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Bluetooth 4.1 LE in a 3.5×3.5×1.0mm chip

Bluetooth 4.1 LE in a 3.5×3.5×1.0mm chip

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By eeNews Europe



The SESUB-PAN-D14580 module features an integrated DC-DC converter, it operates from a 3.0V voltage supply, drawing only 5.0mA when transmitting, 5.4 mA when receiving and 0.8 µA in standby mode. Based on TDK’s SESUB (semiconductor embedded in substrate) integration technology, the device features an embedded DA14580 Bluetooth 4.1 chip from Dialog Semiconductor.

All terminals of the discrete chip are available, allowing full use of chip functions. The quartz oscillator, capacitors, and various other peripheral components are mounted on the same substrate, enabling the record miniaturization. In addition, the modular approach simplifies the hardware design process.

Visit TDK at www.component.tdk.com

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