CEA-Leti promotes LETI-3S (Silicon Specialty Solutions) collaboration mode on 200mm and 300mm platforms
May 03, 2012 // Julien Happich
CEA-Leti now promotes a new collaboration mode for a wide range of industry oriented customers from start-ups to manufacturers. LETI-3S for Silicon Specialty Solutions is targeting start-ups, component integrators, fabless or fablite companies, equipment or consumable suppliers.
Other entities should be concerned such as foundries or research centers with a limited processes offer, micro and nanotechnologies companies who don't want low-volume activities, and high-value silicon wafers dealers.
3S addresses following main domains:
- - Deposition
- - Front Side/Back Side cleanings, wet etch and stripping
- - Lithography with dual side alignment capability. LETI-3S can provide generic masks but usually works on customer designs adapted to CEA-Leti lithography tools.
- - Etching
- - Implantation, epitaxy, diffusion
- - CMP, bonding, grinding, dicing
- - Advanced in-line metrology
LETI-3S is operated on the Minatec Campus in Grenoble on 24/7 200mm and 300mm technological platforms. Lower wafer sizes should be available thanks to an innovative holder technology. LETI-3S can provide substrates or work on customers wafers, pre-processed or not, through stringent contamination protocols. LETI-3S ensures a full traceability from process flow conception to products delivery.
Visit CEA-Leti at www.leti.fr/en/How-to-collaborate/Collaborating-with-Leti/Leti-3SAll news
Visteon concept marries data security and connectivity
October 21, 2014
Automotive supplier Visteon plans to extends its fame as a designer of unconventional, innovative car dashboards. At electronica, ...
Webinar covers ASIC design for MEMS
Utilities keen to own cellular networks
Spansion expands MCUs with IoT on its radar
European plastic electronics industry flexes its muscles
Graphene aerogels promise enhanced energy storage performance
October 21, 2014
Lawrence Livermore researchers have turned to graphene aerogel to develop an enhanced electrical energy storage solution ...
R&S demos 5G test setup
Global chip capex to rise 11% in 2014
"New" MEMS evolution coming, predicts Yole
- 5 Best Practices for Designing Flexible Test Stations
- Intelligent PLCs Expand the Internet of Things
- Solutions for Millimeter Wave Wireless Backhaul
- Enter Linduino
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Oscium is giving away three of its iMSO-204L dual analogue iOS oscilloscopes, worth USD400 each. Designed with native Lightning compatibility, the iMSO-204L transforms the iPad, iPhone, and iPod touch into an ultra-portable, two-channel oscilloscope.
Since Apple changed its connector, Oscium has been working to bring native compatibility to its customers. The third generation...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.