Chip-making equipment spend flat in 2012
March 13, 2012 // Peter Clarke
The amount of money spent annually on semiconductor fab equipment is expected to be flat in 2012, according to the latest forecast from industry body Semiconductor Equipment Materials International.
The total spending on fab equipment spending is estimated to be $38.85 billion for 2012, flat with 2012, and a record $45.50 billion for 2013, up 17 percent.
However, the spend on equipment for 300-mm fabs is growing, SEMI estimates. A spend of $34.27 billion in 2012 would be up 14 percent on 2011 and $40.58 billion spend in 2013, up 18 percent on 2012.
Eight companies, including Samsung and Intel, will keep their fab equipment spending level above $2 billion in 2012, according to SEMI. Hynix is expected to spend $3.75 billion in 2012 and UMC has said it plans to spend $2.0 billion in 2012, SEMI added.
The spending trend is expected to continue into 2013 especially for the foundry, digital logic, microprocessor and NAND flash memory sectors.
While installed capacity for DRAM is expected to level out, flash capacity is growing rapidly between 2010 and 2013. The dedicated foundry sector will also undergo growth in installed capacity with contributors from TSMC, Globalfoundries and UMC.
Micrel's 10 criteria for choosing a MEMS foundry
April 18, 2014
Micrel Inc. (San Jose, Calif.) has prepared an article that lays out the 10 criteria to help guide someone in the choice ...
Superconducting qbits made immune to quasiparticle energy loss
The Filter Wizard: Just add a transistor
Mobile display revenues soar, leaving TV behind
European organic PV project aims for material gains
Nanomaterial-packed cathode extends range of EV lithium-sulfur batteries
April 17, 2014
Researchers at the USA's Department of Energy Pacific Northwest National Laboratory have developed a metal organic framework ...
Wearable computing market on 78% CAGR through 2018
OLED TV shipment delays stall OLED material growth
BMW updates navigation via mobile radio connection
- USB 5V 2.5A Output, 42V Input Synchronous Buck with Cable Drop Compensation
- Measurement applications across multiple test platforms
- Supplying DC input power to string inverters
- Supplying DC input power for HEV testing
InterviewHeartbleed challenges the Internet of Thing
The Heartbleed security bug is a key example of the fundamental security challenge for the Internet of Things says Green Hills Software as it launches a new security group.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Arrow Electronics is giving away ten XMC1200 lighting application kits, worth 100 Euros each, for EETimes Europe's readers to win.
Each kit combines Infineon’s brightness and colour control XMC1200 CPU board to drive flicker free LED dimming and colour changing, together with a colour LED card and a white LED card.
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.