New Products
Analysis: Is the ST, NXP wireless JV the start of IDM break-up?
But it is likely not be the last. Creating fine-grained, fabless, niche-market champions has become the name of the semiconductor game.
But the move begs many questions about the way forward for European semiconductor companies and for integrated device manufacturers (IDMs) in general. We could be witnessing the next stage in the triumph of the fabless over the fabbed.
Some of those questions have already been raised by Joseph Borel, a former executive vice president in central research and development at ST, who recently sent a 12-page proposal to the French government calling for the consolidation of Infineon Technologies, NXP and ST into a European champion chip company (see March 18 story).
One can argue that Borel is old school. Borel's call for the creation of a champion that aggregates everything that moves in semiconductors in Europe and holds on tight to manufacturing and manufacturing R&D was criticized by analysts for overvaluing size and seeing economies of scale where they no longer exist.
In contrast, the proposed plan from ST and NXP sees the semiconductor industry in terms of individual application sectors. But does that view also mean we are seeing the break-up of what are top ten IDMs? Carlo Bozotti, president and CEO of ST, gave a hint of what is on his mind in a conference call when he said: "We said we are determined to improve return."
It was put to Bozotti that with the creation of flash memory company Numonyx BV and an as yet unnamed wireless and fabless JV taking billions of dollars of revenue and thousands of jobs out of ST he is presiding over the break-up of the fifth largest company in the semiconductor market. As another part of ST's love affair with partnership, the company has a significant automotive alliance with Freescale Semiconductor Inc. dating back to February 2006.
Bozotti responded by saying: "It is all about portfolio management. Numonyx is an independent company. In that case we wanted to deconsolidate the flash memory business and create a global leader. In this case [the JV with NXP] we will create a global leader but we WILL consolidate the dimension of scale in ST."
But creating economies of scale within the joint venture also to some degree removes them from ST and definitely does so from NXP. The role that remains for the parent companies is to act as foundries for the invigorated youthful offspring. But this is a role in which they must compete against the likes of TSMC or, more likely, gradually exit as legacy products are moved to foundry and the parents also go fabless.
The exit strategy from the JV for NXP is defined in terms of options on shares at defined prices, exercisable three years after the formation of the JV. However, Bozotti did not state definitively whether the JV would be folded back into ST at that time.
Bozotti and van Houten did not rule out that other such joint ventures could be formed between NXP and ST, but instead said that the topic for discussion was the wireless joint venture, which would require their focus and attention.
But if Bozotti's argument that, "We intend to maintain the financial consolidation within ST," is a defense against the charge of breaking up ST, what about NXP?
The Dutch company is held by equity partners who may be fazed by the 25 percent write-down they are carrying on the 2006 investment which created NXP (see March 4 story). Perhaps they perceive breaking up the company into a series of joint ventures as the most efficient way to get their cash out?
"Many large IDMs are playing in very large fields but they can't all succeed. Scale is needed which is why we are creating the JV. On the product sector scale that is realistic," said NXP's van Houten.
But does that mean all the other NXP business units are suitable cases for the same treatment? "NXP intends to use the proceeds [$1.55 billion] to strengthen our other businesses. It is not the plan to move other businesses out of NXP," van Houten said.
Perhaps, but the sweep of history shows where the pressure is. And if the wireless joint venture is successful that pressure can only increase.
- Future Electronics launches FAI Electronics for improved customer support
- CMOS timing startup raises $2.3 million
- HP releases OpenFlow code for its switches
- Qualcomm, Ericsson demo LTE-to-3G handover
- Graphene institute in Manchester to be funded with £70 million by UK Government
- Nexeon's battery technology claims double triumph at environmental awards
- Advanced mixed-signal process design kit from X-FAB enhanced with Silicon Frontline's post-layout extraction software
- Broadband signal analyzers reduce average cost of signal analysis capability by 55%
- 1-kW industrial quality DC/DC converter offers convection cooling
- LED lighting to drive USD 10bn power supply market in 2016
- Intel makes way for Ivy Bridge by phasing out 25 CPUs
- Shrinking memory bits a million times through antiferromagnetically coupled atoms
- Energy efficient 100-W LED light bulb uses only 12 W
- Analyst claims Windows on ARM will not be much of a success
- Intel, Samsung 'smell blood in the water'
- Nokia's Lumia 900 to lead Windows Phone resurgence
- HokieSpeed, the supercomputer for the masses
- Texas Instruments shows off Pico HD projector that fits into a smartphone
- Osram creates gallium-nitride LED chips on silicon wafers
- Nanometer-thin film enables highest permittivity capacitors
- High-Speed, Real-Time Recording Systems
- Organic solar cells and OLEDs - A comparison of two competing approaches
- USB-Based Thermocouple Temperature Monitor with Cold Junction Compensation
- TTEthernet Scalable Real-Time Ethernet Platform
- IGBT Modules: Data Sheet Comparisons and the Pitfalls of such Comparisons
This month Keithley Instruments is giving away two of its Model 2200 power supplies, worth 735 Euros each, for EETimes Europe's readers to win. The Model 2200-20-5: 20V, 5A, 100W on offer is one of five general-purpose programmable DC power supplies recently launched by the company, designed for source measurement instruments for component, module, and device characterization and test applications.
Part of the Series 2200 family, the unit’s voltage output accuracy is specified at 0.03% and its current output accuracy is 0.05%. The supply’s high output (1mV) and measurement (0.1mA) resolution makes it well-suited for characterizing low power circuits and devices in applications such as measuring idle mode and sleep mode currents to confirm devices can meet today’s ever-more-challenging goals for energy efficiency.
And the winners are:
In our previous reader offer, EPC was giving away ten of its EPC9002 development board kits, worth USD 95 each.
Lucky winners include I. Blythe and C. Hardman from the UK, M. Casartelli and D. Cogliati from Italy, C. Cossio from Spain, W. Milarch from Germany, r. Milewicz from Poland, M. Prascak from Slovakia, A. Raidl from Austria and M. Taslakov from Bulgaria.
All should be receiving their kits soon. Let's wish them some interesting findings with their projects.
NXP Semiconductors
Intel
ARM
Freescale
Linear Technology
Android
LTE
LED
Texas Instruments
IBM
Smartphones
Semiconductor
STMicroelectronics
Analog
MEMS
Wireless
Battery
Maxim Integrated Products
Power Management
Samsung
Analog Devices
TSMC
SoC
Smartphone
Vishay Intertechnology
Solar
Power
IMS Research
FPGA
ABI Research
This site contains articles under license from EETimes Group , a division of United Business Media LLC.



Organic photovoltaics offer greener benefits to provide solar cell
In this news analysis article EE Times Europe Power Management's editor, Paul Buckley quizzes Dr. Martin Pfeiffer, co-founder and CTO of Heliatek GmbH, a global leader and Heliatek's CEO, Thibaud Le Seguillon, ...
