image/jpeg' length='390749'/>
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									<title><![CDATA[DC input LED drivers tolerate supply voltage fluctuations]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916824&news_id=222916824&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916824&news_id=222916824&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/df3ba5010b.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;GlacialPower has announced announce two new LED drivers for variable voltage LED lights, the GP-LD10-30C and GP-LD15-24C. As multi-use scenario LED drivers they fit for a wide range of implementations. Among others, they can be used on vessels or vehicles and with power sources with fluctuating voltage. They also are designed to work well with solar panels for LED illumination. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 12:11:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 12:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 9 May 2013 12:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 10 May 2013 12:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/df3ba5010b.jpg' type='image/jpeg' length='29639'/>
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									<title><![CDATA[Tridonic rolls Zhaga-compliant LED light engine]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916826&news_id=222916826&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916826&news_id=222916826&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/talexxmodule_stark_sle_gen2_les23_blue_r_pic-1.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the TALEXXengine STARK SLE, Tridonic introduces its first Zhaga-certified LED light engine. Another feature are the integrated clip terminals which significantly ease the installation. At the same time, the Austrian manufacturer enhanced its portfolio by a new product in its MINI line and introduced a specific light color class for food lighting in retail applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 11:10:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 11:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:10:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/talexxmodule_stark_sle_gen2_les23_blue_r_pic-1.jpg' type='image/jpeg' length='3451714'/>
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									<title><![CDATA[Power factor and solid state lighting  implications, complications and resolutions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916657&news_id=222916657&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916657&news_id=222916657&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/power-iwatt-led-fig2a.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Lighting comprises approximately 17.5% of global electricity consumption. As the world transitions from incandescent to solid state lighting (SSL) technology, utilities and government regulatory agencies worldwide are concerned that, as this large segment of the consumption base switches to SSL, it will increase infrastructure costs. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:09:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:09:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/power-iwatt-led-fig2a.jpg' type='image/jpeg' length='42642'/>
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									<title><![CDATA[Water- and dust-protected inertial measurement units support CAN and RS-422 interfaces]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916753&news_id=222916753&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916753&news_id=222916753&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-epson.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The M-G550-PC and the M-G550-PR inertial measurement units developed by Seiko Epson feature six degrees of freedom, including gyroscopic sensors on three axes and accelerometers on three directions, with a maximum sampling rate of 1,000 samples per second. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-epson.jpg' type='image/jpeg' length='574958'/>
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									<title><![CDATA[800-W programmable power supplies offer 2U rack mounting benefits]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916828&news_id=222916828&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916828&news_id=222916828&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-09-eeteu-pb-la1018-zplus_36_24-800w.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;TDK Corporation is making an extension to its TDK-Lambda Z+ Series of programmable DC power supplies with the addition of the higher power Z+800 range. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 07:38:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 07:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 9 May 2013 07:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 10 May 2013 07:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-09-eeteu-pb-la1018-zplus_36_24-800w.jpg' type='image/jpeg' length='357860'/>
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									<title><![CDATA[CMOS-based isolated gate drivers provide drop-in replacements for opto-drivers in industrial power systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916827&news_id=222916827&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916827&news_id=222916827&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-09-eeteu-pb-slab0200-si826x-press.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Silicon Labs has introduced the industry's first digital CMOS-based drop-in replacement solution for optocoupler-isolated gate drivers (opto-drivers).]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 07:04:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 07:04:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 19:04:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 19:04:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-09-eeteu-pb-slab0200-si826x-press.jpg' type='image/jpeg' length='757279'/>
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									<title><![CDATA[First online development environment for the Internet of Things]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916815&news_id=222916815&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916815&news_id=222916815&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/data-binary-code.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Thingsquare has announced Thingsquare Code, to help connect products such as light bulbs, thermostats, and smart city systems to smartphone apps.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 13:27:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 13:27:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 13:27:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 13:27:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/data-binary-code.jpg' type='image/jpeg' length='49764'/>
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									<title><![CDATA[Qucell integrates Symmetricom SoftClock into 4G/LTE small cells]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916821&news_id=222916821&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916821&news_id=222916821&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/wireless-comms-network.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Symmetricom has announced the successful design integration of its SoftClocks into 4G/LTE + WiFi small cells offered by Qucell. This successful integration enables Qucell to join Symmetricom's SyncWorld® Ecosystem Program in the small cells category.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 13:18:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 13:18:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 13:18:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 13:18:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/wireless-comms-network.jpg' type='image/jpeg' length='331319'/>
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									<title><![CDATA[Full featured multi-port 40nm Gigabit PHY claims lowest power]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916810&news_id=222916810&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916810&news_id=222916810&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/opto-fibers.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Broadcom has developed a new generation of energy efficient PHY devices for power-intensive Ethernet network applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:41:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/opto-fibers.jpg' type='image/jpeg' length='255647'/>
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									<title><![CDATA[Movea brings its motion control technology for mobile and interactive TV to China, Taiwan and Japan]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916812&news_id=222916812&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916812&news_id=222916812&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/intellectual-property-web-art.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Movea has announced its collaboration with TorchSUN Technology Co., Ltd., to bring Movea's motion control solutions to leading technology companies in China, Taiwan and Japan. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:33:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:33:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:33:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:33:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/intellectual-property-web-art.jpg' type='image/jpeg' length='55455'/>
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									<title><![CDATA[Sub-GHz radio features extended temperature and frequency range]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916813&news_id=222916813&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916813&news_id=222916813&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/hmi-wireless-8315455-web-art.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Microsemi Corporation has announced the ZL70251 ultra low-power (ULP) radio frequency transceiver with an extended temperature operating range of -40 °C to 85 °C for short-range wireless sensor products used in industrial applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:24:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:24:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/hmi-wireless-8315455-web-art.jpg' type='image/jpeg' length='208882'/>
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									<title><![CDATA[Compact half-bridge gate driver family targets applications with a blocking voltage of 600 V]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916814&news_id=222916814&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916814&news_id=222916814&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-08-eeteu-pb-2edl_groupshot.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Infineon Technologies AG will be unveiling the 2EDL EiceDRIVER Compact half-bridge gate driver at PCIM 2013. The device is targeting applications with a blocking voltage of 600 V. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:06:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-08-eeteu-pb-2edl_groupshot.jpg' type='image/jpeg' length='176070'/>
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									<title><![CDATA[Low-power 32M CMOS SRAM in a 12x20mm TSOP-I package]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916750&news_id=222916750&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916750&news_id=222916750&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-alliance.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Alliance Memory has expanded its line of legacy low-power CMOS SRAMs with a new 32M IC (2M x 16 / 4M x 8 switchable), the company's highest density low-power device to date. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 09:00:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 09:00:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:00:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:00:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-alliance.jpg' type='image/jpeg' length='878342'/>
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									<title><![CDATA[DC/DC step-down micromodule regulator delivers high output accuracy]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916811&news_id=222916811&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916811&news_id=222916811&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-08-eeteu-pb-ltc4637.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Linear Technology Corporation has introduced a 20 A DC/DC step-down micromodule regulator with onboard precision differential remote sense amplifier.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:58:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:58:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 19:58:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 19:58:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-08-eeteu-pb-ltc4637.jpg' type='image/jpeg' length='909890'/>
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									<title><![CDATA[Simulator offers low-power verification productivity improvements by upto 30 percent]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916809&news_id=222916809&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916809&news_id=222916809&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/design-flow-chart.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems, Inc. has introduced a new version of Incisive Enterprise Simulator, with features that improve low-power verification productivity of complex SoCs by 30 percent. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:52:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:52:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:52:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:52:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/design-flow-chart.jpg' type='image/jpeg' length='181892'/>
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									<title><![CDATA[Large-scale grid integration of variable photovoltaic power offers new possibilities]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916820&news_id=222916820&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916820&news_id=222916820&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/energy-solar-panels.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The European energy supply landscape is shifting towards a more sustainable and renewables-based mix was one of the conclusions reached at a joint MetaPV and IEA PVPS Task 14 workshop held in Brussels on Monday 6 May 2013.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:48:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 15:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 15:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/energy-solar-panels.jpg' type='image/jpeg' length='155048'/>
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									<title><![CDATA[Safety capacitor range offers higher capacitance values]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916822&news_id=222916822&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916822&news_id=222916822&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-07-eeteu-pb-safety-certified-chips_large.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Syfer has added to the company's UL and TÜV approved range of SMD 250 Vac safety capacitors.  To give engineers more scope in their designs, the upper capacitance value has been extended to 33 nF. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:43:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-07-eeteu-pb-safety-certified-chips_large.jpg' type='image/jpeg' length='995236'/>
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									<title><![CDATA[DC power supply extends perfomance capabilities to high-voltage applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916818&news_id=222916818&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916818&news_id=222916818&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-07-eeteu-pb-programmable_power_sorensen_sg_1000_vdc.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;AMETEK Programmable Power has extended the company's Sorensen SG Series high-power DC power supply line with the introduction of the new SG 1000V, which can supply up to 1,000V DC for applications such as testing photovoltaic inverters and electric vehicles.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:06:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-07-eeteu-pb-programmable_power_sorensen_sg_1000_vdc.jpg' type='image/jpeg' length='555443'/>
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									<title><![CDATA[Panel mount indicator series resists shock and moisture]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916819&news_id=222916819&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916819&news_id=222916819&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/vcc040-cnx-722-series-tuffled-pr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;VCC, a manufacturer of indication solutions for OEM and retrofit applications, including LED, neon, and incandescent indicators, and LED light pipes, has developed a new series of ruggedized panel mount indicators designed for use in a variety of harsh environments.  Featuring built-in LEDs visible both in direct sunlight and at wide angles, VCC's 22mm CNX 722 Series TuffLED indicators are resistant to shock, vibration, and moisture, and are RoHS compliant.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 16:58:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 16:58:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:58:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:58:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/vcc040-cnx-722-series-tuffled-pr.jpg' type='image/jpeg' length='575052'/>
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									<title><![CDATA[Factory-programmable linear Hall-effect sensor ICs for high-bandwidth applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916807&news_id=222916807&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916807&news_id=222916807&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/allegro-microsystems-a1318_a1319.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Two new factory one-time programmable automotive-grade linear Hall-effect sensor ICs eliminate the need for customers to optimise or program the devices for their finished sensor assemblies. The sensors are available from Allegro MicroSystems Europe. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 16:44:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 16:44:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:44:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/allegro-microsystems-a1318_a1319.jpg' type='image/jpeg' length='769916'/>
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									<title><![CDATA[Electric vehicle go-slow hits SiC power devices]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916802&news_id=222916802&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916802&news_id=222916802&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/car-body-electronics.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Wide-bandgap transistor and diode growth potential is obscured by automotive qualification, explains Yole Développement's Philippe Roussel, though PV inverter growth is a bright spot. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 13:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 13:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 13:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 13:05:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/car-body-electronics.jpg' type='image/jpeg' length='695855'/>
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									<title><![CDATA[OpenCL development kit opens up FPGAs to software developers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916801&news_id=222916801&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916801&news_id=222916801&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-cooperation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Altera has announced the broad availability of its Software Development Kit (SDK) for OpenCL and a board partner programme to simplify the development of highly parallel FPGA-based systems.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 12:51:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 12:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 12:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 12:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-cooperation.jpg' type='image/jpeg' length='200563'/>
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									<title><![CDATA[Cadence buys Evatronix for its IP business]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916800&news_id=222916800&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916800&news_id=222916800&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems is to buy the IP business of Polish EDA company Evatronix. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 12:31:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 12:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 12:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 12:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[Free microcontroller software deal extended to OpenRTOS]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916799&news_id=222916799&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916799&news_id=222916799&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Renesas Electronics Europe has teamed up with WITTENSTEIN High Integrity Systems to extend its offering of &euro;20,000 of software for its 32bit RX MCU microcontroller family ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 12:19:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 12:19:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 12:19:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 12:19:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[TO 247-4 pin package for CoolMOS MOSFETs improves efficiencies in hard switching topologies]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916804&news_id=222916804&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916804&news_id=222916804&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-07-eeteu-pb-to-247-4-c7.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Infineon Technologies AG has introduced a TO 247-4 pin package for the company's CoolMOS C7 MOSFETs. The added fourth pin acts as a Kelvin source to effectively reduce the parasitic inductance of the source lead of the power MOSFET.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:57:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:57:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 09:57:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 09:57:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-07-eeteu-pb-to-247-4-c7.jpg' type='image/jpeg' length='408017'/>
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									<title><![CDATA[Automotive 3-phase power module enables higher torque systems for lower fuel consumption]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916805&news_id=222916805&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916805&news_id=222916805&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/ftc03v455a_6x6.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Automotive engineers are constantly looking for ways to reduce fuel consumption and lower CO2 emissions while at the same time lowering overall system costs. To help designers meet these challenges, Fairchild Semiconductor developed the FTC03V455A1, a 3-Phase, Variable Speed Drive Automotive Power Module.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:56:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:56:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 15:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 15:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/ftc03v455a_6x6.jpg' type='image/jpeg' length='896235'/>
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									<title><![CDATA[Citizen, MechaTronix launch joint LED cooling solutions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916796&news_id=222916796&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916796&news_id=222916796&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/lpf8050_zhc_citizen_zhaga_led_pin_fin_heat_sink_family.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the raising demand for standard and validated cooling solutions, MechaTronix has recently launched a full series of passive and active LED cooling solutions for the latest generation Citizen CITILED COB's]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:38:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 13:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 13:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/lpf8050_zhc_citizen_zhaga_led_pin_fin_heat_sink_family.jpg' type='image/gif' length='22548'/>
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									<title><![CDATA[Power-One enters into patent license agreement with Microchip]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916797&news_id=222916797&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916797&news_id=222916797&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Power-One, Inc., a leading global manufacturer of renewable energy and energy-efficient power conversion and management solutions, has entered into a non-exclusive, worldwide, Field of Use agreement with Microchip Technology Inc. for Digital Power Technology (DPT) patents from Power-One.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:35:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:35:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 09:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 09:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[PCIe accelerator card targets enterprise servers and storage applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916747&news_id=222916747&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916747&news_id=222916747&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-micron.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Designed using Micron's XPERT architecture for improved performance and reliability, the P420m PCIe all-flash I/O accelerator combines consistent performance with the inherent power efficiency of an all-flash system to deliver improved economics for enterprise data centers.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:31:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-micron.jpg' type='image/png' length='739804'/>
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									<title><![CDATA[230V AC axial fan is temperature-controlled]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916758&news_id=222916758&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916758&news_id=222916758&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-evg.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;EVG distributes a temperature-controlled 230V AC axial fan measuring 119x119x38mm. Designed with an aluminium housing and impellers made of plastic according to UL 94 V-0, the unit features tinned leads, 280mm long. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:20:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 16:20:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 16:20:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-evg.jpg' type='image/jpeg' length='288088'/>
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									<title><![CDATA[Intelligent diagnostics maximize factory-floor up-times]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916656&news_id=222916656&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916656&news_id=222916656&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/power-infineon-fig1-factory-automation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;More than often it is common that when technical equipment fails, finding the root cause of the failure consumes significantly more time than actually fixing the problem. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:03:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/power-infineon-fig1-factory-automation.jpg' type='image/jpeg' length='4060861'/>
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									<title><![CDATA[M2M data management solution targets multiply-connected embedded systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916771&news_id=222916771&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916771&news_id=222916771&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/design-flow-chart.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ITTIA has released a Machine-to-Machine (M2M) data management solution based on its ITTIA DB SQL peer-to-peer replication technology, enabling embedded systems to efficiently and reliably manage local data that is transparently shared with other systems. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 10:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 10:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/design-flow-chart.jpg' type='image/jpeg' length='181892'/>
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									<title><![CDATA[Mouser signs global distribution deal with ADI]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916791&news_id=222916791&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916791&news_id=222916791&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-06-eeteu-pb-adismall.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mouser Electronics, Inc. has entered into a worldwide distribution agreement with Analog Devices, Inc. that covers Analog Devices' complete product portfolio, including data converters, amplifiers, MEMS, DSPs, RF and power management ICs and associated development tools.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 07:38:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 07:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 18:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 18:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-06-eeteu-pb-adismall.jpg' type='image/jpeg' length='83555'/>
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									<title><![CDATA[Floating surge stopper provides unlimited overvoltage protection]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916792&news_id=222916792&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916792&news_id=222916792&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-07-ltc4366.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Protecting sensitive electronic circuitry from voltage transients is an essential part of any system be it automotive, industrial, avionics or even battery-powered consumer applications. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 20:41:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 20:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 07:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 07:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-07-ltc4366.jpg' type='image/jpeg' length='21808'/>
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									<title><![CDATA[65-nm ARM Flash MCU controls electronic brake]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916794&news_id=222916794&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916794&news_id=222916794&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/electronic-components-pcb2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Texas Instruments and automotive supplier Continental AG collaborate on the first 65 nm ARM Cortex safety microcontrollers with Flash technology in volume production. The Continental processor for advanced control in electronic braking systems (PACE) is the foundation for the Continental MK 100 family of electronic stability control (ESC) systems. This 65 nm Flash technology also serves as the foundation for TI's Hercules safety MCU open market products. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 18:29:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 18:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 17:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 17:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/electronic-components-pcb2.jpg' type='image/jpeg' length='814262'/>
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									<title><![CDATA[Operator service revenues over the next five years to top $1 trillion]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916793&news_id=222916793&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916793&news_id=222916793&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/antennas-web-art.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A new report from Juniper Research finds that the cumulative 4G LTE mobile broadband service revenues over the next five years will account for over $1 trillion, representing approximately 17% of the cumulative operator billed service revenue from all mobile services.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 12:55:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 12:55:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 12:55:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 12:55:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/antennas-web-art.jpg' type='image/jpeg' length='15139'/>
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									<title><![CDATA[Top 20 Solar PV module suppliers capture 70 percent market share in first quarter of 2013 reports NPD Solarbuzz]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916775&news_id=222916775&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916775&news_id=222916775&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The top 20 solar photovoltaic (PV) module suppliers accounted for about 70% of global PV shipments in Q1'13, according to the latest Module Tracker Quarterly report released by market analyst NPD Solarbuzz.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 11:47:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 11:47:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 11:47:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 11:47:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[Superjunction MOSFET innovation brings the world's lowest RDS(on) to hard switching applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916795&news_id=222916795&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916795&news_id=222916795&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-06-eeteu-pb-650v_coolmos_c7_series.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Infineon Technologies has expanded the company's High Voltage portfolio with CoolMOS C7, introducing a 650 V Superjunction MOSFET technology.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 11:44:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 11:44:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 11:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 11:44:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-06-eeteu-pb-650v_coolmos_c7_series.jpg' type='image/jpeg' length='330856'/>
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									<title><![CDATA[Better, cheaper OLED micro displays do away with color filter]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916787&news_id=222916787&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916787&news_id=222916787&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/fraunhofer-oled-screen.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A research team of the Fraunhofer Research Institution for Organics, Materials and Electronic Devices (COMEDD) has developed a manufacturing process that dangles better and cheaper OLED microdisplays. The technology utilizes an innovative coating technology that makes color filters redundant.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 11:24:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 11:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 11:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 11:24:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/fraunhofer-oled-screen.jpg' type='image/jpeg' length='335126'/>
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									<title><![CDATA[US custom chip firm provides front end for European silicon photonics process]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916778&news_id=222916778&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916778&news_id=222916778&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-cooperation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Low cost custom chip prototyping firm MOSIS has teamed up with imec in Belgium, Tyndall in Ireland and the European Silicon Photonics support center ePIXfab to provide access to low-cost prototyping services for photonic ICs. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 09:52:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 09:52:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 12:52:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 12:52:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-cooperation.jpg' type='image/jpeg' length='200563'/>
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									<title><![CDATA[Robust industrial server features dual Intel Xeon E5]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916746&news_id=222916746&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916746&news_id=222916746&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-dsm.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The 4-U 19-inch industrial server Infinity S4 from DSM Computer features an industrial ATX mainboard with the Intel C602 chipset and two Intel Xeon E5-2418L processors (2.0 GHz, 10 MB cache, four cores). ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 09:37:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 09:37:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:37:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:37:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-dsm.jpg' type='image/jpeg' length='748376'/>
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									<title><![CDATA[6-axis MEMS SoC integrates gyroscope and accelerometer in a 3x3x0.8mm chip]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916785&news_id=222916785&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916785&news_id=222916785&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-06-eetimes-jh-invensys.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;InvenSense has released the MPU-6521 MEMS SoC as the world's smallest, lowest profile, and lowest power 6-axis motion tracking solution. The slim profile MPU-6521 aimed at portable devices and motion-based remote controls draws only 6.1mW, which is 60% less power than competing solutions, says the manufacturer.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 09:36:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 09:36:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 09:36:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 09:36:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-06-eetimes-jh-invensys.jpg' type='image/png' length='4939595'/>
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									<title><![CDATA[Extra-wide 387x86x13cm high-end TFT in a 1280x242 resolution]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916773&news_id=222916773&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916773&news_id=222916773&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-koe.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Extra wide and extra slim, KOE's latest high-end TFT offered by Data Modul comes with a resolution of 1280x242 pixels and outside dimensions of 387x86x13cm. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 09:20:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 09:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 11:40:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 11:40:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-koe.jpg' type='image/jpeg' length='476306'/>
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									<title><![CDATA[Starter Kit for COM Express Type 6 modules features AMD Embedded R-Series APUs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916761&news_id=222916761&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916761&news_id=222916761&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-msc.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;MSC Vertriebs now offers a complete starter kit for the quick evaluation and prototyping of embedded systems based on COM Express modules with AMD Embedded R-Series Accelerated Processing Unit (APU). ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 09:04:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 09:04:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 16:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 16:54:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-msc.jpg' type='image/png' length='4195268'/>
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									<title><![CDATA[500-W GaN on SiC HEMT pulsed power transistor provides high gain, efficiency over 1.2-1.4-GHz bandwidth]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916783&news_id=222916783&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916783&news_id=222916783&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-06-eeteu-pb-package-image-magx-flanged.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;M/A-COM Technology Solutions Inc. has introduced a GaN on SiC HEMT Power Transistor for L-Band pulsed radar applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 08:01:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 08:01:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 20:01:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 20:01:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-06-eeteu-pb-package-image-magx-flanged.png' type='image/png' length='1725358'/>
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									<title><![CDATA[Dual n- and p-channel MOSFETs for battery management applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916784&news_id=222916784&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916784&news_id=222916784&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-06-eeteu-pb-apec-ap9922-3.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Advanced Power Electronics has introduced two power MOSFETs well-suited for battery management and protection applications, the AP9922GEO-HF-3 and AP9923GEO-HF-3, dual n- and dual p-channel enhancement-mode MOSFETs.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 07:37:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 07:37:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 19:37:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 19:37:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-06-eeteu-pb-apec-ap9922-3.jpg' type='image/jpeg' length='163297'/>
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									<title><![CDATA[GE invests USD 1.5 Million in New Product Introduction Accelerator Lab]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916781&news_id=222916781&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916781&news_id=222916781&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-03-eetimes-jh-ge.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Aimed for GE engineers to design, develop and deliver new products faster than before, GE's Industrial Solutions business has opened a USD1.5 million, 17,000-square-foot New Product Introduction (NPI) Accelerator Lab located at the business' headquarters in Plainville, Conn. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 14:55:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 14:55:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 14:55:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 14:55:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-03-eetimes-jh-ge.jpg' type='image/png' length='897887'/>
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									<title><![CDATA[EU to set up multi-billion Euro startup and SME grant scheme]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916777&news_id=222916777&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916777&news_id=222916777&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-strategy.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The European Union is setting up a multi-billion Euro grant scheme to invest specifically in startups and spinouts.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 12:14:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 12:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 12:14:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 12:14:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-strategy.jpg' type='image/jpeg' length='446483'/>
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									<title><![CDATA[New growth opportunities for Electroactive Polymers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916776&news_id=222916776&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916776&news_id=222916776&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;IDTechEx Research finds that the electroactive polymer (EAP) market will be USD 245 million in 2013. The materials have been used for some time in actuators, capacitors and nanocomposites but, with new recent technical progress, come new growth opportunities.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 11:55:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 11:55:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 11:55:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 11:55:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[Servo motor controller supports fluctuation-free motor speed range from 0 to 150,000 rpm]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916772&news_id=222916772&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916772&news_id=222916772&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-03-eetimes-jh-maxon.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The maxon motor ESCON 70/10 is a high power density 4-quadrant pulse width modulated (PWM) servo motor controller that supports the efficient control of permanent-magnet brushed DC motors (PMDC) and brushless DC motors (BLDC motors) using Hall sensors with a power rating to about 700W.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 11:10:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 11:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 11:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 11:10:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-03-eetimes-jh-maxon.jpg' type='image/jpeg' length='3391089'/>
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									<title><![CDATA[Digi-Key now stocks Cirrus Logic's new single-stage LED drivers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916770&news_id=222916770&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916770&news_id=222916770&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/distributors-parcels.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Global electronic components distributor Digi-Key has added single stage LED drivers from Cirrus Logic to its portfolio. The CS615/16 product line recreates the dimming performance consumers expect from incandescent light bulbs. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 10:39:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 10:39:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 10:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 10:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/distributors-parcels.jpg' type='image/jpeg' length='369197'/>
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									<title><![CDATA[Bosch highlights radar technology for safety-relevant driver assistant systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916768&news_id=222916768&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916768&news_id=222916768&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/1-cc-18790.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Having already manufactured one million of automotive radar sensors, Bosch expects that the significance of the radar technology for automotive safety and intelligent driver assistance systems will significantly increase in the years ahead. Demand will be driven among other factors by stricter criteria for the Euro NCAP safety assessments.]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 09:28:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 09:28:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 09:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 09:28:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/1-cc-18790.jpg' type='image/jpeg' length='985673'/>
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									<title><![CDATA[AMD supports designs with customer-specific IP through its Semi-Custom Business Unit]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916762&news_id=222916762&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916762&news_id=222916762&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/amd-logo.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Through its Semi-Custom Business Unit, AMD it will now focus on developing unique solutions based on the extensive set of intellectual property (IP) amassed across AMD processors, graphics and multimedia. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 09:17:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 09:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 17:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 17:17:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/amd-logo.jpg' type='image/jpeg' length='19036'/>
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									<title><![CDATA[Battery-assisted passive EPC Gen2 RFID tag features temperature sensing]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916760&news_id=222916760&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916760&news_id=222916760&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/data-flow-code.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With a typical measurement accuracy of up to 0.5°C, the EM4325V11 battery-assisted passive EPC Gen2 RFID tag released by EM Microelectronic is aimed at the wireless real-time or data-logged monitoring of perishables. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 09:01:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 09:01:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 16:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 16:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/data-flow-code.jpg' type='image/jpeg' length='212444'/>
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									<title><![CDATA[Linux Industrial-IO drivers for entire MEMS range shorten development time for motion innovations]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916759&news_id=222916759&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916759&news_id=222916759&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-03-eete.nf-st-mems.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;STMicroelectronics has simplified the use of its MEMS with ready-to-use software drivers for communication with Linux systems through a standard interface.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 3 May 2013 08:51:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 3 May 2013 08:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 16:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 16:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-03-eete.nf-st-mems.jpg' type='image/jpeg' length='92329'/>
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									<title><![CDATA[Radiation-hardened isolated DC-DC converters enable power train solutions for aerospace applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916765&news_id=222916765&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916765&news_id=222916765&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/power-switch-button.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Microsemi Corporation has released a family of radiation-hardened isolated DC-to-DC converters for aerospace applications. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 16:32:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 16:32:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 16:32:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 16:32:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/power-switch-button.jpg' type='image/jpeg' length='184397'/>
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									<title><![CDATA[Win one of five Sabre Lite i.MX6 development board platforms]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916585&news_id=222916585&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916585&news_id=222916585&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-05-01-eetimes-jh-freescale.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The development platform for i.MX 6Quad from element14 (built to the Freescale SABRE Lite design) is an evaluation platform featuring the powerful i.MX 6Q, a multimedia application processor with Quad ARM Cortex-A9 cores at 1.2 GHz from Freescale Semiconductor. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 15:08:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 15:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 19 Apr 2013 16:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 20 Apr 2013 16:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-05-01-eetimes-jh-freescale.jpg' type='image/jpeg' length='245357'/>
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									<title><![CDATA[Global trial reveals huge energy saving potential of LED street lighting]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916755&news_id=222916755&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916755&news_id=222916755&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/energy-renewable.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;LED street lighting can generate energy savings as high as 85%, an independent global trial has found. The programme also indicates that citizens of pilot cities prefer LED lighting, citing social and environmental benefits.]]></description>
									<category><![CDATA[General]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 13:04:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 13:04:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 13:04:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 13:04:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/energy-renewable.jpg' type='image/jpeg' length='54877'/>
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									<title><![CDATA[Analog Devices launches European "Design Conference 2013"]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916752&news_id=222916752&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916752&news_id=222916752&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-adi.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Starting the series with two German editions in June, the new Design Conference aims to connect engineers with high-performance signal processing experts from ADI, Xilinx and MathWorks, over a content-rich technical agenda. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 12:28:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 12:28:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:28:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-adi.jpg' type='image/jpeg' length='218146'/>
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									<title><![CDATA[PCIe-hosted, multi-level-cell SSD boosts performance]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916764&news_id=222916764&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916764&news_id=222916764&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-02-edne-gp-micronhigh_res_p410m.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Micron Technology's P420m PCIe SSD (PCI express, solid-state drive) is designed for enterprise applications that require high-performance read workloads.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 12:22:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 12:22:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:22:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:22:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-02-edne-gp-micronhigh_res_p410m.jpg' type='image/jpeg' length='422810'/>
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									<title><![CDATA[Industrial network security group forms under Gambica's initiative]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916751&news_id=222916751&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916751&news_id=222916751&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-gambica.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A provider of industrial automation, instrumentation and control solutions, Gambica has formed an industrial network security group to identify standards and best practice for members and their customers to help counter the threats of viruses, industrial sabotage and terrorism. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 12:20:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 12:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:20:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:20:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-gambica.jpg' type='image/jpeg' length='126091'/>
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									<title><![CDATA[Smaller charger designs enabled by Super Barrier rectifiers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916763&news_id=222916763&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916763&news_id=222916763&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-02-edne-gp-diodes.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The 15A rated SBR15U50SP5 Super Barrier Rectifier (SBR) from Diodes Inc. has been introduced to meet the needs of next-generation smartphone and tablet chargers.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 11:51:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 11:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-02-edne-gp-diodes.jpg' type='image/jpeg' length='290411'/>
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									<title><![CDATA[NXP acquires Code Red Technologies to leverage its embedded software tools portfolio]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916748&news_id=222916748&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916748&news_id=222916748&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-acquisition.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;NXP Semiconductors has announced the acquisition of Code Red Technologies, an embedded software development tools provider.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 11:49:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 11:49:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:49:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:49:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-acquisition.jpg' type='image/jpeg' length='392863'/>
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									<title><![CDATA[Quadrature demodulator with PLL/VCO features RF building block to optimize power consumption]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916766&news_id=222916766&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916766&news_id=222916766&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-02-eeteu-pb-cmx972image.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;CML Microcircuits has introduced the company's latest RF building block in the form of the CMX972 quadrature modulator/demodulator which is followed on from the company's CMX970, CMX971 and CMX973 devices.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 11:42:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 11:42:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:42:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-02-eeteu-pb-cmx972image.jpg' type='image/jpeg' length='303778'/>
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									<title><![CDATA[Interface ICs connect displays and keyboards, target tablet designs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916749&news_id=222916749&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916749&news_id=222916749&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-02-edne-gp-ti-keyboards.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Texas Instruments has introduced two devices to ease design constraints and reduce board space while adding functionality for tablet designs. The TCA8424 is the industry's first human interface device (HID) over I2C, 128-key keyboard controller. It eliminates the need to program the device at production, simplifying design and speeding time-to-market.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 11:19:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 11:19:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:19:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:19:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-02-edne-gp-ti-keyboards.jpg' type='image/jpeg' length='1001135'/>
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									<title><![CDATA[Cipurse V2 Mobile guidelines address new form factors]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916745&news_id=222916745&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916745&news_id=222916745&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/rfid-tags-nfc.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The Open Standard for Public Transport (OSPT) Alliance has officially released the CIPURSE V2 Mobile Guidelines, a comprehensive set of requirements and use cases for developing and deploying CIPURSE-secured transit fare mobile apps for near field communication (NFC)-enabled devices. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 11:05:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 11:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:05:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/rfid-tags-nfc.jpg' type='image/jpeg' length='439957'/>
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									<title><![CDATA[Optical MT backplane interconnect system simplifies VPX-architecture]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916744&news_id=222916744&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916744&news_id=222916744&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-molex.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Molex's VITA 66.1 ruggedised optical MT backplane interconnect solution is designed for high-density aerospace, defence and commercial embedded system applications. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 11:03:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 11:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:03:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-molex.jpg' type='image/jpeg' length='596316'/>
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									<title><![CDATA[Apple's pull effect on MEMSs raises suppliers' profile and revenues, notes IHS]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916743&news_id=222916743&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916743&news_id=222916743&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Once again demonstrating Apple Inc.'s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems (MEMS) microphones were those that provided devices for iPhones and iPads. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 10:53:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 10:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 10:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 10:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis.jpg' type='image/jpeg' length='191112'/>
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									<title><![CDATA[Intel to make 22-nm chips for Microsemi]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916742&news_id=222916742&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916742&news_id=222916742&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/silicon-wafer-held.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Intel will build ICs and SoCs for Microsemi using its 22-nm FinFET process, Microsemi announced Wednesday (May 1). The foundry deal, signed in January, has allowed Microsemi to engage with customers and begin designs utilizing Intel's 22-nm process technology with product delivery expected to begin in late 2014 or early 2015, Microsemi (Aliso Viejo, Calif.) said. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 10:48:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 10:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 10:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 10:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/silicon-wafer-held.jpg' type='image/jpeg' length='504808'/>
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									<title><![CDATA[Integrated temperature sensor in BAP RFID chip is ideal for wireless real-time or data-logged monitoring]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916741&news_id=222916741&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916741&news_id=222916741&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/rfid-tag-antenna.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;EM Microelectronic, the semiconductor company of the Swatch Group, has introduced a versatile and multipurpose, battery-assisted passive (BAP) RFID chip with a calibrated temperature sensor.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 10:18:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 10:18:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 1 May 2013 19:45:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 2 May 2013 19:45:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/rfid-tag-antenna.jpg' type='image/jpeg' length='677905'/>
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									<title><![CDATA[LCD modules with enhanced viewing angle and colour stability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916732&news_id=222916732&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916732&news_id=222916732&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eetimes-jh-koe.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;KOE has introduced two new TFT displays featuring a new ultra wide viewing angle (UWVA) technology. The 5.7" TX14D23VM5BAA and 6.5" TX17D01VM5BAA units feature VGA (640 x 480 pixels) resolution and are based on traditional TN (twisted nematic) TFT technology. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 09:30:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 09:30:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 15:30:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 15:30:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eetimes-jh-koe.jpg' type='image/jpeg' length='1730763'/>
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									<title><![CDATA[Jenoptik and Phoenix Contact join forces to develop intelligent LED lighting for machines]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916734&news_id=222916734&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916734&news_id=222916734&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-phoenix2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Based on their long-term strategic collaboration agreement on product development and supply, Jenoptik and Phoenix Contact have jointly developed intelligent LED machine lights. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 2 May 2013 09:05:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 2 May 2013 09:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 16:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 16:05:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-phoenix2.jpg' type='image/jpeg' length='593143'/>
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									<title><![CDATA[Security for connected embedded devices defends against rootkits]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916739&news_id=222916739&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916739&news_id=222916739&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-05-01-eete-nf-lynuxworks.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;LynuxWorks has added new security features to its LynxSecure embedded hypervisor to offer real-time detection, alert and protection against new cyber threats such as zero-day rootkits and bootkits. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 15:50:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 15:50:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 1 May 2013 15:50:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 2 May 2013 15:50:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-05-01-eete-nf-lynuxworks.jpg' type='image/jpeg' length='468942'/>
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									<title><![CDATA[Infiniband OpenVPX switch boosts throughput for reconnaissance and imaging]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916738&news_id=222916738&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916738&news_id=222916738&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-05-01-eete-nf-ge.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;GE Intelligent Platforms has launched a rugged 6U OpenVPX InfiniBand Switch Fabric Module to bring leading edge commercial data center connectivity and performance to military and aerospace applications]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 15:38:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 15:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 1 May 2013 15:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 2 May 2013 15:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-05-01-eete-nf-ge.jpg' type='image/jpeg' length='47443'/>
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									<title><![CDATA[Mindspeed looks at its options after 3G disappoints]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916737&news_id=222916737&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916737&news_id=222916737&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2012/2012-01-january/2012-01-05-eet-nf-picochip-2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mindspeed Technologies has hired a Wall Street bank for advice after disappointing growth in its 3G wireless infrastructure business.   ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 15:25:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 15:25:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 1 May 2013 15:25:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 2 May 2013 15:25:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2012/2012-01-january/2012-01-05-eet-nf-picochip-2.jpg' type='image/jpeg' length='312729'/>
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									<title><![CDATA[ZigBee Alliance ratifies Smart Energy Profile 2 standard]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916736&news_id=222916736&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916736&news_id=222916736&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The ZigBee Alliance has completed the development and ratification of the Smart Energy Profile 2 (SEP 2) standard.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 10:25:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 10:25:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 1 May 2013 10:25:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 2 May 2013 10:25:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[SILICA invests in Power 'n More design support strategy]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916733&news_id=222916733&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916733&news_id=222916733&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-strategy.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Silica announced a strategy to establish itself as the power experts in European semiconductor distribution. The new strategy is being rolled out under the brand Power 'n More, and builds on Silica's strong ability to support end-to-end designs both at system and device level.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 09:34:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 09:34:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 15:34:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 15:34:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-strategy.jpg' type='image/jpeg' length='446483'/>
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									<title><![CDATA[IPx8 waterproof 11x15x2mm speaker delivers 94dB of maximum sound pressure]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916731&news_id=222916731&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916731&news_id=222916731&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eetimes-jh-knowlese.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Knowles Sound Solutions' Cobra speaker is a 11x15x2mm speaker with 1 Watt of power handling capacity for outstanding loudness in portable consumer devices. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 09:22:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 09:22:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 15:22:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 15:22:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eetimes-jh-knowlese.jpg' type='image/jpeg' length='276163'/>
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									<title><![CDATA[Fanless palm-size embedded box PC features I/O extensibility and remote management]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916728&news_id=222916728&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916728&news_id=222916728&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-advantech.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Advantech's ARK-1122 palm-size and fanless embedded box PC comes built with the Intel Atom N2600/N2800 dual-core processor. Drawing less than 10 Watts, the unit is readily extendible with a rich selection of I/O connectors. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 09:08:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 09:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 11:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 11:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-advantech.png' type='image/png' length='979203'/>
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									<title><![CDATA[NMI prepares power electronics technology roadmap for the UK to boost share of £135bn global industry]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916735&news_id=222916735&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916735&news_id=222916735&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/power-switch-button.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A multi-annual innovation roadmap for the UK's complete power electronics industry is to be established by NMI, a UK trade association for electronic systems, microelectronics and semiconductors, in partnership with the UK Government. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 1 May 2013 06:31:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 1 May 2013 06:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 19:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 19:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/power-switch-button.jpg' type='image/jpeg' length='184397'/>
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									<title><![CDATA[Premier Farnell signs international agreement with Philips Lumileds]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916716&news_id=222916716&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916716&news_id=222916716&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/distributors-logistics.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Through the deal Premier Farnell will expand its position as the number one high service distributor of LED components. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 16:15:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 16:15:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 16:15:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 16:15:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/distributors-logistics.jpg' type='image/jpeg' length='184204'/>
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									<title><![CDATA[72-bit WIDE DDR2 in a 29x19x7.6mm 191 BGA package]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916730&news_id=222916730&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916730&news_id=222916730&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eetimes-jh-3dplus.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The 3D2D4G72UB3478 is what 3D Plus claims to be the first space grade 72b wide DDR2 memory module, organized as 64M x72b and particularly well suited for use in high reliability, high performance and high density system applications. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 14:53:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 14:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 14:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 14:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eetimes-jh-3dplus.jpg' type='image/jpeg' length='77102'/>
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									<title><![CDATA[MicroTCA 2U cloud computing platform supports 1000W processing]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916729&news_id=222916729&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916729&news_id=222916729&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eete-nf-vadatech.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;VadaTech has started shipping a novel chassis based on the MicroTCA standard designed specifically for application server platforms with multiple processors.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 11:53:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 11:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 11:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 11:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eete-nf-vadatech.jpg' type='image/jpeg' length='8681'/>
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									<title><![CDATA[LeCroy debuts 100/10BASE-T Ethernet decode software]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916727&news_id=222916727&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916727&news_id=222916727&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-lecroy.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Teledyne LeCroy has announced an Ethernet decode software option compatible with its wide range of oscilloscopes featuring bandwidths from 200 MHz to 65 GHz. With the software, users can easily decode 100BASE-T and 10BASE-T Ethernet signals to examine each frame within a given packet, assuring pre-compliance with IEEE standards. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 11:41:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 11:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 11:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 11:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-lecroy.jpg' type='image/jpeg' length='347047'/>
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									<title><![CDATA[Free Android software eases ambient light and proximity sensors integration]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916726&news_id=222916726&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916726&news_id=222916726&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-vishay.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Vishay Intertechnology has released free Android software designed to simplify the use of its VCNL4020 and VCNL3020 integrated proximity and ambient light sensors in any mobile device running Android 4.0.1 software or higher.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 11:36:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 11:36:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 11:36:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 11:36:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-vishay.jpg' type='image/jpeg' length='887934'/>
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									<title><![CDATA[Isolated 8-port PoE PSE controllers eliminate expensive opto-couplers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916725&news_id=222916725&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916725&news_id=222916725&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-linear.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The LTC4290/LTC4271 isolated 8-port power source equipment (PSE) controller chipset from Linear Technology is designed for use in IEEE 802.3at (PoE+) Type 1- and Type 2-compliant Power-over-Ethernet (PoE) systems.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 11:14:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 11:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 11:14:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 11:14:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-linear.jpg' type='image/jpeg' length='1213044'/>
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									<title><![CDATA[Single chip combines Wi-Fi and ZigBee IP for networked devices]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916724&news_id=222916724&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916724&news_id=222916724&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-alphamicro.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Alpha Micro is now stocking GainSpan's GS2000 single chip solution, the industry's first to bring together two IEEE low power standard wireless technologies: Wi-Fi (802.11b/g/n) and 802.15.4. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 11:07:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 11:07:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 11:07:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 11:07:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-alphamicro.jpg' type='image/jpeg' length='3303197'/>
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									<title><![CDATA[Roboteq backs Raspberry PI-based robot navigation computer project on Kickstarter]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916723&news_id=222916723&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916723&news_id=222916723&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-robotec.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Roboteq is collaborating on a kickstarter project named RIO (for Raspberry IO) and aimed at creating an intelligent I/O card that stacks over the USD35 Raspberry PI Linux Single Board computer.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 11:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 11:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 11:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 11:03:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-robotec.jpg' type='image/jpeg' length='286321'/>
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									<title><![CDATA[40 percent of mobile applications will leverage cloud back-end services by 2016, says Gartner]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916722&news_id=222916722&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916722&news_id=222916722&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/cloud-computing2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;By 2016, 40 percent of mobile application development projects will leverage cloud back-end services, causing development leaders to lose control of the pace and path of cloud adoption within their enterprises, predicts the market research firm Gartner.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 10:57:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 10:57:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 10:57:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 10:57:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/cloud-computing2.jpg' type='image/jpeg' length='602267'/>
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									<title><![CDATA[Virtualizer Development Kit for Freescale's Qorivva family boosts automotive ECU design]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916719&news_id=222916719&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916719&news_id=222916719&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eete-nf-synopsys.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Synopsys has launched a Virtualizer Development Kit (VDK) for Freescale Semiconductor's Qorivva microcontrollers to accelerate the development of automotive control applications in powertrain, chassis, safety and body electronic control units. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 10:52:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 10:52:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 10:52:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 10:52:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eete-nf-synopsys.jpg' type='image/jpeg' length='27088'/>
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									<title><![CDATA[NXP expands FlexRay transceiver portfolio]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916721&news_id=222916721&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916721&news_id=222916721&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/nxp-3d-concept-car-ivn.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The automotive data bus system FlexRay is gaining market acceptance. After initially being a feature of high-end vehicles, the data bus now is increasingly designed into mid-size cars, OEM insiders hint. One of the biggest players in the FlexRay silicon market, NXP accompanies the "democratization" of FlexRay with the roll-out of three new transceiver chips. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 10:17:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 10:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 10:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 10:17:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/nxp-3d-concept-car-ivn.jpg' type='image/jpeg' length='157172'/>
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									<title><![CDATA[High energy thick film resistors: power density and non-inductive]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916720&news_id=222916720&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916720&news_id=222916720&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-04-30-edne-gp-tti-ohmite-tp-series' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;From distributor TTI, the Ohmite TP Series is the first in a range with compact design, saving PCB  space; these thick-film resistors also provide the impulse energy capability normally associated with wire wound or composition resistors.]]></description>
									<category><![CDATA[General]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 09:58:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 09:58:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 30 Apr 2013 09:58:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 1 May 2013 09:58:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-04-30-edne-gp-tti-ohmite-tp-series' type='' length='45391'/>
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									<title><![CDATA['Black Silicon' gives CMOS image sensor true nightglow capabilities]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916706&news_id=222916706&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916706&news_id=222916706&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eete-nf-sionyx.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Image sensor developer SiOnyx has demonstrated its XQE family of CMOS image sensors for the first time with sensitivity enhancements as high as 10x for infrared sensing.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 09:23:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 09:23:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 12:23:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 12:23:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-30-eete-nf-sionyx.jpg' type='image/jpeg' length='20375'/>
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									<title><![CDATA[12-bit universal magnetic position encoder in a TSSOP20 package]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916715&news_id=222916715&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916715&news_id=222916715&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-ichaus.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The iC-MHL200 is an integrated system solution for linear and angular magnetic encoder applications. The chip housed in a TSSOP20 package includes a linear Hall sensor array which is adapted to the targets' magnetic pole pitch of 2mm. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 09:13:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 09:13:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 16:13:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 16:13:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-ichaus.jpg' type='image/jpeg' length='435776'/>
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									<title><![CDATA[Bench oscilloscopes feature 20 Msample deep memory and logic analysis option]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916714&news_id=222916714&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916714&news_id=222916714&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-rohdes.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the introduction of the new R&S RTM series, Rohde & Schwarz has expanded the functional range of its bench oscilloscopes with key upgrades such as a 20 Msample deep memory and a logic analysis option with 16 digital channels.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 09:12:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 09:12:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 16:12:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 16:12:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eetimes-jh-rohdes.jpg' type='image/jpeg' length='696972'/>
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									<title><![CDATA[Avnet Abacus to distribute Elektron Technology in all Europe]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916713&news_id=222916713&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916713&news_id=222916713&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Avnet Abacus has signed a pan-European deal with Elektron Technology to distribute the company's Bulgin and Arcolectric brands throughout Europe.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 30 Apr 2013 09:08:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 30 Apr 2013 09:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 16:08:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 16:08:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[Advanced Power Electronics Corp. agrees distribution deal with Neutron for UK and Ireland]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916717&news_id=222916717&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916717&news_id=222916717&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-cooperation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Advanced Power Electronics Corp. (USA) has signed a UK distribution deal with Neutron Ltd, which covers the UK and Ireland.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Mon, 29 Apr 2013 17:43:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 29 Apr 2013 17:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 17:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 17:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-cooperation.jpg' type='image/jpeg' length='200563'/>
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									<title><![CDATA[NXP buys Code Red to boost microcontroller ecosystem]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916708&news_id=222916708&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916708&news_id=222916708&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eete-nf-nxp.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;NXP Semiconductors has bought embedded tool vendor Code Red Technologies in a  move to strengthen its own microcontroller eco-system.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Mon, 29 Apr 2013 12:51:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 29 Apr 2013 12:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 12:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 12:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eete-nf-nxp.jpg' type='image/jpeg' length='240638'/>
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									<title><![CDATA[First single chip touchscreen controller for 15in screens and above]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916709&news_id=222916709&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916709&news_id=222916709&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eete-nf-atmel.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Atmel has launched its next generation controller family for touchscreens up to 23 inches with both self and mutual capacitance and integrating a sensor fusion hub.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 29 Apr 2013 12:51:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 29 Apr 2013 12:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 12:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 12:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-04-april/2013-04-29-eete-nf-atmel.jpg' type='image/jpeg' length='25952'/>
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									<title><![CDATA[Group backs publish/subscribe open protocol for M2M messaging]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916707&news_id=222916707&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916707&news_id=222916707&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/data-flow-code.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Organizations from around the world are collaborating on a lightweight reliable messaging transport protocol for Machine-to-Machine (M2M) connections and Internet of Things (IoT). ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 29 Apr 2013 12:38:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 29 Apr 2013 12:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 12:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 12:38:00 +0200]]></eventEndDate>
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									<title><![CDATA[Service aware switch engines tracks mobile and cloud access]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916710&news_id=222916710&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916710&news_id=222916710&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-04-29-vitesse-seval-2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Vitesse Semiconductor Corporation has expanded its Serval carrier Ethernet switch engine portfolio with Serval-2 (VSC7438), which claims to be the first silicon optimized for high bandwidth IP Edge and Ethernet/MPLS access applications, including mobile backhaul, cloud access and business service delivery. Featuring the Vitesse Service Aware Architecture (ViSAA), Serval-2 radically simplifies carrier delivery of MEF CE 2.0 services in packet-based mobile and cloud access Ethernet networks.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 29 Apr 2013 12:22:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 29 Apr 2013 12:22:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 12:22:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 12:22:00 +0200]]></eventEndDate>
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									<title><![CDATA[Software-based super-resolution technology for low energy mobile applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916718&news_id=222916718&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916718&news_id=222916718&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/mobile-phones-web-art.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;CEVA claims to offer the first software-based Super-Resolution (SR) technology for embedded applications, bringing PC system-equivalent imaging performance to low power mobile devices. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 29 Apr 2013 12:11:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 29 Apr 2013 12:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 29 Apr 2013 12:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 30 Apr 2013 12:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/mobile-phones-web-art.jpg' type='image/jpeg' length='78521'/>
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