Deutsche Bank ranking puts Icera up and ST, NXP down
May 09, 2008 //
Analysts of the developing 3G baseband silicon market at Deutsche Bank are clearly not respecters of market share in the larger mobile communications market for its own sake.
LONDON Analysts of the developing 3G baseband silicon market at Deutsche Bank are clearly not respecters of market share in the larger mobile communications market for its own sake.
In a note issued to clients at the end of February the Deutsche Bank analysts divided 3G baseband chip supplying companies into four tiers based on their understanding of the roadmaps and execution status of 11 companies.
Deutsche Bank restricts its tier one to four companies. Qualcomm and Texas Instruments, the two leading suppliers of silicon for mobile handsets, are included in the top rank. The other two are Ericsson Mobile Platforms and privately-held Icera Inc. As a private company Icera's annual sales have not been disclosed but they will be a tiny fraction of the billions of dollars of annual sales attributed to the wireless market leaders.
The bank puts STMicroelectronics NV, the company with third largest annual wireless revenues at about $1.5 billion according to market researcher iSuppli Inc., in the fourth tier of suppliers. And NXP, with the fifth largest annual wireless revenues at $1.4 billion according to iSuppli, is in the third tier.
"...Qualcomm has a much wider range of products shipping than any of the others. More shocking is that even at this late date there are still so few vendors actually shipping product. On a merchant basis, that is vendors selling to any and all handset vendors, there are really only three HSDPA vendors; Qualcomm, EMP and privately-held Icera," the analysts said.
Deutsche Bank's second tier comprises Freescale, Infineon and Broadcom. The third tier is NXP, Marvell and NEC.
The relatively lowly ranking for ST and NXP may indicate one reason why ST and NXP agreed to merge their wireless businesses to create a third-place joint-venture with annual sales of about $2.9 billion, twice the size of fourth-placed Infineon Technologies AG.
However, it is clear that analysts at Deutsche Bank will not see size alone as a reason to move the ST-NXP venture up the 3G baseband ranking.
According to the note, NXP has the Nexperia PCF0501 offering WCDMA/UMTS capability and undergoing interoperability testing, and started sampling HSDPA silicon at 3.6-Mbits per second in Q3 2007. However, 7.2-Mbits per second and HSUPA capability is not sampling until the first half of 2009, the note added.
ST's entry for WCDMA/UMTS 3G baseband is "no products." For HSPA the observation is that ST has a Nokia supply agreement with first products targeting the first half of 2010.
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