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Dialog Semiconductor licenses Cadenceís Tensilica HiFi audio/voice DSP IP

September 10, 2013 // Paul Buckley

Dialog Semiconductor licenses Cadenceís Tensilica HiFi audio/voice DSP IP

Dialog Semiconductor plc has licenced Tensilica HiFi Audio/Voice DSP IP from Cadence Design Systems, Inc and Dialog will deploy the IP to initially develop next-generation audio solutions for the company's connectivity products.


Cadence Tensilica HiFi Audio/Voice DSPs claim to be the industry’s most widely used licensable audio/voice DSP family, supporting more than 100 proven audio/voice software packages optimised for enhancement of the user’s audio experience.

“Sound quality, performance and low power architecture are critical contributors to our reputation and success with our leading customers,” said Mark Tyndall, vice president of corporate development and strategy at Dialog. “The Cadence Tensilica HiFi Audio/Voice DSP delivers in all these areas and has a comprehensive software partner ecosystem, which is essential for the connectivity and portable device markets we serve.”

“By selecting our HiFi audio/voice DSP IP core, Dialog will be able to continue its tradition of offering its customers top-quality ICs for their next generation wireless connectivity and other portable devices, including smartphone and tablet PCs,” said Jack Guedj, corporate vice president of research and development at Cadence.

The HiFi Audio/Voice DSP is part of the broader Tensilica product offering that combines the best capabilities of DSPs and CPUs while delivering 10X to 100X the performance because they can be optimised using automated design tools to meet specific and demanding signal processing performance targets.

Visit Dialog Semiconductor at www.dialog-semiconductor.com

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