Dow Corning joins imec's GaN affiliation program
January 21, 2011 // Paul Buckley
Dow Corning is joining the imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies which is focusing on the development of the next generation GaN power devices and LEDs. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.
Due to the combination of superior electron mobility, higher breakdown voltage and good thermal conductivity properties, GaN/AIGaN heterostructures offer a high switching efficiency for the next generation power and RF devices compared to the current devices based on silicon (Si). A process for high quality GaN epi-layers on Si substrates is key in obtaining superior power and RF devices. Accurate control of the epi-growth process to master substrate bow, epi-layer defectivity and uniformity while maintaining high epi-reactor throughput are needed to reduce the overall technology cost.
Imec has pioneered GaN epi-growth on sapphire, SiC and Si substrates from 2 to 6 inch substrate sizes and currently focuses on developing GaN epi-layers on 8 inch Si substrates. Leveraging the economics of scale and compatibility with high throughput and high capacity 8 inch Si wafer based process technology will further reduce the cost of GaN devices and LEDs.
As a leading producer of SiC wafers and epitaxy, Dow Corning is applying its capability in electronic materials technology and quality supply to bring next generation materials technology to global device manufacturers.
“By joining the imec GaN Affiliation Program, Dow Corning will rapidly expand its substrate product portfolio with high quality and affordable GaN epi-wafers for power, RF and LED markets” said Tom Zoes, Global Director, Dow Corning Compound Semiconductor Solutions.
Dow Corning is also the majority shareholder in the Hemlock Semiconductor Group joint ventures which is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules.
Visit imec at www2.imec.be/be_nl/home.html
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Internet of Things (IoT) manufacturer Ciseco has launched the Raspberry Pi ‘Wireless Inventors Kit’ (RasWIK), featuring 88 pieces to provide everything a Pi owner needs to follow a series of step-by-step projects or to create their own wireless devices, without the need for configuration or even writing code.
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In our previous reader offer, Farsens was giving away five kits for EEtimes Europe readers to evaluate its FenixVortex, Kineo and X1 wireless, battery free sensor tags.
Lucky winners include Mr A. Neil from the UK, Mr. E. Delvaux from Belgium, Mr Lengal from the Czech Republic, Mr H. Bijlsma from the Netherlands, and Mr G. Pfaff from Germany. All should be receiving their packages soon. Lets wish them some interesting findings with their projects.
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