IBM announces process for power management
September 17, 2010 // Peter Clarke
IBM has announced a 180-nm chip-making process technology for power-management applications that can combine wireless communications and sensors.
The process, labeled CMOS-7HV, will be run primarily at IBM's wafer fab in Burlington, Vermont and the company is rolling out the process to manufacturers in the consumer electronics, industrial, automotive, digital media and alternative-energy segments. IBM is already accepting designs from customers and is scheduling full production for the first half of 2011.
CMOS-7HV includes a triple-gate oxide high voltage CMOS technology that operates at up to 50-V and extendable to 120-V. It also includes support for RF in term of precision polycrystalline, diffusion and well resistors, MIM capacitors and characterized vertical capacitors. The process offers three to seven levels of aluminum interconnect including thick last metal. There is a one-time programmable memory option and the I/O pins can be wirebonded or solder bumped.
As a result the process can integrate wireless communications and power management in a single chip. The company foresees the application of the technology in "smart" building monitor ICs, solar panels, energy grids, industrial, automotive and transportation systems. Chips based on the technology would also have a role in consumer electronics and mobile phones, the company said.
"By enabling more efficient power management in smart phones, IBM's technology opens up the possibility of using smaller, lighter batteries or needing less recharge time to provide the same amount of 'talk' time, video sharing or picture-snapping," said Jeff Hilbert, president and co-founder of Wispry Inc. (Irvine, Calif.) in a statement issued by IBM.
"Integrating communications and power sensors on one chip cuts costs for the industry and is an example of our 'smart-planet' technology vision – one that we back up with R&D," said Michael J. Cadigan, general manager, IBM Microelectronics Division, in the same statement.
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Internet of Things (IoT) manufacturer Ciseco has launched the Raspberry Pi ‘Wireless Inventors Kit’ (RasWIK), featuring 88 pieces to provide everything a Pi owner needs to follow a series of step-by-step projects or to create their own wireless devices, without the need for configuration or even writing code.
RasWIK has been designed to be highly accessible, demystifying the dark art of wireless and enabling anyone with basic computing skills to begin building wireless devices with a Raspberry Pi. You can create anything from a simple traffic light, to a battery monitor, or even a temperature gauge that sends data to the Xively IoT cloud so billions can access the data.This month, Ciseco is giving away twelve Raspberry Pi Wireless Inventors kits, worth £49.99 each for EETimes Europe's readers to win.
And the winners are...
In our previous reader offer, Farsens was giving away five kits for EEtimes Europe readers to evaluate its FenixVortex, Kineo and X1 wireless, battery free sensor tags.
Lucky winners include Mr A. Neil from the UK, Mr. E. Delvaux from Belgium, Mr Lengal from the Czech Republic, Mr H. Bijlsma from the Netherlands, and Mr G. Pfaff from Germany. All should be receiving their packages soon. Lets wish them some interesting findings with their projects.
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