HSPA/LTE accounts for 17.3 percent of PC broadband, says analyst
July 07, 2010 // Peter Clarke
Mobile broadband of the HSPA/LTE variety accounted for 17.3 percent of the total number of broadband connections in Europe at the end of 2009, according to market research company Berg Insight.
The number of HSPA/LTE mobile broadband subscribers grew by 71 percent year-on-year in 2009 to reach 25.0 million across Europe, Berg (Gothenburg, Sweden) said, and forecasted it would grow at a compound annual growth rate (CAGR) of 21.6 percent to reach 81 million by 2015.
The North American market has evolved at a slower pace, with mobile broadband accounting for just 7.1 percent of the total number of connections. Between 2009 and 2015, the North American market is forecasted to grow at a CAGR of 34.8 percent to reach 42 million subscribers at the end of the period.
The levels of adoption of mobile broadband vary significantly across Europe, Berg said.
"Austria is the most advanced market with a penetration rate of over 15 percent, corresponding to 40 percent of all broadband connections in the country. Sweden, Denmark, Norway, Ireland and Portugal have also penetration rates above 10 percent. Belgium, Netherlands and Greece have on the other hand penetration rates of less than 3 percent," said Marcus Persson, telecom analyst with Berg, in a statement.
"The attach rate of embedded mobile broadband in notebooks was less than 5 percent in both Europe and North America last year. This will change as prices for the embedded modules decrease and an attach rate of almost 45 percent is expected already in five years," Persson concluded.
Huawei has established itself as the largest supplier of mobile broadband terminals holding a market share of 53 percent and has a particularly strong foothold in Europe, Berg said. ZTE is the second largest vendor with clear margins capturing a market share of 30 percent. Berg Insight estimates the total global number of shipped external mobile broadband devices in 2009 to be 66 million, with Europe and North America accounting for 24.3 million units and 5.6 million units respectively.
Rohm buys Renesas wafer fab
May 25, 2015
Rohm Co. Ltd. (Kyoto, Japan) has moved to acquire a 200mm wafer fab from Renesas Electronics Corp. for 450 million yen (about ...
SK Hynix, Sharp move up chip vendor ranking
IDT partners EPC to integrate GaN and silicon technologies
Reduce EMI with 42-V, 5-A synchronous step-down silent switcher
Egg-shaped micro home runs on wind, solar power
Extensible CPU cores exploit IoT's vast potential
May 22, 2015
Cisco Systems has predicted that by 2020, there will be 50 billion “things” connected to the Internet up from 15 billion ...
Audi connects to Baidu, Huawei at CES Asia
LED roadway solutions focus on rural, remote communities
New class of magnets attract energy harvesting attention
- Integrating GPS into consumer products
- Controlling LED Lighting Using Triacs and Quadracs
- Automotive Designs Demand Low EMI Synchronous Buck Converters
- Smart Capacitive Design Tips
InterviewCEO interview: What's next after Tower's turn-around?
May 2015 marks the tenth anniversary of Russell Ellwanger taking over as CEO of speciality foundry Tower Semiconductor Ltd. (Migdael Haemek, Israel), which now trades as TowerJazz. And so EE Times Europe ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
In this month's reader offer, Analog Devices is giving away five Blackfin Low-Power Imaging Platform (BLIP) Development Systems (ADZS-BF707-BLIP2), worth 199 dollars each, for EETimes Europe's readers to win.
Targeting demanding ultra-low-power, real-time applications for image sensing and advanced audio, the development platform leverages the company’s ADSP-BF707BBCZ-4 Blackfin processor as...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.