Dow Corning joins imec's GaN affiliation program
January 21, 2011 // Paul Buckley
Dow Corning is joining the imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies which is focusing on the development of the next generation GaN power devices and LEDs. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.
Due to the combination of superior electron mobility, higher breakdown voltage and good thermal conductivity properties, GaN/AIGaN heterostructures offer a high switching efficiency for the next generation power and RF devices compared to the current devices based on silicon (Si). A process for high quality GaN epi-layers on Si substrates is key in obtaining superior power and RF devices. Accurate control of the epi-growth process to master substrate bow, epi-layer defectivity and uniformity while maintaining high epi-reactor throughput are needed to reduce the overall technology cost.
Imec has pioneered GaN epi-growth on sapphire, SiC and Si substrates from 2 to 6 inch substrate sizes and currently focuses on developing GaN epi-layers on 8 inch Si substrates. Leveraging the economics of scale and compatibility with high throughput and high capacity 8 inch Si wafer based process technology will further reduce the cost of GaN devices and LEDs.
As a leading producer of SiC wafers and epitaxy, Dow Corning is applying its capability in electronic materials technology and quality supply to bring next generation materials technology to global device manufacturers.
“By joining the imec GaN Affiliation Program, Dow Corning will rapidly expand its substrate product portfolio with high quality and affordable GaN epi-wafers for power, RF and LED markets” said Tom Zoes, Global Director, Dow Corning Compound Semiconductor Solutions.
Dow Corning is also the majority shareholder in the Hemlock Semiconductor Group joint ventures which is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules.
Visit imec at www2.imec.be/be_nl/home.html
The engineering desk-to-bench ratio
November 21, 2014
Dennis Feucht discusses the right and wrong, senior and junior ways to organize the theoretical and practical work of an ...
Rohm's European Design Center in growth phase
Combo inertial sensor market on 19% CAGR, says Yole.
US, China pushing industrial chip market growth, says IHS
LA Auto Show: Hydrogen fuel cell drive is back
Opening up the IoT data flood gates
November 21, 2014
Only a few days after their LoRa long range communication demo at electronica, IBM and Semtech are making the LoRa MAC protocol ...
Polarizing filter reduces energy drain from smartphone displays
From warm to cool white: colour-temperature tunable LEDs
System provides high-volume solution for flexible OLED displays
- Halogen-free options and increased performance for terminal blocks
- Wireless Power User Guide
- Secure is the New Smart
- 5 Best Practices for Designing Flexible Test Stations
InterviewFreescale CEO: 'IoT isn't just buzz'
Coming after the solid third quarter results that produced higher operating margins and improving cash flow, Freescale Semiconductor's CEO Gregg Lowe had every reason to be chipper and lively when EE Times ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Cherry is giving away five of its Energy Harvesting Evaluation kits, worth over 266 Euros each, for EETimes Europe's readers to win. Cherry's energy harvesting technology benefit mostly applications where a complex wire assembly and/or batteries would be inappropriate.
The required RF-energy is created by the mechanical actuation of the switch and the data is transmitted...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.
Most popular news
- Could magnesium battery innovation end lithium's dominance?
- From warm to cool white: colour-temperature tunable LEDs
- Li-Fi communication module wirelessly transfers data at 1-Gbps
- Supercapacitor innovation promises panel-powered cars in five years
- Rebranding the revolution: the future of IoT is embedded