Chip-making equipment spend flat in 2012
March 13, 2012 // Peter Clarke
The amount of money spent annually on semiconductor fab equipment is expected to be flat in 2012, according to the latest forecast from industry body Semiconductor Equipment Materials International.
The total spending on fab equipment spending is estimated to be $38.85 billion for 2012, flat with 2012, and a record $45.50 billion for 2013, up 17 percent.
However, the spend on equipment for 300-mm fabs is growing, SEMI estimates. A spend of $34.27 billion in 2012 would be up 14 percent on 2011 and $40.58 billion spend in 2013, up 18 percent on 2012.
Eight companies, including Samsung and Intel, will keep their fab equipment spending level above $2 billion in 2012, according to SEMI. Hynix is expected to spend $3.75 billion in 2012 and UMC has said it plans to spend $2.0 billion in 2012, SEMI added.
The spending trend is expected to continue into 2013 especially for the foundry, digital logic, microprocessor and NAND flash memory sectors.
While installed capacity for DRAM is expected to level out, flash capacity is growing rapidly between 2010 and 2013. The dedicated foundry sector will also undergo growth in installed capacity with contributors from TSMC, Globalfoundries and UMC.
Structural electronics - the next big thing in smart cars?
September 18, 2014
Electronic circuits embedded in vehicles, aircraft and more have the potential to be a $60 billion market by 2025, says technology ...
Elastomeric camouflage switches texture and colour
Solar microinverter to break USD1bn barrier in 2018
7nm EUV could ease 10nm squeeze, says ASML
Europeans flex skills to commercialize OLED and OPV devices
Freescale opens Discovery Lab in Toulouse to foster innovation
September 17, 2014
Shortly after the company celebrated the first year of existence of its Austin-based Freescale Discovery Lab, an incubator ...
Can a large-area flexible OLED have reliable contacts?
Lemoptix pico-projector excels
Building ARM-based Bluetooth-enabled wearables
- Putting FPGAs to Work in Software Radio Systems Handbook
- Flexible and Low Power Driving of Solenoid Coils
- How to Protect & Monetize Android Apps
- Power Modules: The New Super Power
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.