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					<title><![CDATA[News]]></title>
					<description></description>
					<link>http://www.electronics-eetimes.com/en/News/full-news.html</link>
					
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									<title><![CDATA[4-channel analog input device for voltage and sensor-based measurements]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916998&news_id=222916998&cmp_id=7]]></link>
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									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-24-eetimes-jh-ipetronik.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The M-SENS2 4-channel analog input device from Ipetronik offers a direct CAN (Controller Area Network) bus output. Compatible with the previous M-SENS, the new module has a higher internal sample rate and a newly designed 500Hz hardware filter to support higher input frequencies.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 11:22:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 11:22:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 24 May 2013 11:22:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 25 May 2013 11:22:00 +0200]]></eventEndDate>
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									<title><![CDATA[Single chip integrates JTAG standards and mixed-signal test instruments]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916997&news_id=222916997&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916997&news_id=222916997&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-24-eetimes-jh-goepel.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Goepel electronic's CION LX is a new generation of JTAG transceiver ICs that provides ultra-low voltage characteristics, offering a tester-per-pin architecture based on diverse Boundary Scan standards, in combination with additional digital and analogue test instruments. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 11:12:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 11:12:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 24 May 2013 11:12:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 25 May 2013 11:12:00 +0200]]></eventEndDate>
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									<title><![CDATA[Hardware and software wireless design services help OEMs deploy M2M solutions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916996&news_id=222916996&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916996&news_id=222916996&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/wireless-comms-network.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Digi International announced that its wireless design division, Spectrum Design Solutions, will join Etherios, a division of Digi, as Wireless Design Services. The services include complete hardware and software wireless design services that allow OEMs to quickly and easily add wireless capabilities to new and existing products. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 10:53:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 10:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 24 May 2013 10:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 25 May 2013 10:53:00 +0200]]></eventEndDate>
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									<title><![CDATA[6.5 million euros European project AMBASSADOR aims for eco-friendly districts]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916995&news_id=222916995&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916995&news_id=222916995&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/energy-renewable.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;By taking their environment into consideration, smart buildings can perform significant energy savings, translated directly into CO2 reduction. The 6.5 million euros European project AMBASSADOR will transform smart buildings into flexible buildings in an eco-district. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 10:41:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 10:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 24 May 2013 10:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 25 May 2013 10:41:00 +0200]]></eventEndDate>
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									<title><![CDATA[London Calling: ST's Bozotti seeks another term]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916994&news_id=222916994&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916994&news_id=222916994&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/stmicro-logo.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Carlo Bozotti, chief executive officer, of ST was taking questions during a financial and media analysts' day held in London on May 16 when  he was asked by an analyst what would happen when his contract runs out   in 2014. Would he go or seek another term in office?]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 10:38:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 10:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 24 May 2013 10:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 25 May 2013 10:38:00 +0200]]></eventEndDate>
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									<title><![CDATA[Miniature connector is 45% lighter than a D-sub]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916993&news_id=222916993&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916993&news_id=222916993&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-24-eetimes-jh-souriau.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;An alternative to the D-subminiature connector, the microComp Quicklatch is a 100% composite miniature quick connector designed particularly for use on in-flight entertainment (IFE) screens aboard commercial aircraft. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 10:34:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 10:34:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 24 May 2013 10:34:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 25 May 2013 10:34:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-24-eetimes-jh-souriau.jpg' type='image/jpeg' length='150183'/>
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									<title><![CDATA[Miniature self-charging tracking device generates its own radio signal]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916986&news_id=222916986&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916986&news_id=222916986&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-24-eetimes-jh-roke.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Roke Manor Research Ltd announced a self-charging miniaturised device which generates a radio signal that can be tracked up to an estimated 200 kilometres away. Dubbed Agitate, the unit is the size of a five pence piece. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 10:31:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 10:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 18:01:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 18:01:00 +0200]]></eventEndDate>
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									<title><![CDATA[Time for a new UI programming paradigm]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916663&news_id=222916663&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916663&news_id=222916663&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-03-march/haptics-cranksoftware-2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the ubiquitous usage of smartphones, tablets, and other mainstream screens, traditional products that once had analog displays are now being modernized with digital user interfaces (UI). ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 09:24:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 09:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:24:00 +0200]]></eventEndDate>
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									<title><![CDATA[DSM Computer markets electro-luminescent displays from Lumineq]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916980&news_id=222916980&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916980&news_id=222916980&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eetimes-jh-dsm.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;DSM Computer GmbH now distributes the high-quality thin film electro-luminescent (TFEL) displays made by Lumineq Displays, particularly suited for a wide range of applications with extreme environment requirements. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 09:07:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 09:07:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 12:07:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 12:07:00 +0200]]></eventEndDate>
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									<title><![CDATA[Mouser sign global distribution agreement with Advanced Thermal Solutions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916992&news_id=222916992&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916992&news_id=222916992&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Advanced Thermal Solutions, Inc. (ATS) has signed a new global agreement with Mouser Electronics, Inc. to distribute high performance heat sinks and cooling solutions.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Fri, 24 May 2013 07:45:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 24 May 2013 07:45:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 24 May 2013 07:45:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 25 May 2013 07:45:00 +0200]]></eventEndDate>
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									<title><![CDATA[Brussels Calling: Qualcomm wins in a wasteful industry]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916985&news_id=222916985&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916985&news_id=222916985&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/energy-battery-charger.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Is there a difference between the U.S. and Europe on green and sustainability issues? It appears there is to judge from an interaction at the IMEC Technology Forum here yesterday. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 17:03:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 17:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 17:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 17:03:00 +0200]]></eventEndDate>
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									<title><![CDATA[Europe in 10 billion &euro; bid to boost chip industry]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916983&news_id=222916983&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916983&news_id=222916983&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/documents/whitepapers/13-05/aeneas-nanoelectronics-beyond2020.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;BRUSSELS, Belgium  The European Commission has launched a campaign of public investment in micro- and nano-electronics with the aim of doubling chip production on the continent to reach 20 percent of global   production.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 15:43:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 15:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 15:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 15:43:00 +0200]]></eventEndDate>
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									<title><![CDATA[Nujira surpasses own world record for ET PA linearity]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916981&news_id=222916981&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916981&news_id=222916981&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/wireless-wifi.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Nujira will present new performance results at the IEEE MTT International Microwave Symposium (IMS) in Seattle, USA that demonstrate the company has bettered its own world record linearity mark for an RF Power Amplifier (PA) operating under ET conditions. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 14:44:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 14:44:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 14:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 14:44:00 +0200]]></eventEndDate>
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									<title><![CDATA[Silica moves to fast lane in Europe's LED market]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916968&news_id=222916968&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916968&news_id=222916968&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-strategy.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;In the booming market for LED lighting, electronics distributor Silica intends to lead the pack by offering technological excellence at application level. The company is currently planning to offer tailor-made solutions based on customer specifications, said Martin Bielesch, General Manager Lighting and New Markets Silica, in an interview with EE Times Europe.]]></description>
									<category><![CDATA[Interviews]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 14:26:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 14:26:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 14:26:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 14:26:00 +0200]]></eventEndDate>
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									<title><![CDATA[Tiny PCIe clock generators ease power and design complexity]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916979&news_id=222916979&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916979&news_id=222916979&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eete-nf-silabs.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Silicon Labs has launched new one- and two-output PCI Express (PCIe) clock generators that offer the smallest footprint and lowest power in the market.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 12:01:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 12:01:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 12:01:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 12:01:00 +0200]]></eventEndDate>
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									<title><![CDATA[Intel's new CEO shakes things up]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916978&news_id=222916978&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916978&news_id=222916978&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-news2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Newly minted Intel Corp. CEO Brian Krzanich wasted little time putting his stamp on the company he has worked for for more than 30 years. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 11:38:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 11:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 11:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 11:38:00 +0200]]></eventEndDate>
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									<title><![CDATA[Wide-angle lens is less than 3mm high for the same diameter]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916977&news_id=222916977&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916977&news_id=222916977&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eetimes-jh-suyin.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;By employing plastic, glass, and hybrid materials in production, Suyin Optronics is able to develop different lenses for image sensors with resolutions from 0.3 megapixels (with one element) to 13 megapixels (with five plastic elements or with one glass and three plastic elements). ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 11:29:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 11:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 11:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 11:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eetimes-jh-suyin.jpg' type='image/jpeg' length='1710086'/>
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									<title><![CDATA[Four channel analog input module adds direct CAN bus output]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916975&news_id=222916975&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916975&news_id=222916975&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eete-nf-ipetronik.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;German test equipment maker IPETRONIK has upgraded its M-Series by adding a 4-channel analog input module with direct CAN (Controller Area Network) bus output. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 11:21:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 11:21:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 11:21:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 11:21:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eete-nf-ipetronik.jpg' type='image/jpeg' length='373779'/>
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									<title><![CDATA[Mobile accelerated processing unit line-up addresses new PC form factors]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916974&news_id=222916974&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916974&news_id=222916974&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/amd-logo.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;AMD has added three products to its 2013 A-Series and E-Series Mobile Accelerated Processing Unit (APU) lineup, addressing today's evolving PC market with dramatically increased performance and power efficiency.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 11:18:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 11:18:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 11:18:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 11:18:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/amd-logo.jpg' type='image/jpeg' length='19036'/>
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									<title><![CDATA[Low-power wireless projected to make waves in remote controls according to IMS Research]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916973&news_id=222916973&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916973&news_id=222916973&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Nearly one-fifth of all remote controls will feature wireless radio frequency (RF) technology by 2018 that enable many advanced technologies not available with current remotes, including voice and gesture control, according to insights from IMS Research. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 11:14:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 11:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 11:14:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 11:14:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[Floating point extends QorIQ Qonverge B4 family to Industrial and General-Purpose markets]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916972&news_id=222916972&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916972&news_id=222916972&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eete-nf-freescale.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Freescale Semiconductor has added advanced floating point technology to its QorIQ Qonverge B4 wireless baseband processor family to address industrial and general-purpose markets. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 11:10:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 11:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 11:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 11:10:00 +0200]]></eventEndDate>
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									<title><![CDATA[Intel pushes for more research beyond 10-nm]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916971&news_id=222916971&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916971&news_id=222916971&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-23-eetimes-jh-imec.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mike Mayberry, director of component research at Intel Corp. has looked down the highway of conventional silicon development and reckons things become foggy beyond about the 7-nm node.  ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 10:42:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 10:42:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 10:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 10:42:00 +0200]]></eventEndDate>
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									<title><![CDATA[Single-chip sensorless, brushless DC motor driver spins motors instantly]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916988&news_id=222916988&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916988&news_id=222916988&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-23-eeteu-pb-mt1513_22may13_drv10963_chipshot-final.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Texas Instruments Incorporated has expanded the company's sensorless, brushless DC (BLDC) motor driver portfolio with a new device designed for high efficiency and low noise, which requires a low external component count of only one capacitor. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 10:42:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 10:42:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 10:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 10:42:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-23-eeteu-pb-mt1513_22may13_drv10963_chipshot-final.jpg' type='image/jpeg' length='223444'/>
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									<title><![CDATA[Expanded ecosystem of ultra-low power MCUs speeds capacitive touch design development]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916970&news_id=222916970&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916970&news_id=222916970&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-23-eeteu-pb-pushbutton-1.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Texas Instruments Incorporated has released a new software library, sensor tuning GUI, design collateral and support for additional microcontrollers (MCU) to ease development of capacitive touch solutions.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 10:07:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 10:07:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 10:07:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 10:07:00 +0200]]></eventEndDate>
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									<title><![CDATA[PFC IC enables compact designs for consumer products and PCs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916990&news_id=222916990&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916990&news_id=222916990&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/power-switch-button.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Power Integrations has introduced HiperPFS-2, a new family of high-efficiency, active-PFC ICs for offline applications from 100 W to 380 W.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 09:55:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 09:55:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 09:55:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 09:55:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/power-switch-button.jpg' type='image/jpeg' length='184397'/>
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									<title><![CDATA[Radiation hardened DC-DC power conversion devices support space power systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916989&news_id=222916989&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916989&news_id=222916989&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-23-eeteu-pb-vpt0404-2d-space.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;VPT Inc., a HEICO company has introduced a new series of radiation hardened DC-DC power converters, point of load converters, and EMI filters to power space systems.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 09:39:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 09:39:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 09:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 09:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-23-eeteu-pb-vpt0404-2d-space.jpg' type='image/jpeg' length='945811'/>
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									<title><![CDATA[Yokogawa enhances DLM4000 oscilloscope for use in automotive environments]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916991&news_id=222916991&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916991&news_id=222916991&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/yokogawa-europe-tm-l16-option-for-the-dlm4000.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A number of new enhancements have been introduced to the Yokogawa DLM4000 Series of 8-channel mixed-signal oscilloscopes. These include the L16 option, which adds 16 extra channels of logic, plus upgraded firmware for power measurements and serial-bus testing.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 09:37:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 09:37:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 09:37:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 09:37:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/yokogawa-europe-tm-l16-option-for-the-dlm4000.jpg' type='image/jpeg' length='915791'/>
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									<title><![CDATA[The quick way to build better embedded user interfaces]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916662&news_id=222916662&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916662&news_id=222916662&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-03-march/haptics-qt-digia-fig3.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A software framework for user interface and application development with cross-platform capability can help speed-up UI development through rapid prototyping as well as ensure smooth and fluid interaction within the overall application. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 09:23:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 09:23:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:23:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:23:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/haptics-qt-digia-fig3.png' type='image/png' length='580294'/>
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									<title><![CDATA[ProximusDA teams with STMicroelectronics to develop distributed SOC TLM virtual prototypes]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916969&news_id=222916969&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916969&news_id=222916969&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-cooperation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ProximusDA GmbH, a company based in Munich, Germany, has collaborated with STMicroelectronics to develop the next generation of software virtual prototypes.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 07:50:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 07:50:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 07:50:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 07:50:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-cooperation.jpg' type='image/jpeg' length='200563'/>
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									<title><![CDATA[Ultra compact DC-DC converters offer a voltage trim capability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916987&news_id=222916987&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916987&news_id=222916987&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-24-eeteu-pb-mur238.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Murata has added to the company's LXDC series of ultra compact DC-DC converters with new devices that comprise the LXDC55F and LXDC55K step down converters. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 23 May 2013 07:06:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 23 May 2013 07:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 23 May 2013 17:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 24 May 2013 17:06:00 +0200]]></eventEndDate>
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									<title><![CDATA[Lithium-ion batteries withstand 10.000 charging cycles]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916963&news_id=222916963&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916963&news_id=222916963&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/zsw.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Scientists from the Centre for Solar Energy and Hydrogen Research Baden Wuerttemberg (ZSW) have developed lithium-ion-batteries that could offer new perspectives for electromobility: After more than 10.000 charging cycles, the batteries still had more than 85 percent of its initial capacity. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 18:07:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 18:07:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 18:07:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 18:07:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/zsw.jpg' type='image/jpeg' length='58530'/>
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									<title><![CDATA[Power supply IC combines automotive qualification with very low quiescent current]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916965&news_id=222916965&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916965&news_id=222916965&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/allegro-microsystems-a8580.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The new A8580 from Allegro MicroSystems Europe is a buck regulator power-supply IC that offers a high degree of flexibility in input voltage (4 to 40 V), switching frequency (250 kHz to 2.4 MHz), and output current (up to 2.5 A).]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 17:04:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 17:04:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 17:04:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 17:04:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/allegro-microsystems-a8580.jpg' type='image/jpeg' length='715398'/>
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									<title><![CDATA[USB 2.0 Hub Controller adds battery charging to simplify charging and communications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916960&news_id=222916960&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916960&news_id=222916960&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-22-eete-nf-renesas.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Renesas Electronics has developed a USB 2.0 hub controller chip that supports simultaneous USB communication and charging of portable devices such as smartphones and tablet PCs via a single USB connector.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 12:41:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 12:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 12:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 12:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-22-eete-nf-renesas.jpg' type='image/jpeg' length='331466'/>
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									<title><![CDATA[420-W quarter brick DC-DC converters are PMBus compliant]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916966&news_id=222916966&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916966&news_id=222916966&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-22-eeteu-pb-mur261.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Murata Power Solutions has unveiled the UDQ series of isolated digitally controlled DC-DC converters which incorporate a 32-bit ARM7 processor.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 12:16:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 12:16:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 12:16:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 12:16:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-22-eeteu-pb-mur261.jpg' type='image/jpeg' length='1044635'/>
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									<title><![CDATA[Microsemi begins shipping production-qualified SmartFusion2 SoC FPGAs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916959&news_id=222916959&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916959&news_id=222916959&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/electronic-design-pcb.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Microsemi Corporation has begun shipping production-qualified SmartFusion2 system-on-chip (SoC) field programmable gate arrays (FPGAs). ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 11:11:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 11:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 11:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 11:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/electronic-design-pcb.jpg' type='image/jpeg' length='152895'/>
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									<title><![CDATA[Market researcher sees Samsung and Osram in price war]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916957&news_id=222916957&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916957&news_id=222916957&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-down.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Taiwan-based market researcher LEDinside has observed a steep decline for LED bulbs in Germany and the United Kingdom. This decline is in line with the global trend, but not all vendors were hit equally. The market researcher already talks of a price war. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 10:34:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 10:34:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 10:34:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 10:34:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-down.jpg' type='image/jpeg' length='743206'/>
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									<title><![CDATA[EPC offers GaN power library online]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916958&news_id=222916958&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916958&news_id=222916958&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-22-eeteu-pb-library-pr-graphic-final.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A gallium nitride transistor library of educational material is a key new feature of Efficient Power Conversion Corporation's redesigned website - epc-co.com.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 10:32:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 10:32:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 10:32:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 10:32:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-22-eeteu-pb-library-pr-graphic-final.jpg' type='image/jpeg' length='175807'/>
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									<title><![CDATA[36-V digital potentiometers support wide signal swings and high power-supply voltages]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916967&news_id=222916967&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916967&news_id=222916967&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-22-eeteu-pb-microchip-8749571262.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Microchip Technology Inc., has introduced two new volatile, SPI digital potentiometers (digipots) which are the first to operate at 10, 12, 18, 24 and 36 volts, for systems requiring wide signal swing or high power-supply voltages.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 10:18:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 10:18:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 22 May 2013 10:18:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 23 May 2013 10:18:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-22-eeteu-pb-microchip-8749571262.jpg' type='image/jpeg' length='119126'/>
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									<title><![CDATA[Cockpit concept learns driver's habits]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916964&news_id=222916964&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916964&news_id=222916964&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/e-bee_img_01.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Automotive supplier Visteon Corp. has developed a cockpit concept that incorporates Artificial Intelligence (AI) techniques to deliver an enhanced driving experience: Machine learning algorithms, cognizant of the specific driver and the surrounding environment, are able to suggest a different route to or from work when there are traffic stalls on the regular way or adjusts cabin temperature based on the driver's preferences. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 09:50:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 09:50:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 09:50:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 09:50:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/e-bee_img_01.jpg' type='image/jpeg' length='2410650'/>
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									<title><![CDATA[Digital and analogue I/O modules have built-in web servers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916952&news_id=222916952&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916952&news_id=222916952&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-audon.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Audon Electronics' ControlByWeb family comprises a set of DIN rail mounting digital and analogue I/O modules with built-in web servers. This allows their remote monitoring and control across the Web or any other IP network using a standard web browser on a computer, tablet or smartphone. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 09:45:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 09:45:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 15:45:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 15:45:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-audon.jpg' type='image/jpeg' length='538460'/>
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									<title><![CDATA[Wifi board combines Arduino with Linux for easy M2M use]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916951&news_id=222916951&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916951&news_id=222916951&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-arduinoyu.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Arduino Yún is the first member of a new line of wifi products combining the power Linux with ease of use of Arduino. Yún means cloud in chinese language as the purpose of this board to make it simple to connect to complex web services directly from Arduino.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 09:35:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 09:35:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 15:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 15:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-arduinoyu.jpg' type='image/jpeg' length='126780'/>
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									<title><![CDATA[Ginsbury introduce Kyocera Super Wide View (SWV) TFTs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916945&news_id=222916945&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916945&news_id=222916945&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-ginsbury.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Specialist display distributor Ginsbury has introduced of a new family of Kyocera TFT LCD displays featuring Kyocera's innovative Super Wide View (SWV) technology. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 12:27:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 12:27:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-ginsbury.jpg' type='image/jpeg' length='642856'/>
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									<title><![CDATA[Requirements lifecycle management tool targets safety-critical FPGA and ASIC design]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916946&news_id=222916946&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916946&news_id=222916946&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-aldec.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Aldec's Spec-TRACER is a requirements lifecycle management solution for use in safety-critical industries in which rigorous certification standards exist; such as DO-254 for avionics, ISO 26262 for automotive, IEC 61508/61511 for industrial and IEC 61513 for nuclear. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 09:05:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 09:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 12:45:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 12:45:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-aldec.jpg' type='image/jpeg' length='67856'/>
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									<title><![CDATA[Large size displays for truck clearance]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916950&news_id=222916950&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916950&news_id=222916950&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-sieger.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Designed to streamline freight scheduling processes, the widely visible displays offered by Siebert ensure a smooth communication with truck drivers. In the simplest case the driver gets a sequence number on his arrival that appears on the display at the call together with the number of the station or point to go to. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 22 May 2013 09:05:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 22 May 2013 09:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 15:25:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 15:25:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-sieger.jpg' type='image/jpeg' length='2660350'/>
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									<title><![CDATA[OMAP5432 processor-based EVM boosts graphics capabilities for industrial applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916954&news_id=222916954&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916954&news_id=222916954&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-22-eeteu-pb-mt1508.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Texas Instruments Incorporated has introduced the company's OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications to help developers jumpstart their product designs.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 16:33:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 16:33:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 16:33:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 16:33:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-22-eeteu-pb-mt1508.jpg' type='image/jpeg' length='4233201'/>
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									<title><![CDATA[DMA reference design is released for Stratix V and PCIe Gen3 solutions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916953&news_id=222916953&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916953&news_id=222916953&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Altera Corporation's 28 nm Stratix V GX FPGAs have achieved inclusion on the latest PCI-SIG Integrators List for the PCI Express (PCIe) 3.0 specification (Gen3).]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 16:19:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 16:19:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 16:19:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 16:19:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[Automotive MCU benchmark takes energy efficiency into account]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916949&news_id=222916949&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916949&news_id=222916949&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/data-flow-code.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Today, cars are crammed with microprocessors, and many of them are not completely switched off when the driver parks and locks the vehicle. Instead, many remain "semi-active" in sleep mode - and over time, even ultra-low power processors discharge the battery. To gain a foundation for assessment of microprocessor power consumption, the Volkswagen and the Embedded Microprocessor Benchmark Consortium (EEMBC) group plan to jointly establish an energy-efficiency benchmark for microcontrollers. The results will help designers to make automotive control units more energy aware.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 14:52:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 14:52:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 14:52:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 14:52:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/data-flow-code.jpg' type='image/jpeg' length='212444'/>
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									<title><![CDATA[EnSilica partners Cross Border Technologies to boost sales growth in key European markets]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916948&news_id=222916948&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916948&news_id=222916948&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-cooperation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;EnSilica has partnered with Cross Border Technologies to accelerate the sales of EnSilica's IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 13:42:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 13:42:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 13:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 13:42:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-cooperation.jpg' type='image/jpeg' length='200563'/>
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									<title><![CDATA[Industry's first ultra-wideband Doherty amplifiers support broadband operation]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916947&news_id=222916947&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916947&news_id=222916947&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-21-eeteu-pb-nxp_blf888d_preview.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;NXP Semiconductors N.V. has introduced an ultra-wideband Doherty reference design using the BLF884P and BLF884PS &ndash; the industry&rsquo;s first wideband Doherty power amplifiers capable of broadband operation (470 to 806 MHz). ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 13:31:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 13:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 13:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 13:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-21-eeteu-pb-nxp_blf888d_preview.jpg' type='image/jpeg' length='114302'/>
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									<title><![CDATA[Graphics chip recognizes nearby pedestrians and bicycles]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916955&news_id=222916955&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916955&news_id=222916955&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/pr1049-fujitsu-triton.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Fujitsu Semiconductor Europe (FSEU) announced the development of MB86R24, the company's third-generation graphic SoCs for automotive applications. The device incorporates the Approaching Object Detection functionality-which notifies drivers of nearby people, bicycles and other objects-into the 360° Wraparound View System that allows drivers to check their entire surroundings in 3D from any angle.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 12:23:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 12:23:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 12:23:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 12:23:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/pr1049-fujitsu-triton.png' type='image/png' length='163001'/>
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									<title><![CDATA[EMS boom for medical industry says analyst]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916944&news_id=222916944&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916944&news_id=222916944&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-growth.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to handle the escalating volumes of electronic content in the medical industry says market analyst Frost & Sullivan. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 12:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 12:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 12:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 12:03:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-growth.jpg' type='image/jpeg' length='267133'/>
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									<title><![CDATA[Family of modules provides all-in-one LTE connectivity for M2M]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916943&news_id=222916943&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916943&news_id=222916943&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eete-nf-sequans.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;French 4G chipmaker Sequans Communications has introduced a new line of LTE modules with a complete RF front end and key interfaces in a single, compact package for M2M designs. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 11:54:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 11:54:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 11:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 11:54:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eete-nf-sequans.jpg' type='image/jpeg' length='31982'/>
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									<title><![CDATA[Gemalto teams with Encore Networks for mission critical M2M communications as US shifts to wireless]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916941&news_id=222916941&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916941&news_id=222916941&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-cooperation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;European smartcard specialist Gemalto has teamed up with US machine-to-machine (M2M) router supplier Encore Networks to provide reliable wireless links for mission critical applications as operators pull out of wired communications.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 11:47:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 11:47:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 11:47:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 11:47:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-cooperation.jpg' type='image/jpeg' length='200563'/>
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									<title><![CDATA[Bluetooth low energy chip doubles the battery life of app-enabled peripherals]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916939&news_id=222916939&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916939&news_id=222916939&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eete-nf-dialog.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Dialog Semiconductor has launched what it claims is the industry's lowest power Bluetooth system-on-chip.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 11:25:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 11:25:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 11:25:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 11:25:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eete-nf-dialog.jpg' type='image/png' length='16256'/>
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									<title><![CDATA[Solar industry capital spending hits seven-year low in 2013 but upturn is on the cards]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916938&news_id=222916938&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916938&news_id=222916938&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-down.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Although global capital spending during 2013 in the photovoltaics supply chain is expected to fall to its lowest level since 2006 market analyst IHS predicts the downturn in investment has hit bottom and that purchases of equipment may soon rebound.  ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 11:14:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 11:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 11:14:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 11:14:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-down.jpg' type='image/jpeg' length='743206'/>
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									<title><![CDATA[Apple's overseas tax evasion stirs debate over US tax code]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916937&news_id=222916937&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916937&news_id=222916937&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-law.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;According to the Wall Street Journal, Senate investigators found that Apple Inc paid no corporate income tax to any national government on tens of billions of dollars in overseas income over the past four years. This revelation fuels the debate over whether the U.S. tax code needs an overhaul.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 10:52:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 10:52:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 10:52:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 10:52:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-law.jpg' type='image/jpeg' length='134547'/>
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									<title><![CDATA[Could Intel enable USD200 Ultrabook?]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916936&news_id=222916936&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916936&news_id=222916936&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the traditional PC apparently heading the way of the abacus, market research firm IHS is proposing a radical course of action: that Intel Corp. cut the price of chips supplied to PC makers to enable ultrathin touch-screen PCs that appeal to consumers and cost just USD200.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 10:34:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 10:34:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 10:34:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 10:34:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis.jpg' type='image/jpeg' length='191112'/>
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									<title><![CDATA[Driver chip features primary-side peak-current mode for high-brightness LEDs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916956&news_id=222916956&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916956&news_id=222916956&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/zsls7031_648x271.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ZMDI (Dresden, Germany) has introduced the ZSLS7031, a primary-side peak-current mode LED driver for high-brightness LED lighting. This product is suited for many consumer, commercial and industrial lighting applications, particularly where electrical isolation is required.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 10:12:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 10:12:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 10:12:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 10:12:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/zsls7031_648x271.jpg' type='image/jpeg' length='175084'/>
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									<title><![CDATA[Bluetooth SoC only draws 3.8mA at transmission and reception]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916940&news_id=222916940&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916940&news_id=222916940&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-dialog.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With SmartBond, Dialog Semiconductor has released what the company claims to be the world's lowest power and smallest Bluetooth Smart System-on-Chip (SoC), which more than doubles the battery life of an app-enabled smartphone accessory or computer peripheral in comparison to competing solutions on the market.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 10:06:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 10:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 10:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 10:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-dialog.jpg' type='image/jpeg' length='1314685'/>
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									<title><![CDATA[Places2Be project aims to boost European leadership around FD-SOI]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916935&news_id=222916935&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916935&news_id=222916935&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/silicon-wafer-held.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A group of 19 leading European companies and academic institutions have launched Places2Be, a 3-year, &euro;360 million advanced-technology pilot-line project to support the industrialization of Fully-Depleted Silicon-On-Insulator (FD-SOI) microelectronics technology.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 09:51:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 09:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 21 May 2013 09:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 22 May 2013 09:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/silicon-wafer-held.jpg' type='image/jpeg' length='504808'/>
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									<title><![CDATA[Test card evaluates mobile device behaviour in extreme temperatures]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916923&news_id=222916923&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916923&news_id=222916923&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-comprion.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the increase of M2M (Machine to Machine) communication, mobile device requirements are increasing as well. Comprion's new test card helps confirm the proper functioning of mobile phones in extreme temperature zones, from the Arctic to the Sahara.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 09:30:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 09:30:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 16:30:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 16:30:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-21-eetimes-jh-comprion.jpg' type='image/jpeg' length='94778'/>
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									<title><![CDATA[Industrial USB camera delivers 2592x1944 pixels at 15fps in a 23x26.5x21.5mm casing]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916922&news_id=222916922&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916922&news_id=222916922&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-ids.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the XS, IDS is launching a generation of cameras that combines the convenient operation of a standard consumer camera, along with the versatility of a robust industrial camera. The 23x26.5x21.5mm unit weighs just 12 grams and can be integrated very easily into any system. Its magnesium housing makes it very robust.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 16:19:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 16:19:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-ids.jpg' type='image/jpeg' length='2058026'/>
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									<title><![CDATA[Printed, flexible and organic electronics will enjoy a solid growth over the next decade says IDTechEx]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916924&news_id=222916924&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916924&news_id=222916924&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;In its latest report on printed, flexible and organic electronics, IDTechEx expects the total market for these technologies to grow from USD16.04 billion in 2013 to USD76.79 billion in 2023, in effect showing a healthy 15% compounded annual growth rate over the next decade. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 21 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 21 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 16:49:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 16:49:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[UL-certified software streamlines development for consumer functional safety]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916932&news_id=222916932&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916932&news_id=222916932&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-ti.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;New UL-certified software packages from Texas Instruments are helping make designing functional safety consumer applications using C2000 real-time control microcontrollers (MCUs) easier and faster. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 15:23:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 15:23:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 15:23:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 15:23:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-ti.jpg' type='image/jpeg' length='45225'/>
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									<title><![CDATA[Floating surge stopper provides unlimited overvoltage protection]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916803&news_id=222916803&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916803&news_id=222916803&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-07-ltc4366.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Protecting sensitive electronic circuitry from voltage transients is an essential part of any system be it automotive, industrial, avionics or even battery-powered consumer applications.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 15:20:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 15:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 13:20:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 13:20:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-07-ltc4366.jpg' type='image/jpeg' length='21808'/>
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									<title><![CDATA[Obsolescence groups tackles long term supply and conflict minerals challenges]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916931&news_id=222916931&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916931&news_id=222916931&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-merger.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The increasing use of off the shelf commercial equipment and conflict minerals are two key risks facing designers of long term systems says the outgoing chairman of the UK's Component Obsolescence Group (COG).]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 15:13:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 15:13:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 15:13:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 15:13:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-merger.jpg' type='image/jpeg' length='132289'/>
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									<title><![CDATA[Cadence launches massively parallel timing tool to speed SoC design]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916930&news_id=222916930&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916930&news_id=222916930&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/design-cad.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems has launched a new static timing analysis and closure tool designed to run on passively parallel hardware and enable System-on-Chip (SoC) developers to speed timing closure and move chip designs to fabrication quickly.   ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 14:51:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 14:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 14:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 14:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/design-cad.jpg' type='image/jpeg' length='865007'/>
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									<title><![CDATA[Rugged SBC offers flexible I/O for data processing in compact displays]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916929&news_id=222916929&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916929&news_id=222916929&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-men.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;MEN Micro has launched a low power, rugged single board computer (SBC) with a 1.6GHz Atom processor that incorporates flexible I/O for demanding graphics environments.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 12:48:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 12:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 12:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 12:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-20-eete-nf-men.jpg' type='image/jpeg' length='162320'/>
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									<title><![CDATA[First 45nm embedded flash logic test chips sample]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916928&news_id=222916928&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916928&news_id=222916928&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/silicon-wafer-3d.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Samsung Electronics has sampled the first devices from its 45nm embedded flash (eFlash) logic process development which it claims is the industry's first.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 12:41:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 12:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 12:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 12:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/silicon-wafer-3d.jpg' type='image/jpeg' length='2437255'/>
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									<title><![CDATA[Wolfson to move integrated MEMS microphones to 8in wafers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916927&news_id=222916927&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916927&news_id=222916927&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/silicon-wafer-large.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Wolfson Microelectronics is integrating digital signal processing on the same die as its MEMS microphones and moving production to 8in (200mm) wafers in the first to make the move.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 12:29:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 12:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 20 May 2013 12:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 21 May 2013 12:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/silicon-wafer-large.jpg' type='image/jpeg' length='572690'/>
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									<title><![CDATA[MLCC types address automotive and industrial markets]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916933&news_id=222916933&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916933&news_id=222916933&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/20130516_02.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;TDK Corporation has expanded its portfolio of automotive-grade multi-layer ceramic capacitors (MLCCs) with new mid-voltage types featuring C0G temperature characteristics and rated voltages from 100 V to 630 V. Typical applications include EV/HEV inverters and DC/DC converters, resonance circuits for wireless power transmission or general-purpose power supplies. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 10:40:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 10:40:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:40:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:40:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/20130516_02.jpg' type='image/jpeg' length='184187'/>
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									<title><![CDATA[ZigBee single-chip solution connects smart lighting to infrastructure]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916934&news_id=222916934&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916934&news_id=222916934&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/14may13_cc2538_pr_low.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;To simplify the development of ZigBee wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Incorporated announced the availability of the CC2538 system-on-chip (SoC). The industry's most integrated ZigBee solution, the CC2538 is cost-efficient with an ARM  Cortex-M3 MCU, memory and hardware accelerators on one piece of silicon. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 10:20:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 10:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:20:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:20:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/14may13_cc2538_pr_low.jpg' type='image/jpeg' length='78306'/>
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									<title><![CDATA[Exploiting depth sensing for 3D interfaces and complex image analysis]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916661&news_id=222916661&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916661&news_id=222916661&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/hapticsbluetechnix-fig1.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Nowadays intelligent sensor networks have entered many application fields ranging from building and industrial automation to traffic management or medical applications. Intelligent sensors are able to process the sensor inputs on the sensor node and trigger actions autonomously. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Mon, 20 May 2013 09:21:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 20 May 2013 09:21:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:21:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:21:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/hapticsbluetechnix-fig1.jpg' type='image/jpeg' length='72701'/>
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									<title><![CDATA[Altera to integrate Enpirion power interfaces into its FPGAs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916921&news_id=222916921&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916921&news_id=222916921&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Altera is planning to develop IP blocks for its FPGAs optimized for the Enpirion power management devices following the $141m acquisition this week. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 12:35:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 12:35:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 12:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 12:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' type='image/jpeg' length='838746'/>
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									<title><![CDATA[Automation CAN group plans permanent interoperability test capability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916920&news_id=222916920&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916920&news_id=222916920&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eete-nf-canfd.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The group promoting the use of the CAN networking standard in automation is planning a permanent interoperability test capability following its first plugfest in Nuremberg, Germany.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 11:54:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 11:54:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 11:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 11:54:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eete-nf-canfd.jpg' type='image/jpeg' length='1702580'/>
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									<title><![CDATA[u-blox to develop 3G HSPA module based on Intel's XMM 6255 HSPA platform]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916918&news_id=222916918&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916918&news_id=222916918&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-ublox.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Swiss-based u-blox announced it is collaborating with Intel to bring a small, cost-effective 3G-only HSPA module to the market. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 10:06:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 10:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 10:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 10:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-ublox.jpg' type='image/jpeg' length='11663'/>
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									<title><![CDATA[High density optical fiber enables stress analysis over large areas]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916917&news_id=222916917&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916917&news_id=222916917&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-jonson.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The ability to measure multiple sensing points over large intricate surfaces can be a difficult task. Traditionally engineers have used electrical strain gauges to monitor many points over a structure such as an aircraft wing or large composite component. However applying many individual gauges is both time consuming and adds significant weight to the structure in the form of cabling.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 09:44:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 09:44:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 09:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 09:44:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-17-eetimes-jh-jonson.jpg' type='image/jpeg' length='8366'/>
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									<title><![CDATA[Opening up new user-interaction scenarios with Time-of-Flight measurements]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916660&news_id=222916660&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916660&news_id=222916660&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/haptics-stmicro-fig3.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;STMicroelectronics recently unveiled an all-in-one module embedding both a wide dynamic ambient light sensor and a robust ranging sensor along with an infra-red light emitter. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 09:16:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 09:16:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:16:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:16:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/haptics-stmicro-fig3.jpg' type='image/jpeg' length='70784'/>
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									<title><![CDATA[Goepel electronic initiates Cooperation Network with EMS companies]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916915&news_id=222916915&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916915&news_id=222916915&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-strategy.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Goepel electronic has initiated a comprehensive cooperation network with contract manufacturers, the EMS Partner Program, as a global alliance program focused on joint activities for the knowledge transfer of test methods and strategies.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 09:11:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 09:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 16:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 16:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-strategy.jpg' type='image/jpeg' length='446483'/>
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									<title><![CDATA[8.5x8.5x5.91mm CMOS camera module features 8 megapixels]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916914&news_id=222916914&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916914&news_id=222916914&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-suyin.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Suyin Optronics' CM 8013 AF05 OV01 miniaturized camera module features a maximum resolution of 8 megapixels in a 8.5x8.5x5.91mm footprint, it also combines autofocus capabilities with a high-performance lens consisting of five plastic elements for sharp imaging.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 08:07:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 08:07:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 15:57:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 15:57:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-suyin.jpg' type='image/jpeg' length='363662'/>
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									<title><![CDATA[The number of charging stations for electrical vehicles is expected to soar by 2020, study says]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916916&news_id=222916916&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916916&news_id=222916916&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/car-electric-connector.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The number of electric vehicle charging stations is set to soar globally by 2020, supporting a shift in driving away from traditional petrol and diesel-fuelled vehicles, says a report from market research company IHS. The market watchers strongly advocate a unified charging system. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Fri, 17 May 2013 00:00:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 17 May 2013 00:00:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 17 May 2013 00:00:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 18 May 2013 00:00:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/car-electric-connector.jpg' type='image/jpeg' length='466080'/>
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									<title><![CDATA[High-precision dual Op Amp operates from -55 up to +225°C]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916913&news_id=222916913&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916913&news_id=222916913&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-cissoid.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;CISSOID's high-precision dual Op Amp OPAL remains operational at temperatures from -55°C up to +225°C and is specifically designed to meet the toughest environmental constraints of sensors in automotive, industrial and general high reliability applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 12:24:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 12:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 12:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 12:24:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-cissoid.jpg' type='image/jpeg' length='752490'/>
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									<title><![CDATA[In automotive lighting, LEDs still lacks of horsepower, study says]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916911&news_id=222916911&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916911&news_id=222916911&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Despite the impression some LED manufacturers and carmakers are trying to create, in automotive lighting LED is still far from displacing conventional lighting technologies. A market study from Marketsandmarkets provides insights into a market segment that moves ahead only slowly.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:58:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:58:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:58:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:58:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[Web JTAG tool supports innovative fast board failure test]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916909&news_id=222916909&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916909&news_id=222916909&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eete-nf-jtag.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A suite of JTAG tools that is downloadable from the Web is supporting an innovative technique to quickly check the failure of components on a board.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eete-nf-jtag.jpg' type='image/jpeg' length='1790586'/>
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									<title><![CDATA[Ultra-low-power SoC supports world's smallest Bluetooth location stickers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916910&news_id=222916910&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916910&news_id=222916910&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-nordic.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Nordic Semiconductor ASA's nRF51822 SoC has been specified into the world's smallest Bluetooth low energy coin-sized location stickers.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-nordic.jpg' type='image/jpeg' length='15184'/>
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									<title><![CDATA[High temperature multilayer stacked capacitors offer high temperature reliability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916912&news_id=222916912&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916912&news_id=222916912&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-16-eeteu-pb-kemet.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;KEMET has introduced the company's new KEMET Power Solutions High Temperature (KPS HT) multilayer stacked capacitors.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 11:10:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 11:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 11:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 11:10:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-16-eeteu-pb-kemet.jpg' type='image/jpeg' length='85485'/>
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									<title><![CDATA[Imec and Renesas collaborate on ultra-low power short range radios]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916908&news_id=222916908&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916908&news_id=222916908&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Imec and Renesas Electronics have entered into a new strategic research collaboration at Holst Centre to enhance ultra-low power (ULP) wireless technologies for short range communication, targeting sensor networks for automotive and industrial purposes.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 10:54:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 10:54:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:54:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[Triplexer LC filter supports PMR communications between emergency services]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916907&news_id=222916907&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916907&news_id=222916907&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-microtek.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;New from RF and microwave specialist Link Microtek is the LF9287 triplexer LC filter, which has been designed to support private mobile radio (PMR) real-time communications between different branches of the emergency services.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 10:46:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 10:46:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:46:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:46:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-microtek.jpg' type='image/jpeg' length='657166'/>
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									<title><![CDATA[European Semiconductor Distribution Market shows sequential recovery in Q1/CY13]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916906&news_id=222916906&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916906&news_id=222916906&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The European Semiconductor Distribution Market currently looks at a sequential recovery. Although Q1/CY13 ended 5% lower than the comparable quarter last year, the sequential development is extremely promising  plus 16% compared to Q4/CY12. Q1 ended with sales of 1.48 Billion Euro, according to DMASS (Distributors' and Manufacturers' Association of Semiconductor Specialists).]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 10:43:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 10:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 10:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 10:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis.jpg' type='image/jpeg' length='191112'/>
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									<title><![CDATA[Omron appoints TME to strengthen presence in Eastern Europe]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916905&news_id=222916905&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916905&news_id=222916905&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Omron Electronic Components bv has appointed leading Eastern Europe catalog supplier TME as franchised distributor for Poland, the Czech Republic, Slovakia, Hungary and Romania.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:45:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:45:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 16 May 2013 09:45:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 17 May 2013 09:45:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[LVDT/RVDT signal conditioner with analog and RS485 outputs]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916900&news_id=222916900&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916900&news_id=222916900&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-macrosensors.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Macro Sensors's Eazy-Cal LVC 4000 signal conditioner features analogue (4-20mA or user selectable voltage) and RS-485 outputs, it is compatible with most LVDT and RVDT linear position sensors, including half bridge, and can communicates digitally with up to 16 devices simultaneously. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:37:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:37:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:37:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:37:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-macrosensors.jpg' type='image/jpeg' length='58886'/>
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									<title><![CDATA['The Economics of Automatic Testing' now in electronic versions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916892&news_id=222916892&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916892&news_id=222916892&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-ebook.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Brendan Davis' book The Economics of Automatic Testing, originally published by McGraw-Hill in 1982, and followed by a highly expanded second edition in 1994, is now available in e-book versions.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:15:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:15:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 11:15:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 11:15:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-ebook.jpg' type='image/jpeg' length='71935'/>
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									<title><![CDATA[USB data acquisition unit offers four differential inputs for thermocouples]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916902&news_id=222916902&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916902&news_id=222916902&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-datatranslation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The DT9828E thermocouple measurement module from Data Translation is designed for users looking for a very cost-effective module, with all the basic features for temperature measurements and analyses without galvanic isolation and four instead of eight differential inputs for thermocouples. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:14:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:44:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-datatranslation.jpg' type='image/jpeg' length='1953969'/>
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									<title><![CDATA[Avnet Supply Chain Solutions launches RaBET Tool in Europe]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916899&news_id=222916899&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916899&news_id=222916899&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-avnet.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Avnet Supply Chain Solutions has launched the Rapid Benefit Estimation Tool (RaBET) for European customers looking to reduce their supply chain costs. This free, supply chain diagnostic tool enables customers to model the potential benefits and savings they will experience by adding Avnet as their supply chain partner. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:08:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:28:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-avnet.jpg' type='image/jpeg' length='42191'/>
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									<title><![CDATA[Miniature Rogowski coils enable accurate non-contact current measurement]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916890&news_id=222916890&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916890&news_id=222916890&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-pem.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Power Electronic Measurements' latest generation of Rogowski coils for non-contact current measurement, is designed specifically for monitoring today's most advanced power systems and semiconductors.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 16 May 2013 09:06:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 16 May 2013 09:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-pem.jpg' type='image/jpeg' length='1181192'/>
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									<title><![CDATA[3D motion development kit targets wireless orientation tracking]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916903&news_id=222916903&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916903&news_id=222916903&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-xsens.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Xsens has released a new development kit specifically for system integrators with a need for wireless orientation tracking, the MTw, suitable in markets which require wireless communication, like training and simulation, pedestrian navigation, test and measurement and robotics.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 17:48:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 17:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-16-eetimes-jh-xsens.jpg' type='image/jpeg' length='2434397'/>
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									<title><![CDATA[sureCore receives £250K SMART Award to prototype its low power SRAM technology]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916901&news_id=222916901&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916901&news_id=222916901&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;sureCore Ltd has secured a Technology Strategy Board SMART award of £250K to help realise the company's low power SRAM technology in a leading edge next generation silicon process node. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 17:40:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 17:40:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 17:40:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 17:40:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[Amantys partners Fuji Electric to launch IGBT gate drivers for wind and solar markets]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916898&news_id=222916898&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916898&news_id=222916898&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/energy-renewable.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Amantys collaborates with Fuji Electric to introduce Amantys Power Insight enabled gate drivers for the growing market for PrimePACK compatible IGBT modules.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 12:14:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 12:14:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 12:14:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 12:14:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/energy-renewable.jpg' type='image/jpeg' length='54877'/>
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									<title><![CDATA[Cambridge Nanotherm starts mass manufacturing of thermal management substrate]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916897&news_id=222916897&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916897&news_id=222916897&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-15-eeteu-pb-led_exploded_nobg.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;UK-based electronics thermal management innovator Cambridge Nanotherm plans to build the company&rsquo;s first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB).]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 12:04:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 12:04:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 12:04:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 12:04:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-15-eeteu-pb-led_exploded_nobg.png' type='image/png' length='416082'/>
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									<title><![CDATA[Redux Labs spins out from HiWave to develop new haptics and embedded audio]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916894&news_id=222916894&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916894&news_id=222916894&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-redux.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Led by HiWave's former CEO and CTO, James Lewis and Chris Travis, start-up Redux Labs has been spun out to advance its Surface Sensation technology for third generation haptic and embedded audio technology. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 11:47:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 11:47:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 11:47:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 11:47:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-redux.jpg' type='image/jpeg' length='160439'/>
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									<title><![CDATA[Heatsink housings avoid LEDs overheating]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916889&news_id=222916889&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916889&news_id=222916889&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-fischer.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Fischer Elektronik has expanded its product range of heat discharge housings by adding an additional housing series, the G LED range of U-shaped housing profiles, which are open on one side with integrated guide grooves to take LED line modules and slot-in cover plates or plexiglass discs.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:53:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-fischer.jpg' type='image/jpeg' length='773989'/>
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									<title><![CDATA[New generation of thermal sensor arrays overcome the limitations in single-element sensors]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916891&news_id=222916891&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916891&news_id=222916891&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/power-switch-button.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ULIS is concluding the first of two phases in the MIRTIC (Micro Retina Thermal Infrared) project with the launch of the Micro80P thermal sensor array.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/power-switch-button.jpg' type='image/jpeg' length='184397'/>
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									<title><![CDATA[Freeform packaging technology flexibly encapsulates semiconductor sensors or MEMS]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916887&news_id=222916887&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916887&news_id=222916887&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-sencio.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Independent package development and assembly specialists Sencio BV is bringing an extra dimension to sensor and MEMS encapsulation with the launch of its nCapsulate freeform packaging technology. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:38:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-sencio.jpg' type='image/jpeg' length='77861'/>
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									<title><![CDATA[850 and 940nm IR emitters and package-matched Silicon PIN photodiode target IR touch panels]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916886&news_id=222916886&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916886&news_id=222916886&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-vishay.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Vishay Intertechnology has introduced two high-speed 850 and 940nm infrared emitters and a package-matched high-speed silicon PIN photodiode with high radiant sensitivity from 780nm to 1050nm. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:33:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:33:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:33:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:33:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-vishay.jpg' type='image/jpeg' length='966283'/>
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									<title><![CDATA[EU antidumping duties could block Chinese modules out of the European Market]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916884&news_id=222916884&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916884&news_id=222916884&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Average pricing for Chinese-manufactured photovoltaic (PV) solar modules could surge by 45 percent in June, cutting some solar project IRRs to below 7 percent and further dampen demand in Europe as a result of the preliminary antidumping duties imposed in the European Union, says market analysis firm IHS.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 10:22:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 10:22:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 10:22:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 10:22:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[VDSL chipset supports data rates of 200 Mbits]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916877&news_id=222916877&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916877&news_id=222916877&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-lantiq.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Lantiq has launched what the company claims to be the industry's most integrated and highest performance VDSL chipset family, the XWAY VRX300. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 09:27:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 09:27:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:27:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:27:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-lantiq.jpg' type='image/jpeg' length='842017'/>
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									<title><![CDATA[Critical factors in air-mouse system design]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916659&news_id=222916659&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916659&news_id=222916659&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-03-march/haptics-hillcrest-fig2.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Motion control is coming to Smart TVs in the form of in-air mice. MEMS sensors and sensor fusion algorithms provide the foundation for wireless, 3D cursor control, which bring exciting new interaction opportunities to the TV. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 09:13:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 09:13:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:13:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:13:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/haptics-hillcrest-fig2.png' type='image/png' length='31811'/>
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									<title><![CDATA[The OSPT Alliance and UK-Based ITSO join efforts on smart ticketing standardization]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916878&news_id=222916878&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916878&news_id=222916878&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The Open Standard for Public Transport (OSPT) Alliance and ITSO Ltd., the organization responsible for the UK national specification for smart ticketing, have agreed to participate as members in each other's organizations and to explore ways they can work together to promote the use of open security standards in public transit for smart ticketing and electronic fare collection systems. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 09:02:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 09:02:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:42:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[Altera acquires power technology innovator Enpirion]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916883&news_id=222916883&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916883&news_id=222916883&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/business-acquisition.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Altera Corporation has signed a definitive merger agreement to acquire Enpirion, Inc., the industry&rsquo;s leading provider of high-efficiency, integrated power conversion products known as PowerSoCs (power system-on-chip). ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 08:00:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 08:00:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 15 May 2013 08:00:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 16 May 2013 08:00:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-acquisition.jpg' type='image/jpeg' length='392863'/>
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									<title><![CDATA[Industry's first all SiC three-phase power module offers lower cost power conversion]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916882&news_id=222916882&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916882&news_id=222916882&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-15-eeteu-pb-crc030-1200v-50a-6-pack-module-pr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cree, Inc. has introduced the industry&rsquo;s first commercially available silicon carbide (SiC) six-pack power module in an industry standard 45 mm package. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 07:12:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 07:12:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 20:12:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 20:12:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-15-eeteu-pb-crc030-1200v-50a-6-pack-module-pr.jpg' type='image/jpeg' length='376105'/>
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									<title><![CDATA[Brake resistor passes salt water spray challenge]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916862&news_id=222916862&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916862&news_id=222916862&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-13-eeteu-pb-reo49.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;REO UK's BW155 range of braking resistors has been validated for corrosion resistance against salt mist and water spray as well as dust Ingress protection to IP65 by the Rail System Testing Laboratory at Hennigsdorf, Germany.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 06:24:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 06:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 20:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 20:24:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-13-eeteu-pb-reo49.jpg' type='image/jpeg' length='430230'/>
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									<title><![CDATA[In vivo tests show EnerChip batteries are biologically safe for all applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916875&news_id=222916875&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916875&news_id=222916875&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/energy-battery.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;At the PCIM Europe exhibition Cymbet Corporation has revealed successful results of in vivo biocompatibility feasibility studies that were conducted to evaluate the biological safety of the EnerChip Rechargeable Solid State Battery.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 15 May 2013 06:02:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 15 May 2013 06:02:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 13:02:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 13:02:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/energy-battery.jpg' type='image/jpeg' length='938550'/>
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									<title><![CDATA[Nokia claims best camera features with the newly launched Lumia 925]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916881&news_id=222916881&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916881&news_id=222916881&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-nokiajpg.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Introduced in a metal design, Nokia has unveiled the Nokia Lumia 925 as an upgrade to its Lumia 920, featuring the company's latest PureView camera innovation, new features and third party applications.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 15:42:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 15:42:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 15:42:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 15:42:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-nokiajpg.jpg' type='image/jpeg' length='43369'/>
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									<title><![CDATA[Altera buys power management chip specialist]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916880&news_id=222916880&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916880&news_id=222916880&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;FPGA designer Altera has signed a definitive merger agreement to acquire Enpirion which develops high-efficiency, integrated power conversion PowerSoCs (power system-on-chip) in a deal worth $141m.    ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 14:59:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 14:59:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:59:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:59:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-altera.jpg' type='image/jpeg' length='838746'/>
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									<title><![CDATA[element14 adds image and video capture with Raspberry Pi eye accessory]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916879&news_id=222916879&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916879&news_id=222916879&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-element14.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The eagerly anticipated Raspberry Pi camera board launched by element14 enables pictures and video to be taken with the Raspberry Pi which can be used for security and VoIP projects as well as image and video capture.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 14:48:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 14:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eetimes-jh-element14.jpg' type='image/jpeg' length='948217'/>
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									<title><![CDATA[ARM teams with LogMeIn to drive M2M in the cloud]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916876&news_id=222916876&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916876&news_id=222916876&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/cloud-computing.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Processor core designer ARM has teamed with US remote access specialist LogMeIn to simplify and accelerate commercial development on the Internet of Things (IoT). ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 14:19:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 14:19:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 14:19:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 14:19:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/cloud-computing.jpg' type='image/jpeg' length='57121'/>
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									<title><![CDATA[Force monitoring enables reliable manual press-insertion processes]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916872&news_id=222916872&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916872&news_id=222916872&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-burster.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The ForceMaster 9110 from burster enables continuous monitoring of force/time or force/displacement/time curves to ensure that even simple manual press-insertion processes are reliable. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:48:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-burster.jpg' type='image/jpeg' length='1747359'/>
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									<title><![CDATA[Dual-band Ethernet port adapter with external stub antenna]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916871&news_id=222916871&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916871&news_id=222916871&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-connectblue.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;connectBlue's Ethernet port adapter RWE251s features Wireless LAN (WLAN) dual-band functionality and an omnidirectional external stub antenna, making the unit suitable for use in both the 2.4GHz and the 5GHz ISM bands with no restrictions as to its position.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:23:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:23:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:23:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:23:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-connectblue.jpg' type='image/jpeg' length='1598076'/>
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									<title><![CDATA[Power Modules excel through high power density and reliability]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916870&news_id=222916870&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916870&news_id=222916870&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/ff600r12me4_b11_medium.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;At PCIM Europe 2013 in Nuremberg, Infineon launches EconoDUAL 3 IGBT modules, which are fully qualified according to automotive standards. The offering addresses demanding applications in commercial, construction or agricultural vehicles where extended reliability is a key. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:17:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:17:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/ff600r12me4_b11_medium.jpg' type='image/jpeg' length='216766'/>
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									<title><![CDATA[Configurable digital sensor output driver delivers stable 3.3V sensor supply]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916869&news_id=222916869&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916869&news_id=222916869&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-ichaus.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The universal digital output driver iC-DX3/DXC3 from iC-Haus enables compact sensors to be equipped with NPN, PNP, push-pull, and IO link-compatible output driver options. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:16:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:16:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:16:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:16:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-ichaus.jpg' type='image/jpeg' length='489014'/>
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									<title><![CDATA[AndersDX launches new range of commercial grade Android tablets scalable to 21.5]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916868&news_id=222916868&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916868&news_id=222916868&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-andersdx.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;AndersDX has released the iDISPLAY Tablets range of touch screen platforms, sized from 7 to 21.5 and operating on Android 4.0.4. OS, designed with intelligent features specifically created for commercial environments.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:05:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-andersdx.jpg' type='image/jpeg' length='543154'/>
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									<title><![CDATA[Rutronik joins the China Electronics Distributor Alliance]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916867&news_id=222916867&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916867&news_id=222916867&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/distributors-logistics.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Rutronik Elektronische Bauelemente GmbH has officially joined the China Electronics Distributor Alliance (CEDA) after approval by the CEDA executive board members. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 10:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 10:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 10:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 10:03:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/distributors-logistics.jpg' type='image/jpeg' length='184204'/>
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									<title><![CDATA[ETSI publishes first specification for Ultra Low Energy DECT aimed at the M2M market]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916866&news_id=222916866&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916866&news_id=222916866&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-etsi.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ETSI has published the first Technical Specification (TS 102 939-1) on DECT ULE (Ultra Low Energy), a low power consumption radio technology intended for home automation and other Machine-to-Machine (M2M) applications.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:53:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 09:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 09:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-etsi.jpg' type='image/jpeg' length='140895'/>
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									<title><![CDATA[Autoliv provides the "eyes" for driver assistance systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916865&news_id=222916865&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916865&news_id=222916865&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/a54d2e05cd90e387_org.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;All scenarios around automatic driving require a number of sophisticated sensors inside the cars. This scenario is what supplier Autoliv is aiming at with its Stereo Vision Sensing System (SVS) it rolls out these days. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:51:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 09:28:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/a54d2e05cd90e387_org.jpg' type='image/jpeg' length='876898'/>
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									<title><![CDATA[MEMS-based micro mirror laser projector can be integrated into cell phones]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916861&news_id=222916861&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916861&news_id=222916861&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-fraunhofer2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;For years, Fraunhofer IPMS has been working on scanning mirrors for light deflection in one and two dimensions. Alongside resonant scanners with constant sinusoidal movement, a quasi-static variation has also been available for a while, which serves to make linear movement or static orientation in a specified position possible.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:36:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:36:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:46:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:46:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-fraunhofer2.jpg' type='image/jpeg' length='6964184'/>
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									<title><![CDATA[Industry's smallest 18-Bit Successive Approximation Register ADC saves 70% board space]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916853&news_id=222916853&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916853&news_id=222916853&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-maxim.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Maxim Integrated Products has introduced the industry's smallest 12-pin, 18-bit successive approximation register (SAR) analog-to-digital converter (ADC). ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:30:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:30:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 15:30:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 15:30:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-14-eete-nf-maxim.jpg' type='image/jpeg' length='621603'/>
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									<title><![CDATA[Characterization tools reduce power by ten percent for mobile applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916864&news_id=222916864&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916864&news_id=222916864&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/design-flow-chart.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems has helped Yamaha Corporation to reduce power consumption for the company's mobile consumer chips with characterization tools that delivered a 10 percent reduction in dynamic power to the clock network required for Yamaha ASICs. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 14 May 2013 09:28:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 15 May 2013 09:28:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/design-flow-chart.jpg' type='image/jpeg' length='181892'/>
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									<title><![CDATA[Understanding onboard flash programming]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916860&news_id=222916860&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916860&news_id=222916860&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/electronic-components-pcb2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Firmware often is preprogrammed into flash memory devices prior to the printed-circuit board's (PCB) manufacture to maintain high throughput and avoid slowing the manufacturing beat rate. Yet there are advantages to programming the flash memory after it has been soldered to the PCB. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:17:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:17:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/electronic-components-pcb2.jpg' type='image/jpeg' length='814262'/>
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									<title><![CDATA[Shunt-based management system targets lithium-ion batteries]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916857&news_id=222916857&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916857&news_id=222916857&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-isabelle.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The "IB4" battery management system from Isabellenhütte is designed for four-cell lithium ion batteries with individual cell voltages of up to 5V, and was developed in cooperation with the company's Braunschweig-based development partner I+ME Actia.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 16:49:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 16:49:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-isabelle.jpg' type='image/jpeg' length='1953863'/>
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									<title><![CDATA[Dimming PC prospects initiate inventory reduction in the computer supply chain, notes IHS iSupply]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916859&news_id=222916859&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916859&news_id=222916859&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-down.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the outlook for the PC market growing increasingly uncertain because of rising consumer interest in smartphones and tablets, computer manufacturers and distributors are striving to keep their inventories to a minimum. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:09:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:09:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-down.jpg' type='image/jpeg' length='743206'/>
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									<title><![CDATA[Ismosys to represent Amulet Technologies throughout Europe]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916856&news_id=222916856&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916856&news_id=222916856&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-imosys.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Amulet Technologies, a provider of high-performance embedded graphical user interface (GUI) processors, modules and development tools, has appointed the Ismosys (International Sales, Marketing and Operations System) division of the Spectrum Electronics Group as its sales & marketing representative in all the key European territories.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:08:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 16:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 16:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-imosys.jpg' type='image/jpeg' length='136890'/>
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									<title><![CDATA[PCI Express protocol analyzer with interchangeable interposers for probing]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916855&news_id=222916855&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916855&news_id=222916855&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-teledyne.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Teledyne LeCroy has released its most cost-effective PCI Express protocol analyzer with interchangeable interposers for probing. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 09:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 09:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 16:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 16:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-teledyne.jpg' type='image/jpeg' length='847029'/>
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									<title><![CDATA[EBV Elektronik releases the 'SoCrates' board]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916858&news_id=222916858&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916858&news_id=222916858&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/design-cad.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Aimed at Altera's NewSoC families, the SoCrates' development board from EBV Elektronik simplifies the integration and design convergence towards FPGAs.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 14 May 2013 08:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 14 May 2013 08:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 17:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 17:05:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/design-cad.jpg' type='image/jpeg' length='865007'/>
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									<title><![CDATA[Advanced microcontroller combines floating point and low leakage technology]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916852&news_id=222916852&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916852&news_id=222916852&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-13-eeteu-pb-em129-1wglaunchpr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Energy Micro has begun shipping the company's most advanced microcontroller yet, the EFM32 Wonder Gecko, with devices and development kits available immediately. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 13:10:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 13:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 13:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 13:10:00 +0200]]></eventEndDate>
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									<title><![CDATA[First universal multicore debug IP delivered to PMC-Sierra]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916851&news_id=222916851&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916851&news_id=222916851&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;UK startup UltraSoC has delivered the first version of its universal multicore debug IP for PMC-Sierra's next generation of storage controllers. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 11:51:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 11:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 11:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 11:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[Rotary encoder offers 360º endless rotation]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916850&news_id=222916850&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916850&news_id=222916850&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-piher.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Piher's 360º version of the PT15 rotary encoder adds endless clockwise (CW or CCW) rotation to its already highly configurable mechanical and electrical specifications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 11:08:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 11:08:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 11:08:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 11:08:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-piher.jpg' type='image/jpeg' length='138721'/>
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									<title><![CDATA[J1-Series power modules feature compact 6-in-1 package for use in electric and hybrid vehicles]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916849&news_id=222916849&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916849&news_id=222916849&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mitsubishi.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mitsubishi Electric has announced the J1-Series power modules featuring a compact 6-in-1 package mainly for use in electric and hybrid vehicles. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:53:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:53:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:53:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:53:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mitsubishi.jpg' type='image/jpeg' length='615115'/>
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									<title><![CDATA[Sentrollers' taking over from People' as the majority population on the Internet, says GreenPeak Technologies]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916848&news_id=222916848&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916848&news_id=222916848&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-greenpeak.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;GreenPeak Technologies has released a white paper called Sentrollers and the Internet of Things where it defines Sentrollers as a new, all-encompassing term for sensors, actuators and controllers  the various devices that make up the new Internet of Things.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:43:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-greenpeak.jpg' type='image/jpeg' length='61285'/>
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									<title><![CDATA[Fast axis collimators can be optimally used with monolithically integrated reference surfaces]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916847&news_id=222916847&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916847&news_id=222916847&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-limo.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;LIMO's fast axis collimators can be optimally used with monolithically integrated reference surfaces or adjustment grooves for automatic adjustment.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:39:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:39:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-limo.jpg' type='image/jpeg' length='997851'/>
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									<title><![CDATA[Piezoelectric taxels made up of zinc oxide nanowires convert motion to electronic signals]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916846&news_id=222916846&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916846&news_id=222916846&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-taxels.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Using bundles of vertical zinc oxide nanowires, researchers of the Georgia Institute of Technology have fabricated arrays of piezotronic transistors capable of converting mechanical motion directly into electronic controlling signals.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:31:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-taxels.jpg' type='image/jpeg' length='47877'/>
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									<title><![CDATA[Wireless data logger connects to the cloud through Bluetooth LE]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916845&news_id=222916845&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916845&news_id=222916845&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-msr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;MSR Electronics has unveiled the universal MSR145 mini data logger, a wireless unit able to connect via Bluetooth Low Energy and a smartphone, a PC or the BLE receiver box, to the manufacturer's web-based "MSR SmartCloud" service for mobile data monitoring. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:29:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-msr.jpg' type='image/jpeg' length='592109'/>
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									<title><![CDATA[Magnetic sensor guides robotic vehicles along magnetic tracks]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916843&news_id=222916843&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916843&news_id=222916843&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-robotek.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Roboteq has released a new magnetic guide sensor capable of detecting and reporting the position of a magnetic field along its horizontal axis. The sensor is intended for line following robotic applications, using adhesive magnetic tape to form a track guide on the floor.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 10:13:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 10:13:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 10:13:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 10:13:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-robotek.jpg' type='image/jpeg' length='227090'/>
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									<title><![CDATA[Mouser launches dedicated MEMS technology site]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916842&news_id=222916842&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916842&news_id=222916842&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mouser.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mouser Electronics has launched a new technology site on Mouser.com, covering Microelectromechanical Systems (MEMS) Technology and designed to help design engineers find the latest in MEMS products by application.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 09:49:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 09:49:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 13 May 2013 09:49:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 14 May 2013 09:49:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eetimes-jh-mouser.jpg' type='image/jpeg' length='181446'/>
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									<title><![CDATA[Ultra-sensitive touch sensor operates through glass or steel sheet]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916834&news_id=222916834&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916834&news_id=222916834&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eete-nf-peratech.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Peratech has developed an ultra-sensitive sensor using its QTC nano-scale technology that it aims to license for domestic, industrial and automotive applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 09:35:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 09:35:00 +0200]]></date>
									<eventStartDate><![CDATA[Sat, 11 May 2013 18:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sun, 12 May 2013 18:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-13-eete-nf-peratech.jpg' type='image/jpeg' length='3229279'/>
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									<title><![CDATA[Identifying the best power supply for your test application]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916658&news_id=222916658&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916658&news_id=222916658&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo1LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/power-test-keithleyfig2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Most electrical engineers believe they have a good understanding of power supplies because they are relatively simple, single-function DC devices designed to output controlled voltages. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 09:11:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 09:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/power-test-keithleyfig2.jpg' type='image/jpeg' length='53305'/>
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									<title><![CDATA[Select resolution from 8 to 16 bits in a USB oscilloscope]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916841&news_id=222916841&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916841&news_id=222916841&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-04-15-edne-gp-pico.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Pico Technology has used reconfigurable ADC technology to offer a choice of resolutions from 8 to 16 bits in a single product; the company says this is the first time this facility has been popssible in an oscilloscope.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 13 May 2013 07:30:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 13 May 2013 07:30:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 15 Apr 2013 09:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 16 Apr 2013 09:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-04-15-edne-gp-pico.jpg' type='image/jpeg' length='2894806'/>
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									<title><![CDATA[How to do functional tests on I2C and SPI monitors with JTAG]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916840&news_id=222916840&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916840&news_id=222916840&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-edne-gp-asset_block-diagram.png' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;An eBook from Asset InterTech explains how the structural test methodology based on the IEEE 1149.1 boundary scan standard, known as JTAG, can apply functional tests to I2C and SPI system monitors during prototype board bring-up and later during production of the circuit board.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 13:51:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 13:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 13:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 13:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-edne-gp-asset_block-diagram.png' type='image/png' length='75982'/>
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									<title><![CDATA[High precision foil resistors]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916838&news_id=222916838&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916838&news_id=222916838&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-edne-gp-riedon.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Ultra-high precision resistances come in leaded and surface mount packages.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 13:34:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 13:34:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 13:34:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 13:34:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-edne-gp-riedon.jpg' type='image/jpeg' length='19164'/>
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									<title><![CDATA[Multi-connector range for CoaXPress applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916839&news_id=222916839&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916839&news_id=222916839&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-10-edne-gp-cambridgeconnectors_coaxpress_multiconnector.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cambridge Connectors's CXP-Multi-Connector is a precision 6-GHz 1.0/2.3 Stackable Multiport Connector system that meets the requirements of the newly JIIA ratified CoaXPress (CXP) specification for use in High Speed Image and Data Transmission.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 12:15:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 12:15:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 12:15:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 12:15:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-edne-gp-cambridgeconnectors_coaxpress_multiconnector.jpg' type='image/jpeg' length='123231'/>
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									<title><![CDATA[Varied data output formats expand digital temperature sensor options]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916837&news_id=222916837&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916837&news_id=222916837&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-10-edne-gp-meas_spec_digital-temperature-sensor-tsys02.3327.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Measurement Specialties has released a family of compact digital temperature sensors that easily integrates into a variety of industrial control, HVAC/R and heating/cooling systems. TSYS02 combines low power, high accuracy in an ultra-small TDFN8 package.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 10:29:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 10:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 10:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 10:29:00 +0200]]></eventEndDate>
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									<title><![CDATA[Solar PV wafer production to grow 19 percent in 2013, forecasts NPD Solarbuzz]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916833&news_id=222916833&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916833&news_id=222916833&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-analysis.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Solar photovoltaic wafer production is forecast to grow 19% in 2013, passing 30 GW and recovering to the 2011 level, according to the latest NPD Solarbuzz Polysilicon and Wafer Supply Chain Quarterly.  The market fell 15% in 2012.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 10:17:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 10:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 10:17:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 10:17:00 +0200]]></eventEndDate>
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									<title><![CDATA[Single-phase bridge rectifiers target smartphone chargers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916835&news_id=222916835&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916835&news_id=222916835&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-eeteu-pb-vish8696379045_d27c3ea6bf.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Vishay Intertechnology, Inc. has released four new 1 A miniature glass passivated single-phase bridge rectifiers in the surface-mount MBLS package featuring a low typical height of 1.4 mm.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:39:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:39:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 09:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 09:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-eeteu-pb-vish8696379045_d27c3ea6bf.jpg' type='image/jpeg' length='668044'/>
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									<title><![CDATA[Bosch tests automatic driving on the Autobahn]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916836&news_id=222916836&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916836&news_id=222916836&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/1-cc-19152.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;If you happen to see a driver on the German Autobahn these days with no hands at the wheel, don't panic: Automotive electronics supplier Bosch is currently conducting extensive tests of automated vehicles on public roads in Germany. The purpose of these tests is assessing and further improving the technology for automatic driving in everyday driving situations.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:38:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 09:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 09:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/1-cc-19152.jpg' type='image/jpeg' length='1192272'/>
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									<title><![CDATA[Swindon Silicon Systems signs technology partnership deal with ZPower]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916832&news_id=222916832&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916832&news_id=222916832&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-10-eeteu-pb-agzn-cell-zinc-air-cells.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ZPower turns to Swindon for power management solution that allows hearing aid manufacturers to use silver-zinc batteries without modifying their existing DSP systems.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:27:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:27:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 09:27:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 09:27:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-10-eeteu-pb-agzn-cell-zinc-air-cells.jpg' type='image/jpeg' length='69448'/>
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									<title><![CDATA[Space-grade 32Mb PROM memory has 20 years of garanteed life data retention]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916754&news_id=222916754&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916754&news_id=222916754&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-3dplus-prom.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;3D Plus has released a space-grade 32Mb PROM memory chip, the 3DPO32M08VS1419 One-Time-Programmable (OTP) Rom memory designed to store configuration bit streams for FPGA devices, such as Xilinx Virtex FPGAs. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 09:17:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 09:17:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:47:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:47:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-3dplus-prom.jpg' type='image/jpeg' length='60355'/>
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									<title><![CDATA[Growth of motion sensing IC market slowing]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916831&news_id=222916831&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916831&news_id=222916831&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The market for acceleration and yaw sensors grew 7 percent in 2012, the lowest percentage increase for motion-sensing semiconductors since 2005, according to market research firm IC Insights Inc.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 08:26:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 08:26:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 08:26:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 08:26:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-analysis2.jpg' type='image/jpeg' length='502898'/>
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									<title><![CDATA[IBM analytics solving cancer]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916830&news_id=222916830&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916830&news_id=222916830&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/medical-electronics.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;IBM's medical diagnostics analytics are not exactly a 'cure' for cancer, but they are aiming to lower the cost of a promising new remedy for destroying existing tumors.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Fri, 10 May 2013 08:16:00 +0200]]></pubDate>
									<date><![CDATA[Fri, 10 May 2013 08:16:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 10 May 2013 08:16:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 11 May 2013 08:16:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/medical-electronics.jpg' type='image/jpeg' length='204727'/>
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									<title><![CDATA[Students build electric racing car]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916829&news_id=222916829&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916829&news_id=222916829&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/rennbolide.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Students and scientists have developed an electrically driven racing car that goes from rest to 100 km/h in 3.6 seconds. That is only slightly slower than a McLaren Formula 1 car or a Porsche 911 Turbo. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 21:54:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 21:54:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 21:54:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 21:54:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/rennbolide.jpg' type='image/jpeg' length='30037'/>
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									<title><![CDATA[Digi-Key rounds out LED portfolio with Philips Lumileds distribution agreement]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916825&news_id=222916825&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916825&news_id=222916825&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/led-cluster.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Electronic components distributor Digi-Key Corp. announced the signing of a global distribution agreement with Philips Lumileds. The move expands the company's LED portfolio and strengthens their position as one of the largest distributors of LED products and suppliers.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 19:09:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 19:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 19:09:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 19:09:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/led-cluster.jpg' type='image/jpeg' length='106766'/>
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									<title><![CDATA[Switching matrix enables high-throughput test applications at high package density]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916823&news_id=222916823&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916823&news_id=222916823&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo5LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/40-568series_press_release.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;For test applications in the automotive and in the electronics industry in general, signal condition devices manufacturer Pickering Interfaces has developed two new switching modules - one based on solid-state switching elements and one based on electromechanical relays. Both enable very high package density in switching matrixes. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 12:59:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 12:59:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 9 May 2013 12:59:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 10 May 2013 12:59:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/40-568series_press_release.jpg' type='image/jpeg' length='390749'/>
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									<title><![CDATA[DC input LED drivers tolerate supply voltage fluctuations]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916824&news_id=222916824&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916824&news_id=222916824&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/df3ba5010b.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;GlacialPower has announced announce two new LED drivers for variable voltage LED lights, the GP-LD10-30C and GP-LD15-24C. As multi-use scenario LED drivers they fit for a wide range of implementations. Among others, they can be used on vessels or vehicles and with power sources with fluctuating voltage. They also are designed to work well with solar panels for LED illumination. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 12:11:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 12:11:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 9 May 2013 12:11:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 10 May 2013 12:11:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/df3ba5010b.jpg' type='image/jpeg' length='29639'/>
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									<title><![CDATA[Tridonic rolls Zhaga-compliant LED light engine]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916826&news_id=222916826&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916826&news_id=222916826&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/talexxmodule_stark_sle_gen2_les23_blue_r_pic-1.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the TALEXXengine STARK SLE, Tridonic introduces its first Zhaga-certified LED light engine. Another feature are the integrated clip terminals which significantly ease the installation. At the same time, the Austrian manufacturer enhanced its portfolio by a new product in its MINI line and introduced a specific light color class for food lighting in retail applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 11:10:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 11:10:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:10:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:10:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/talexxmodule_stark_sle_gen2_les23_blue_r_pic-1.jpg' type='image/jpeg' length='3451714'/>
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									<title><![CDATA[Power factor and solid state lighting  implications, complications and resolutions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916657&news_id=222916657&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916657&news_id=222916657&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/power-iwatt-led-fig2a.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Lighting comprises approximately 17.5% of global electricity consumption. As the world transitions from incandescent to solid state lighting (SSL) technology, utilities and government regulatory agencies worldwide are concerned that, as this large segment of the consumption base switches to SSL, it will increase infrastructure costs. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:09:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:09:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/power-iwatt-led-fig2a.jpg' type='image/jpeg' length='42642'/>
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									<title><![CDATA[Water- and dust-protected inertial measurement units support CAN and RS-422 interfaces]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916753&news_id=222916753&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916753&news_id=222916753&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-epson.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The M-G550-PC and the M-G550-PR inertial measurement units developed by Seiko Epson feature six degrees of freedom, including gyroscopic sensors on three axes and accelerometers on three directions, with a maximum sampling rate of 1,000 samples per second. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 09:09:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:39:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:39:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-04-30-eetimes-jh-epson.jpg' type='image/jpeg' length='574958'/>
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									<title><![CDATA[800-W programmable power supplies offer 2U rack mounting benefits]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916828&news_id=222916828&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916828&news_id=222916828&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjowLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-09-eeteu-pb-la1018-zplus_36_24-800w.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;TDK Corporation is making an extension to its TDK-Lambda Z+ Series of programmable DC power supplies with the addition of the higher power Z+800 range. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 07:38:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 07:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 9 May 2013 07:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 10 May 2013 07:38:00 +0200]]></eventEndDate>
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									<title><![CDATA[CMOS-based isolated gate drivers provide drop-in replacements for opto-drivers in industrial power systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916827&news_id=222916827&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916827&news_id=222916827&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-09-eeteu-pb-slab0200-si826x-press.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Silicon Labs has introduced the industry's first digital CMOS-based drop-in replacement solution for optocoupler-isolated gate drivers (opto-drivers).]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Thu, 9 May 2013 07:04:00 +0200]]></pubDate>
									<date><![CDATA[Thu, 9 May 2013 07:04:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 19:04:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 19:04:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-09-eeteu-pb-slab0200-si826x-press.jpg' type='image/jpeg' length='757279'/>
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									<title><![CDATA[First online development environment for the Internet of Things]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916815&news_id=222916815&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916815&news_id=222916815&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/data-binary-code.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Thingsquare has announced Thingsquare Code, to help connect products such as light bulbs, thermostats, and smart city systems to smartphone apps.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 13:27:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 13:27:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 13:27:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 13:27:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/data-binary-code.jpg' type='image/jpeg' length='49764'/>
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									<title><![CDATA[Qucell integrates Symmetricom SoftClock into 4G/LTE small cells]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916821&news_id=222916821&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916821&news_id=222916821&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/wireless-comms-network.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Symmetricom has announced the successful design integration of its SoftClocks into 4G/LTE + WiFi small cells offered by Qucell. This successful integration enables Qucell to join Symmetricom's SyncWorld® Ecosystem Program in the small cells category.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 13:18:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 13:18:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 13:18:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 13:18:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/wireless-comms-network.jpg' type='image/jpeg' length='331319'/>
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									<title><![CDATA[Full featured multi-port 40nm Gigabit PHY claims lowest power]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916810&news_id=222916810&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916810&news_id=222916810&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo3LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/opto-fibers.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Broadcom has developed a new generation of energy efficient PHY devices for power-intensive Ethernet network applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:41:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/opto-fibers.jpg' type='image/jpeg' length='255647'/>
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									<title><![CDATA[Movea brings its motion control technology for mobile and interactive TV to China, Taiwan and Japan]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916812&news_id=222916812&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916812&news_id=222916812&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/intellectual-property-web-art.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Movea has announced its collaboration with TorchSUN Technology Co., Ltd., to bring Movea's motion control solutions to leading technology companies in China, Taiwan and Japan. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:33:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:33:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:33:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:33:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/intellectual-property-web-art.jpg' type='image/jpeg' length='55455'/>
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									<title><![CDATA[Sub-GHz radio features extended temperature and frequency range]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916813&news_id=222916813&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916813&news_id=222916813&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/hmi-wireless-8315455-web-art.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Microsemi Corporation has announced the ZL70251 ultra low-power (ULP) radio frequency transceiver with an extended temperature operating range of -40 °C to 85 °C for short-range wireless sensor products used in industrial applications.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:24:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:24:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/hmi-wireless-8315455-web-art.jpg' type='image/jpeg' length='208882'/>
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									<title><![CDATA[Compact half-bridge gate driver family targets applications with a blocking voltage of 600 V]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916814&news_id=222916814&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916814&news_id=222916814&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-08-eeteu-pb-2edl_groupshot.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Infineon Technologies AG will be unveiling the 2EDL EiceDRIVER Compact half-bridge gate driver at PCIM 2013. The device is targeting applications with a blocking voltage of 600 V. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 11:06:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 11:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Wed, 8 May 2013 11:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Thu, 9 May 2013 11:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-08-eeteu-pb-2edl_groupshot.jpg' type='image/jpeg' length='176070'/>
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									<title><![CDATA[Low-power 32M CMOS SRAM in a 12x20mm TSOP-I package]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916750&news_id=222916750&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916750&news_id=222916750&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-alliance.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Alliance Memory has expanded its line of legacy low-power CMOS SRAMs with a new 32M IC (2M x 16 / 4M x 8 switchable), the company's highest density low-power device to date. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 09:00:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 09:00:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 12:00:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 12:00:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-alliance.jpg' type='image/jpeg' length='878342'/>
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									<title><![CDATA[DC/DC step-down micromodule regulator delivers high output accuracy]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916811&news_id=222916811&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916811&news_id=222916811&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-08-eeteu-pb-ltc4637.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Linear Technology Corporation has introduced a 20 A DC/DC step-down micromodule regulator with onboard precision differential remote sense amplifier.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:58:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:58:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 19:58:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 19:58:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-08-eeteu-pb-ltc4637.jpg' type='image/jpeg' length='909890'/>
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									<title><![CDATA[Simulator offers low-power verification productivity improvements by upto 30 percent]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916809&news_id=222916809&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916809&news_id=222916809&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/design-flow-chart.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems, Inc. has introduced a new version of Incisive Enterprise Simulator, with features that improve low-power verification productivity of complex SoCs by 30 percent. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:52:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:52:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:52:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:52:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/design-flow-chart.jpg' type='image/jpeg' length='181892'/>
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									<title><![CDATA[Large-scale grid integration of variable photovoltaic power offers new possibilities]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916820&news_id=222916820&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916820&news_id=222916820&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/energy-solar-panels.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The European energy supply landscape is shifting towards a more sustainable and renewables-based mix was one of the conclusions reached at a joint MetaPV and IEA PVPS Task 14 workshop held in Brussels on Monday 6 May 2013.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:48:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:48:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 15:48:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 15:48:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/energy-solar-panels.jpg' type='image/jpeg' length='155048'/>
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									<title><![CDATA[Safety capacitor range offers higher capacitance values]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916822&news_id=222916822&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916822&news_id=222916822&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-07-eeteu-pb-safety-certified-chips_large.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Syfer has added to the company's UL and TÜV approved range of SMD 250 Vac safety capacitors.  To give engineers more scope in their designs, the upper capacitance value has been extended to 33 nF. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:43:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:43:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-07-eeteu-pb-safety-certified-chips_large.jpg' type='image/jpeg' length='995236'/>
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									<title><![CDATA[DC power supply extends perfomance capabilities to high-voltage applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916818&news_id=222916818&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916818&news_id=222916818&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/2013-05-07-eeteu-pb-programmable_power_sorensen_sg_1000_vdc.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;AMETEK Programmable Power has extended the company's Sorensen SG Series high-power DC power supply line with the introduction of the new SG 1000V, which can supply up to 1,000V DC for applications such as testing photovoltaic inverters and electric vehicles.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Wed, 8 May 2013 07:06:00 +0200]]></pubDate>
									<date><![CDATA[Wed, 8 May 2013 07:06:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:06:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:06:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-07-eeteu-pb-programmable_power_sorensen_sg_1000_vdc.jpg' type='image/jpeg' length='555443'/>
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									<title><![CDATA[Panel mount indicator series resists shock and moisture]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916819&news_id=222916819&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916819&news_id=222916819&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/vcc040-cnx-722-series-tuffled-pr.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;VCC, a manufacturer of indication solutions for OEM and retrofit applications, including LED, neon, and incandescent indicators, and LED light pipes, has developed a new series of ruggedized panel mount indicators designed for use in a variety of harsh environments.  Featuring built-in LEDs visible both in direct sunlight and at wide angles, VCC's 22mm CNX 722 Series TuffLED indicators are resistant to shock, vibration, and moisture, and are RoHS compliant.  ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 16:58:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 16:58:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:58:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:58:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/vcc040-cnx-722-series-tuffled-pr.jpg' type='image/jpeg' length='575052'/>
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									<title><![CDATA[Factory-programmable linear Hall-effect sensor ICs for high-bandwidth applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916807&news_id=222916807&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916807&news_id=222916807&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/allegro-microsystems-a1318_a1319.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Two new factory one-time programmable automotive-grade linear Hall-effect sensor ICs eliminate the need for customers to optimise or program the devices for their finished sensor assemblies. The sensors are available from Allegro MicroSystems Europe. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 16:44:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 16:44:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 16:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 16:44:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/allegro-microsystems-a1318_a1319.jpg' type='image/jpeg' length='769916'/>
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									<title><![CDATA[Electric vehicle go-slow hits SiC power devices]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916802&news_id=222916802&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916802&news_id=222916802&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/car-body-electronics.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Wide-bandgap transistor and diode growth potential is obscured by automotive qualification, explains Yole Développement's Philippe Roussel, though PV inverter growth is a bright spot. ]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 13:05:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 13:05:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 13:05:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 13:05:00 +0200]]></eventEndDate>
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									<title><![CDATA[OpenCL development kit opens up FPGAs to software developers]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916801&news_id=222916801&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916801&news_id=222916801&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjozLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-cooperation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Altera has announced the broad availability of its Software Development Kit (SDK) for OpenCL and a board partner programme to simplify the development of highly parallel FPGA-based systems.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 12:51:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 12:51:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 12:51:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 12:51:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-cooperation.jpg' type='image/jpeg' length='200563'/>
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									<title><![CDATA[Cadence buys Evatronix for its IP business]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916800&news_id=222916800&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916800&news_id=222916800&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Cadence Design Systems is to buy the IP business of Polish EDA company Evatronix. ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 12:31:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 12:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 12:31:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 12:31:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[Free microcontroller software deal extended to OpenRTOS]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916799&news_id=222916799&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916799&news_id=222916799&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-picture-library/business-agreement.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Renesas Electronics Europe has teamed up with WITTENSTEIN High Integrity Systems to extend its offering of &euro;20,000 of software for its 32bit RX MCU microcontroller family ]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 12:19:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 12:19:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 12:19:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 12:19:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/business-agreement.jpg' type='image/jpeg' length='318508'/>
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									<title><![CDATA[TO 247-4 pin package for CoolMOS MOSFETs improves efficiencies in hard switching topologies]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916804&news_id=222916804&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916804&news_id=222916804&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNywibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-07-eeteu-pb-to-247-4-c7.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Infineon Technologies AG has introduced a TO 247-4 pin package for the company's CoolMOS C7 MOSFETs. The added fourth pin acts as a Kelvin source to effectively reduce the parasitic inductance of the source lead of the power MOSFET.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:57:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:57:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 09:57:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 09:57:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-07-eeteu-pb-to-247-4-c7.jpg' type='image/jpeg' length='408017'/>
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									<title><![CDATA[Automotive 3-phase power module enables higher torque systems for lower fuel consumption]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916805&news_id=222916805&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916805&news_id=222916805&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/ftc03v455a_6x6.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Automotive engineers are constantly looking for ways to reduce fuel consumption and lower CO2 emissions while at the same time lowering overall system costs. To help designers meet these challenges, Fairchild Semiconductor developed the FTC03V455A1, a 3-Phase, Variable Speed Drive Automotive Power Module.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:56:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:56:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 15:56:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 15:56:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/ftc03v455a_6x6.jpg' type='image/jpeg' length='896235'/>
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									<title><![CDATA[Citizen, MechaTronix launch joint LED cooling solutions]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916796&news_id=222916796&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916796&news_id=222916796&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/lpf8050_zhc_citizen_zhaga_led_pin_fin_heat_sink_family.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;With the raising demand for standard and validated cooling solutions, MechaTronix has recently launched a full series of passive and active LED cooling solutions for the latest generation Citizen CITILED COB's]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:38:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 13:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 13:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/lpf8050_zhc_citizen_zhaga_led_pin_fin_heat_sink_family.jpg' type='image/gif' length='22548'/>
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									<title><![CDATA[Power-One enters into patent license agreement with Microchip]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916797&news_id=222916797&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916797&news_id=222916797&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-agreement-ip.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Power-One, Inc., a leading global manufacturer of renewable energy and energy-efficient power conversion and management solutions, has entered into a non-exclusive, worldwide, Field of Use agreement with Microchip Technology Inc. for Digital Power Technology (DPT) patents from Power-One.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:35:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:35:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 09:35:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 09:35:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/business-agreement-ip.jpg' type='image/jpeg' length='107650'/>
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									<title><![CDATA[PCIe accelerator card targets enterprise servers and storage applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916747&news_id=222916747&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916747&news_id=222916747&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo0LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-micron.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Designed using Micron's XPERT architecture for improved performance and reliability, the P420m PCIe all-flash I/O accelerator combines consistent performance with the inherent power efficiency of an all-flash system to deliver improved economics for enterprise data centers.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:31:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:31:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 11:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 11:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-micron.jpg' type='image/png' length='739804'/>
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									<title><![CDATA[230V AC axial fan is temperature-controlled]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916758&news_id=222916758&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916758&news_id=222916758&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-evg.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;EVG distributes a temperature-controlled 230V AC axial fan measuring 119x119x38mm. Designed with an aluminium housing and impellers made of plastic according to UL 94 V-0, the unit features tinned leads, 280mm long. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:20:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:20:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 2 May 2013 16:20:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 3 May 2013 16:20:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-02-eetimes-jh-evg.jpg' type='image/jpeg' length='288088'/>
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									<title><![CDATA[Intelligent diagnostics maximize factory-floor up-times]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916656&news_id=222916656&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916656&news_id=222916656&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-03-march/power-infineon-fig1-factory-automation.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;More than often it is common that when technical equipment fails, finding the root cause of the failure consumes significantly more time than actually fixing the problem. ]]></description>
									<category><![CDATA[Feature Articles]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Thu, 25 Apr 2013 11:03:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Fri, 26 Apr 2013 11:03:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-03-march/power-infineon-fig1-factory-automation.jpg' type='image/jpeg' length='4060861'/>
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									<title><![CDATA[M2M data management solution targets multiply-connected embedded systems]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916771&news_id=222916771&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916771&news_id=222916771&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxMiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/01-picture-library/design-flow-chart.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;ITTIA has released a Machine-to-Machine (M2M) data management solution based on its ITTIA DB SQL peer-to-peer replication technology, enabling embedded systems to efficiently and reliably manage local data that is transparently shared with other systems. ]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 09:03:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 10:43:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 10:43:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-picture-library/design-flow-chart.jpg' type='image/jpeg' length='181892'/>
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									<title><![CDATA[Mouser signs global distribution deal with ADI]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916791&news_id=222916791&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916791&news_id=222916791&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-06-eeteu-pb-adismall.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Mouser Electronics, Inc. has entered into a worldwide distribution agreement with Analog Devices, Inc. that covers Analog Devices' complete product portfolio, including data converters, amplifiers, MEMS, DSPs, RF and power management ICs and associated development tools.]]></description>
									<category><![CDATA[Business News]]></category>
									<pubDate><![CDATA[Tue, 7 May 2013 07:38:00 +0200]]></pubDate>
									<date><![CDATA[Tue, 7 May 2013 07:38:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 18:38:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 18:38:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/2013-05-06-eeteu-pb-adismall.jpg' type='image/jpeg' length='83555'/>
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									<title><![CDATA[Floating surge stopper provides unlimited overvoltage protection]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916792&news_id=222916792&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916792&news_id=222916792&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo4LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/01-edit-photos-uploads/2013/2013-05-may/2013-05-07-ltc4366.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Protecting sensitive electronic circuitry from voltage transients is an essential part of any system be it automotive, industrial, avionics or even battery-powered consumer applications. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 20:41:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 20:41:00 +0200]]></date>
									<eventStartDate><![CDATA[Tue, 7 May 2013 07:41:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Wed, 8 May 2013 07:41:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/01-edit-photos-uploads/2013/2013-05-may/2013-05-07-ltc4366.jpg' type='image/jpeg' length='21808'/>
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									<title><![CDATA[65-nm ARM Flash MCU controls electronic brake]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916794&news_id=222916794&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916794&news_id=222916794&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoyLCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/electronic-components-pcb2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Texas Instruments and automotive supplier Continental AG collaborate on the first 65 nm ARM Cortex safety microcontrollers with Flash technology in volume production. The Continental processor for advanced control in electronic braking systems (PACE) is the foundation for the Continental MK 100 family of electronic stability control (ESC) systems. This 65 nm Flash technology also serves as the foundation for TI's Hercules safety MCU open market products. ]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 18:29:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 18:29:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 17:29:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 17:29:00 +0200]]></eventEndDate>
									<enclosure url='http://www.electronics-eetimes.com//images/news_sync_images/electronic-components-pcb2.jpg' type='image/jpeg' length='814262'/>
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									<title><![CDATA[Operator service revenues over the next five years to top $1 trillion]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916793&news_id=222916793&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916793&news_id=222916793&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOSwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/antennas-web-art.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A new report from Juniper Research finds that the cumulative 4G LTE mobile broadband service revenues over the next five years will account for over $1 trillion, representing approximately 17% of the cumulative operator billed service revenue from all mobile services.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 12:55:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 12:55:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 12:55:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 12:55:00 +0200]]></eventEndDate>
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									<title><![CDATA[Top 20 Solar PV module suppliers capture 70 percent market share in first quarter of 2013 reports NPD Solarbuzz]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916775&news_id=222916775&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916775&news_id=222916775&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxOCwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/business-analysis2.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;The top 20 solar photovoltaic (PV) module suppliers accounted for about 70% of global PV shipments in Q1'13, according to the latest Module Tracker Quarterly report released by market analyst NPD Solarbuzz.]]></description>
									<category><![CDATA[Market News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 11:47:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 11:47:00 +0200]]></date>
									<eventStartDate><![CDATA[Fri, 3 May 2013 11:47:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Sat, 4 May 2013 11:47:00 +0200]]></eventEndDate>
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									<title><![CDATA[Superjunction MOSFET innovation brings the world's lowest RDS(on) to hard switching applications]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916795&news_id=222916795&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916795&news_id=222916795&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjoxNiwibWFzayI6IjYweDYwIiwianVzdF9yZXNpemUiOjJ9/images/news_sync_images/2013-05-06-eeteu-pb-650v_coolmos_c7_series.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;Infineon Technologies has expanded the company's High Voltage portfolio with CoolMOS C7, introducing a 650 V Superjunction MOSFET technology.]]></description>
									<category><![CDATA[New Products]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 11:44:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 11:44:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 11:44:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 11:44:00 +0200]]></eventEndDate>
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									<title><![CDATA[Better, cheaper OLED micro displays do away with color filter]]></title>
									<link><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916787&news_id=222916787&cmp_id=7]]></link>
									<guid><![CDATA[http://www.electronics-eetimes.com/en/News/full-news.html?id=222916787&news_id=222916787&cmp_id=7]]></guid>
									<description><![CDATA[<img class='rss_image' align='left' src='http://www.electronics-eetimes.com/imf/c/eyJtIjo2LCJtYXNrIjoiNjB4NjAiLCJqdXN0X3Jlc2l6ZSI6Mn0/images/news_sync_images/fraunhofer-oled-screen.jpg' height='60' style='margin-right:5px;margin-bottom:5px;'/>&nbsp;A research team of the Fraunhofer Research Institution for Organics, Materials and Electronic Devices (COMEDD) has developed a manufacturing process that dangles better and cheaper OLED microdisplays. The technology utilizes an innovative coating technology that makes color filters redundant.]]></description>
									<category><![CDATA[Technology News]]></category>
									<pubDate><![CDATA[Mon, 6 May 2013 11:24:00 +0200]]></pubDate>
									<date><![CDATA[Mon, 6 May 2013 11:24:00 +0200]]></date>
									<eventStartDate><![CDATA[Mon, 6 May 2013 11:24:00 +0200]]></eventStartDate>
									<eventEndDate><![CDATA[Tue, 7 May 2013 11:24:00 +0200]]></eventEndDate>
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