IBM warns of 'design rule explosion' beyond 22-nm
April 01, 2010 // R. Colin Johnson, EE Times.com
An IBM researcher warned of "design rule explosion" beyond the 22-nanometer node during a paper presentation at the International Symposium on Physical Design (ISPD). Kevin Nowka, senior manager of VLSI Systems at the IBM Austin Research Lab, described the physical design challenges beyond the 22-nm node, emphasizing that sub-wavelength lithography has made silicon image fidelity a serious challenge.
like rectangular shapes, Boolean design rules, and constant parameters
will not suffice to enable us to push designs to the ultimate levels of
performance," Nowka said.
Solving "design rule explosion," according to Nowka, involves
balancing area against image fidelity by considering the physical
design needs at appropriate levels of abstraction, such as within
cells. Nowka gave examples of how restricted design rules could reap a
three-fold improvement in variability with a small area penalty.
IBM described a solution to "design rule explosion"
at the 22 nanometer node illustrated in an SRAM chip design.
Nowka envisions physical design rules beyond the 22-nm node
that are more technology-aware and which make use of pre-analysis and
library optimization for improved density and robustness, he said.
Also at ISPD, which was held March 14 to 17 in San Francisco, Mentor
Graphics Corp. proposed that hardware/software co-design be used for
chips, their packages and their printed circuit (pc) boards. A Mentor
executive offered an example in which a 26 percent cost savings was
realized by performing such a co-optimization of all three systems
"Thinking outside of the chip," was the key, according to John Park,
business development manager for Mentor's System Design division. By
optimizing the interconnect complexity among all three levels of a
design chip, package and pc board Park claimed that pin counts,
packaging costs and high speed I/O can be optimized.
According to Park, the chip-to-package-to-pc board design flow needs to be performed in parallel because restraints on pc boards often place requirements on
package design, while package requirements can in turn constrain chip
design, both of which are ignored by current designs flows.
Serge Leef, Mentor's vice president of new ventures and general manager
of the company's System-Level Engineering division, invited theAll news
BAE Systems develops 'smart skin' for aircraft
August 27, 2014
Defense and aerospace company BAE Systems plc is working on a project to give aircraft a "skin" of sensors to enable detection ...
Emberlight connects ordinary light bulbs to your smartphone
Cree targets mid-power LEDs with USD83m Lextar investment
Will 2D semiconductors threaten graphene's PV dominance?
IKEA GreenTech invests in energy-efficient LED technology developer
Searching through big data with the NSA
August 26, 2014
Deepening the NSA scandal, The Intercept detailed yesterday how the US National Security Agency is providing data to nearly ...
China Launching Its Own OS, Seriously?
JEDEC unveils standard for low power memory devices
Audi makes the leap to 48V supply
- How to Protect & Monetize Android Apps
- Building Blocks for the Internet of Things
- New Linear Regulators Solve Old Problems
- Testing GPS with a Simulator
InterviewCEO interview: Tronics' Langlois makes moves in MEMS
Pascal Langlois has been CEO at Tronics for nine months. He discusses plans for the company and directions for the complex and diverse MEMS technology sector.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.