Agilent, Altair to do interoperability testing for LTE
February 14, 2011 // Colin Holland
Agilent Technologies Inc. and Altair Semiconductor are to conduct interoperability and validation testing using Altair's 4G LTE chipset in conjunction with the Agilent PXT wireless communications test set and N6070A-series signaling conformance test software.
"Having a prestigious test equipment vendor like Agilent on board for interoperability testing is of huge importance to Altair," said Eran Eshed, cofounder and VP of Marketing and Business Development at Altair Semiconductor. "Verifying and certifying leading-edge designs is always a challenge, and this collaboration ensures that the chipset technology and the testing solutions move forward together at an accelerated pace, allowing our products to be brought to market quickly and efficiently."
Altair's LTE chip portfolio includes the FourGee-3100 baseband and FourGee-6200 RFIC chipsets.
The FourGee-3100 is a 3GPP LTE baseband processor that supports LTE category 3 throughputs (100Mbps/50Mbps DL/UL respectively). The chip implements a 20-MHz MIMO receiver and is based on a proprietary, cutting-edge O²P software-defined radio processor. T
The FourGee-6200 is a multiband RF transceiver that supports any 3GPP LTE band in the range of 700 MHz to 2700 MHz. The chipset supports FDD as well as TDD versions of the LTE standard and, together with Altair's software stack, has been extensively interoperability-tested with leading infrastructure vendors in multiple-band and duplex configurations.
"Our work with Altair lends to our on-going interoperability testing with the PXT and validation of Agilent's conformance test solutions," said Guy Séné, vice president and general manager of Agilent's Microwave and Communications Division. "Altair's chipset will be used to further increase the capability of our LTE test platforms, expanding our design verification and conformance test capability into new operating bands."
In addition to interoperability testing, the Altair chipset will be used for validation of 3GPP test cases running on the Agilent N6070A-series Signaling Conformance Test solution.
Design win; IDT meets IKEA
April 24, 2015
Integrated Device Technology, Inc. (IDT) has disclosed that IKEA has chosen IDT’s wireless power transmitters to embed in ...
Eurotech to offload its cloud offering to iNebula
Electric vehicles: Driving range decides
Samsung details its flex display
3D-printing aerogels for energy storage
Gartner lowers 2015 chip market growth forecast
April 23, 2015
A mix of currency shifts, excess inventory and the end a PC upgrade cycle is set to slow growth in the global semiconductor ...
Hexagon, Xylon join forces for smart CT-based quality control systems
PSA, IBM tie Connected Car to the Internet of Things
Disposable sensor patch analyses golfers' swing
- Smart Capacitive Design Tips
- Wireless MCUs and IoT
- Battery Management System Tutorial
- Deciding if Automated Test is right for your Company
InterviewInfineon: CAN FD success goes at the expense of FlexRay
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay. ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, DecaWave is offering EETimes Europe's readers the chance to win two TREK1000 kits to evaluate its Ultra-Wideband (UWB) indoor location and communication DW1000 chip in different real-time location system topologies.
Worth €947, the kit allow designers to prove a concept within hours and have a prototype ready in days. Based on the two-way ranging scheme, the kit lets you test...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.