CEA-Leti ramps up 300-mm 3-D fab
January 18, 2011 // Peter Clarke
France's CEA-Leti research center in Grenoble has begun to ramp up production on its 300-mm wafer fabrication facility dedicated to 3D-integration applications.
By adding this technology to its existing 300-mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200- and 300-mm diameter wafers.
The line has cost about 15 to 18 million euro (about $18 to $24 million) according to Andre Rouzaud, deputy vice president in microsystems and integration. Rouzaud stressed that it would cost considerably more to set up a commercial 3-D line as Leti has been able to recycle some equipment and has other equipment placed with it as part of research cooperation with partner companies.
The line is dedicated to R&D and prototyping and can provide 3-D oriented lithography, deep etching, dielectric deposition, metallization, wet etching and packaging tools that will be available for Leti's partner and customers.
There is no figure of merit for manufacturing throughput of the line. "We're not focused on throughput but on development and developing processes. Tools are constantly being reconfigured" said Mark Scannell, program manager for 3-D integration. However, it was stressed that the processes that are being developed at CEA-Leti are being done so with commercial throughput in mind.
Leti claims to have a large portfolio of through-silicon vias (TSVs) as well as capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks.
CEA-Leti is known to be a close partner of STMicroelectronics and plans to work with Shinko Electric Industries Co. Ltd. (Nagano, Japan) a developer of silicon interposer substrates, Scannell said. "In very high-end research there are some confidential prototypes," he added saying the names could not be shared at this time.
The stacking of die in multichip packages has been happening for some time through the use of bond wires on simple stepped stacks. However the use of TSVs is expected to have a major impact on design density. TSVs are also in commercial operation for some simple operations. Xilinx has used TSVs to attach four FPGA die to a substrate. Similarly TSVs have been used for back side attach to image sensors. However, there is still a lot of research and optimization to be done said Scannell.
Trinamic's stepper motor package gets you started
August 22, 2014
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, ...
Webinar: Printed circuit board test and in line automation
Apple, Samsung tablet sales decline
MCU market on a rebound, says analyst
Is free-space wireless charging viable? Dialog thinks itís worth a try
Schaeffler to boost electromobility by Formula E commitment
August 21, 2014
Mechatronics technology company Schaeffler AG highlights its ambition to be conceived in the automotive markets of the future: ...
Solid state battery advance removes 'range anxiety' fears
Volvo opens proving ground for next-gen car technology
Infineon closes technology gap through International Rectifier takeover
- Building Blocks for the Internet of Things
- New Linear Regulators Solve Old Problems
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
InterviewCEO interview: Tronics' Langlois makes moves in MEMS
Pascal Langlois has been CEO at Tronics for nine months. He discusses plans for the company and directions for the complex and diverse MEMS technology sector.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.