3-D IC standards needed within six months
February 01, 2012 // Rick Merritt
Standards for 3-D chip stacks need to be in place within six months to stay ahead of chips rolling out in 2013, said a Qualcomm executive driving some of the efforts.
We have less than a year to put the rest of the key standards in place, otherwise commercial pressures will push EDA and other companies to solve the problems themselves and want to own their solutions, said Riko Radojcic, a director of advanced technology engineering at Qualcomm, speaking in a panel discussion on the topic at DesignCon here.
I think we have a window of opportunity that of months, said Radojcic who chairs a board overseeing a set of 3-D IC standards efforts underway at the Silicon Integration Initiative Inc., (Si2), an industry standards group. Those of us who are impatient think we are already a year behind, he said.
The Si2 effort consists of three working groups officially kicked off last summer at the Design Automation Conference. The groups are expected to deliver by the end of this year standards for the first of three phases, said Sumit DasGupta, senior vice president of engineering at Si2.
The initial phase is defining formats for sharing design data on 2.5- and 3-D partitioning and floor planning including thermal and mechanical constraints and exclusion zones between chip layers. A second phase will create formats for sharing modeling information, and a third phase will describe formats and APIs needed to create full 3-D IC design flows, he said.
The Si2 group includes participants form Cadence, Intel, GlobalFoundries, Mentor Graphics and Qualcomm among others. Our goal is to deliver the first specs for review late in the second or third quarter, said DasGupta.All news
Belgium spin-off takes photonic IC design to the mainstream
September 16, 2014
Imec's investment arm Fidimec and the Flemish spin-off investment fund SOFI I are investing EUR 340k in Founded last June, ...
Tablets to provide growth over flat PC market
Android One debuts in India, ignites next 5 billion battle
ZF swallows TRW Automotive
Is rapid charging batteries really so damaging?
Canadian startup mutualizes iBeacon deployment costs
September 15, 2014
Bluetooth Smart-enabled applications crop up everyday, from personalized remote sensors to proximity detection for home automation, ...
U.S. foundry agrees to help expand China's MEMS ecosystem
Moore's law has no end in sight
OLED panel smashes luminous efficacy and lifetime records
- Flexible and Low Power Driving of Solenoid Coils
- How to Protect & Monetize Android Apps
- Power Modules: The New Super Power
- Flexible Performance for Network Security Appliances
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.