Bond via array technology pushes interconnect boundaries between memory and processor dies to 1,512 pins
May 22, 2012 // Julien Happich
Provider of IC packaging and interconnect solutions, Invensas has unveiled a package-on-package (PoP) solution relying on an internally developped bond via array (BVA) technology.
Instead of the traditional solder balls used in solder ball stack PoPs with a pitch limited by the solder balls' diameter (typically 0.65 to 0.5mm high between PCBs), or even the solder-filled via PoP whereby vias are laser-etched into an over-mould and filled with solder, the bond via array consists in raising 0.5mm high copper wires directly from the metal contacts of the lower PCB, then securing them into an insulation compound that only lets the copper wire extremities stand out about 100mm high for easy reflow soldering. Because the copper wires are so thin, this approach enables a very high I/O density, with a pitch from 0.3 to 0.2mm exceeding what is possible with today’s solder ball stacking and solder filled laser via approaches. By increasing the PoP interconnect bandwidth, BVA technology is positioned as an alternative to Wide-I/O through silicon via (TSV) 3D interconnects, at least a 2.5D solution that is readily available for mobile OEMs while preserving the proven infrastructure and business model of traditional package-on-package (PoP).
Close up of Invensas' PoP bond via array technology, the copper wires free-standing from the bottom PCB, and their emerging extremities after potting.
According to Simon McElrea, president of Invensas, because it uses common, low cost wire-bond technology, bond via array technology is about half the cost of using TSVs and even cheaper to implement than alternative PoP solutions. But what’s most important is that it does not disrupt the current PoP business model whereby OEMs are free to assemble memories and processors from different vendors. "Wide I/O is a nice theoretical solution to address memory bandwidth and power issues, but the business model does not work yet very well", explained McElrea, "and I don’t think that Wide I/O will be ready by 2013 so what we offer is a bridging technology that OEMs can use now" he added.
Invensas has built and characterized several interconnect solutions respecting the most common PoP perimeter stacking arrangements on 14x14mm packages, demonstrating scalability up to 1512 interconnects with a 0.2mm pitch. BVA PoP is well suited for applications processor plus memory PoP stacks where increasing processor to memory bandwidth will enables higher resolution, faster frame rate video streaming, faster search, higher resolution multi-screen, multi-application operation and a whole new generation of high-resolution 3D applications.
Visit Invensas at www.invensas.comAll news
Automotive MCU benchmark takes energy efficiency into account
May 21, 2013
Today, cars are crammed with microprocessors, and many of them are not completely switched off when the driver parks and ...
EnSilica partners Cross Border Technologies to boost sales growth in key European markets
Industry's first ultra-wideband Doherty amplifiers support broadband operation
Graphics chip recognizes nearby pedestrians and bicycles
EMS boom for medical industry says analyst
Gemalto teams with Encore Networks for mission critical M2M communications as US shifts to wireless
May 21, 2013
European smartcard specialist Gemalto has teamed up with US machine-to-machine (M2M) router supplier Encore Networks to provide ...
Solar industry capital spending hits seven-year low in 2013 but upturn is on the cards
Apple's overseas tax evasion stirs debate over US tax code
Could Intel enable USD200 Ultrabook?
InterviewWireless control drives Atmel in Europe
Atmel's recent acquisition of Osmo Devices with a WiFi Direct design center in Cambridge and some key microcontroller launches has seen the company focus heavily on wireless control in Europe says Jörg ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
The development platform for i.MX 6Quad from element14 (built to the Freescale SABRE Lite design) is an evaluation platform featuring the powerful i.MX 6Q, a multimedia application processor with Quad ARM Cortex-A9 cores at 1.2 GHz from Freescale Semiconductor.
This month, Freescale and element14 are giving away five such platforms, worth £128.06 each, for EETimes Europe's readers to win. The platform helps evaluate the rich set of peripherals and includes a 10/100/Gb Ethernet port, SATA-II, HDMI v1.4, LVDS, parallel RGB interface, touch screen interface, analog headphone/microphone, micro TF and SD card interface, USB, serial port, JTAG, camera interface, and input keys for Android.
And the winners are...
In our previous reader offer, Pico Technology was giving away one of its recently launched PicoScope 3207B, a 2-channel USB 3.0 oscilloscope worth 1451 Euros. Lucky winner Mr L. Sanchez-Gonzalez from Spain should be receiving his PicoScope 3207B soon. Let's wish them some interesting findings with his projects.
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.