Can a large-area flexible OLED have reliable contacts?
In cooperation with printing paste manufacturers and other suppliers, e.g. machine manufacturers, adhesive manufacturers, encapsulation film suppliers, the Fraunhofer FEP scientists are now able to develop optimized products for required process steps under production conditions.
Fraunhofer FEP provides a roll-to-roll process line which enables the application of organic materials for OLED (organic light-emitting diodes), OPD (organic photodiodes) or OPV (organic photovoltaic) on flexible substrates in one complete technology. The process includes the structuring, automatic inspection of the initial substrates, the vapor deposition of the organics and, finally, the encapsulation of the coated films or glasses.
“Our customers have different requirements to design and mechanical stability of devices. With our know-how and our process equipment we provide a unique development platform for all these demands,” explained Dr. Jacqueline Brückner, Project Manager Surface Analysis for the roll-to-roll organic technology.
For example, there are various solutions for the device contacting. Currently, several contacting solutions with flat ribbon cable, like ACF (Anisotropic Conductive Film)-Bonding, ACA (Anisotropically Conductive Adhesive)-Bonding or ACP (Anisotropic Conductive Paste)-Bonding are evaluated.
Fraunhofer FEP plans to present examples of different contacting solutions, special contacting and encapsulation layouts for the roll-to-roll OLED processes at the Plastic Electronics 2014 event in Grenoble, France on 7 to 9 October, 2014.
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