Audio configuration switch IC detects headset type to ease system design
June 14, 2012 // Julien Happich
By integrating the automatic detection and switching function in a single device, the TS3A225E audio headset detection and configuration switch IC from Texas Instruments eliminates detection, leakage and click-pop issues.
The chip works seamlessly to extend the functionality of best-in-class TI audio codecs, such as TLV320AIC3262 and TLV320AIC3212. For designers who prefer only a 2x2 crosspoint switch functionality without headset-type detection, TI also offers the reduced-cost TS3A26746E. The device enhances the end user's experience by supporting three-prong (without microphone) and four-prong (with microphone) audio headsets from all manufacturers. It detects the configuration of the microphone and ground pins on a four-prong headset and routes them appropriately via a 2x2 crosspoint switch. The IC also prevents audio signal distortion with 66-percent lower on-resistance (100 mOhms) for the ground switch compared to the competition. It comes in both 16-pin QFN and WCSP packages.
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Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.