Audio processing chip boosts performance from small, low-cost speakers
February 04, 2011 // Paul Buckley
STMicroelectronics has unveiled an audio processing chip that connects directly to the latest miniature microphones and provides a new way of boosting performance from small, low-cost, or even damaged speakers. The device allows customers to deliver market-leading miniaturized audio products offering outstanding sound quality.
The new device, the STA321MP, joins ST’s SoundTerminal audio IC family, and features a built-in interface for a MEMS digital microphone as well as a standard microphone input. With tiny dimensions and low sensitivity to noise from LCDs and power components, MEMS microphones are ideal for multi-function products such as smartphones. The STA321MP permits direct connection of a MEMS microphone, saving parts count and cost.
In addition, the STA321MP has a second MEMS input that can be connected to a tiny sensor for detecting speaker movements. This allows designers to apply active-sound shaping using ST patented techniques to optimize speaker performance. In active-sound shaping, the processor compensates automatically for distortion or damage to the speaker enabling high-quality audio performance from over-driven speakers or from those with torn or restricted-movement cones.
As a third-generation SoundTerminal IC, the STA321MP delivers advanced features and performance. Support for designers includes complete development kits for MEMS-based systems, as well as the APWorkbench graphical development environment. APWorkbench helps designers configure Sound Terminal products intuitively, and includes features for setting up active sound shaping.
Availability and Pricing
The STA321MP is available now in a 7 x 7 mm QFN package, priced at $3.00 in quantities of 1000. Alternative pricing options are available for larger quantities.
Visit STMicroelectronics at www.st.com
Rohm buys Renesas wafer fab
May 25, 2015
Rohm Co. Ltd. (Kyoto, Japan) has moved to acquire a 200mm wafer fab from Renesas Electronics Corp. for 450 million yen (about ...
SK Hynix, Sharp move up chip vendor ranking
IDT partners EPC to integrate GaN and silicon technologies
Reduce EMI with 42-V, 5-A synchronous step-down silent switcher
Egg-shaped micro home runs on wind, solar power
Extensible CPU cores exploit IoT's vast potential
May 22, 2015
Cisco Systems has predicted that by 2020, there will be 50 billion “things” connected to the Internet up from 15 billion ...
Audi connects to Baidu, Huawei at CES Asia
LED roadway solutions focus on rural, remote communities
New class of magnets attract energy harvesting attention
- Integrating GPS into consumer products
- Controlling LED Lighting Using Triacs and Quadracs
- Automotive Designs Demand Low EMI Synchronous Buck Converters
- Smart Capacitive Design Tips
InterviewCEO interview: What's next after Tower's turn-around?
May 2015 marks the tenth anniversary of Russell Ellwanger taking over as CEO of speciality foundry Tower Semiconductor Ltd. (Migdael Haemek, Israel), which now trades as TowerJazz. And so EE Times Europe ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
In this month's reader offer, Analog Devices is giving away five Blackfin Low-Power Imaging Platform (BLIP) Development Systems (ADZS-BF707-BLIP2), worth 199 dollars each, for EETimes Europe's readers to win.
Targeting demanding ultra-low-power, real-time applications for image sensing and advanced audio, the development platform leverages the company’s ADSP-BF707BBCZ-4 Blackfin processor as...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.