Fab utilization near capacity in Q3
November 17, 2010 // Mark LaPedus
Despite an apparent slowdown in the IC industry, the utilization rate of the world's wafer fabs was 95 percent in the third quarter of 2010, according to the Semiconductor International Capacity Statistics (SICAS) group. This compares to 95.6 percent in Q2 and 86.5 percent a year ago, according to the figures.
Total 200-mm utilization was 95.4 percent in the third quarter, compared to 94.6 percent in the second quarter and 80.2 percent a year ago, according to SICAS.
Total foundry utilization was 99.3 percent in the third quarter, compared to 98.8 percent in the second quarter and 91.9 percent a year ago, according to SICAS.
At 60-nm and below, utilization was 97.2 percent of capacity in Q3, down from 98.6 percent in Q2 and 93.8 percent a year ago, according to group. Between 80- and 60-nm, utilization was 97.2 percent of capacity in Q3, down from 98.8 percent in the previous quarter and 95.3 percent a year ago.
''Heading into 3Q10, expectations were muted, at best, on increasing macro worries about the sovereign debt crisis, volcanic eruptions, inflation concerns and currency pressures,'' said Steven Pelayo, an analyst with HSBC, in a report.
''The technology sector was not immune, as LCD demand softened, inventories built, and pricing rolled over. PCs were also soft as notebook builds fell sharply in July, memory pricing accelerated downward, and Intel lowered guidance,'' he said. ''Thankfully, the mid-quarter pre-build ahead of the Asian holidays began to offset and helped drive a rebound. In the end, we estimate that average 3Q10 revenue for Asia tech companies increased 8 percent quarter-over-quarter.''
Still, it was a mixed bag. ''However, the variation was wide, with solar and smartphones outperforming, while fabless chipmakers and LCD declined. Net/net, 3Q10 was clearly below historic seasonality, but reset expectations early in the quarter resulted in a 'not-as-bad-as-initially-feared' tone afterwards,'' he said. All news
MEMS leaders under pressure, says Yole
July 31, 2014
The MEMS industry is changing as established leaders with manufacturing and an emphasis on delivering components are put ...
OLED lighting to be competitive with LEDs by 2016
Panasonic and Tesla Gigafactory battery plan forges ahead
Surface inspection tool can get customized
Wireless charging - a more cost-effective approach
Sony, Panasonic, Japan Display plan OLED joint venture
July 30, 2014
Sony Corp., Panasonic Corp., and Japan Display Inc. are working together to create a new company, to be named JOLED, which ...
Sony, TSMC win award for silicon-plastic process development
Sensor footprint evolution: Does size matter?
Memscap breaks even on rising Q2 revenue
- New Linear Regulators Solve Old Problems
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.