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Audio Subsystems for Efficient SoC Integration

March 29, 2012 // Synopsys // 0 comments

Audio Subsystems for Efficient SoC Integration Download White Paper 717Ko

Implementing advanced audio functionality in a system-on-chip (SoC) involves integrating a range of hardware and software components, including an audio processor, audio peripherals, software drivers and audio processing software. This white paper discusses the requirements for audio solutions for processing of high-definition (HD) multi-channel audio and detail the challenges involved in building such solutions,


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This month, Future Electronics has 20 of Intersil's ISL8203MEVAL2Z evaluation boards to give away to EETimes Europe's readers. Worth 95 US dollars, the board was designed to demonstrate the performance of the ISL8203M dual step-down power module which integrates a PWM controller, synchronous switching MOSFETs, inductors, and passives all in a 9.0x6.5x1.83mm package.

The ISL8203M is rated for dual 3A output current or 6A current sharing operation with an input range of 2.85V to 6V. Each of the two channels employs the current mode pulse width modulation scheme for fast transient response and pulse-by-pulse current limiting.

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