CEA-Leti ramps up 300-mm 3-D fab
January 18, 2011 // Peter Clarke
France's CEA-Leti research center in Grenoble has begun to ramp up production on its 300-mm wafer fabrication facility dedicated to 3D-integration applications.
By adding this technology to its existing 300-mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200- and 300-mm diameter wafers.
The line has cost about 15 to 18 million euro (about $18 to $24 million) according to Andre Rouzaud, deputy vice president in microsystems and integration. Rouzaud stressed that it would cost considerably more to set up a commercial 3-D line as Leti has been able to recycle some equipment and has other equipment placed with it as part of research cooperation with partner companies.
The line is dedicated to R&D and prototyping and can provide 3-D oriented lithography, deep etching, dielectric deposition, metallization, wet etching and packaging tools that will be available for Leti's partner and customers.
There is no figure of merit for manufacturing throughput of the line. "We're not focused on throughput but on development and developing processes. Tools are constantly being reconfigured" said Mark Scannell, program manager for 3-D integration. However, it was stressed that the processes that are being developed at CEA-Leti are being done so with commercial throughput in mind.
Leti claims to have a large portfolio of through-silicon vias (TSVs) as well as capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks.
CEA-Leti is known to be a close partner of STMicroelectronics and plans to work with Shinko Electric Industries Co. Ltd. (Nagano, Japan) a developer of silicon interposer substrates, Scannell said. "In very high-end research there are some confidential prototypes," he added saying the names could not be shared at this time.
The stacking of die in multichip packages has been happening for some time through the use of bond wires on simple stepped stacks. However the use of TSVs is expected to have a major impact on design density. TSVs are also in commercial operation for some simple operations. Xilinx has used TSVs to attach four FPGA die to a substrate. Similarly TSVs have been used for back side attach to image sensors. However, there is still a lot of research and optimization to be done said Scannell.
Indian fab project hires former GloFo exec
August 01, 2015
Indian foundry fab will be located near Indore in Madhya Pradesh. The company reports that talks are moving the project forward ...
OmniVision shareholders approve Seagull takeover
Ancient RF teardown: crude but effective
Omnifocal eye-glasses need two-year's development
Is 3D XPoint based on phase-change memory?
Google Glass refocuses on enterprises, circumvents privacy issues
July 31, 2015
According to the Wall Street Journal, Google Glass has been relooked to and redesigned with a bigger display and a faster ...
IoT wireless sensors and the problem of short battery life
High speed DAC for wide bandwidth signal generation
IBM's Watson to help CVS manage patient health data
- Dual Phase Buck Controller Drives High Density 1.2V/60A Supply with Submilliohm DCR Sensing
- Test environment for the positioning elements of wearable devices
- Automotive Circuit Protection using Littelfuse Automotive TVS Diodes
- Top 5 Challenges for testing Today's Consumer Electronics
InterviewGlobalfoundries' CEO on why FD-SOI and why now
With its latest news Globalfoundries Inc. has not only confirmed itself as a supporter of the fully-depleted silicon-on-insulator (FD-SOI) approach to IC manufacturing but that it also thinks sufficiently ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Novelda is giving away two full XeThru Inspiration kits worth 1499 US Dollars each, for EETimes Europe's readers to experiment first hand with its XeThru technology.Based on the use of radio waves, rather than infrared, ultrasound or light, the company's X2M1000 Inspiration modules can detect presence just from the chest movement while breathing, and measure both the rate and... MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.