CEA-Leti ramps up 300-mm 3-D fab
January 18, 2011 // Peter Clarke
France's CEA-Leti research center in Grenoble has begun to ramp up production on its 300-mm wafer fabrication facility dedicated to 3D-integration applications.
By adding this technology to its existing 300-mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200- and 300-mm diameter wafers.
The line has cost about 15 to 18 million euro (about $18 to $24 million) according to Andre Rouzaud, deputy vice president in microsystems and integration. Rouzaud stressed that it would cost considerably more to set up a commercial 3-D line as Leti has been able to recycle some equipment and has other equipment placed with it as part of research cooperation with partner companies.
The line is dedicated to R&D and prototyping and can provide 3-D oriented lithography, deep etching, dielectric deposition, metallization, wet etching and packaging tools that will be available for Leti's partner and customers.
There is no figure of merit for manufacturing throughput of the line. "We're not focused on throughput but on development and developing processes. Tools are constantly being reconfigured" said Mark Scannell, program manager for 3-D integration. However, it was stressed that the processes that are being developed at CEA-Leti are being done so with commercial throughput in mind.
Leti claims to have a large portfolio of through-silicon vias (TSVs) as well as capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks.
CEA-Leti is known to be a close partner of STMicroelectronics and plans to work with Shinko Electric Industries Co. Ltd. (Nagano, Japan) a developer of silicon interposer substrates, Scannell said. "In very high-end research there are some confidential prototypes," he added saying the names could not be shared at this time.
The stacking of die in multichip packages has been happening for some time through the use of bond wires on simple stepped stacks. However the use of TSVs is expected to have a major impact on design density. TSVs are also in commercial operation for some simple operations. Xilinx has used TSVs to attach four FPGA die to a substrate. Similarly TSVs have been used for back side attach to image sensors. However, there is still a lot of research and optimization to be done said Scannell.
Tower buys Maxim's Texas wafer fab
November 27, 2015
Foundry Tower Semiconductor Ltd. (Migdal Haemek, Israel) is set to buy an 8-inch wafer fab in San Antonio, Texas, from Maxim ...
Deterministic motor control with FPGAs
Smart buildings, smartphones will drive IR detector market
Private ID as a service leverages smartphone-enabled biometrics
Like Micron, SK Hynix rejects Chinese advances
NXP, Freescale merger clears FTC hurdle
November 26, 2015
NXP Semiconductors NV (Eindhoven, The Netherlands) has received clearance from the Committee on Foreign Investment in the ...
Thin film micro-lenses stretch to focus
German battery maker puts squeeze on Tesla's solar storage plans
Report: Abu Dhabi holding talks over GloFo sale
- Battery Size Matters
- Software-Defined Radio Handbook - 11th edition
- Multichemistry Buck Battery Charger Controller
- Automotive Circuit Protection using Littelfuse Automotive TVS Diodes
InterviewCEO interview: InvenSense's Abdi on expanding MEMS horizons
InvenSense Inc. is a MEMS company that has epitomized a fabless approach to a sector that is still highly reliant on a thorough grasp of the manufacturing and packaging processes. We interviewed CEO Behrooz ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, FTDI Chip is giving away six MCU development board packages complete with a dedicated compiler (including a full integrated development environment).
Worth Euro 315 each, the packages include a credit card sized Clicker 2 board for the FT90X 32-bit MCU supplied alongside a powerful dedicated compiler from MikroElektronika.
MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.