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Chip engineers prepare for 450mm wafer transition

February 13, 2013 // By Christoph Hammerschmidt

Chip engineers prepare for 450mm wafer transition

At the 10th Innovation Forum on Fab Automation in Dresden, participants and presenters discussed technology trends in manufacturing automation.


Since this event has been launched by a group of companies which are active in the field of semiconductor manufacturing and is attended in the first place by participants out of this industry segment, it is only natural that the presentations also focused on automation in IC production - especially as the host for this year's forum.

Read the full article on page 6 of our February digital edition.

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