Infineon backing of HSMC set to include equity investment
April 19, 2007 //
Infineon is likely to take a stake in recently-launched Hindustan Semiconductor Manufacturing Corp. (HSMC), according to a report in the Economic Times of India. The amount of equity Infineon will take has yet to be determined.
MUNICH, Germany Infineon is likely to take a stake in recently-launched Hindustan Semiconductor Manufacturing Corp. (HSMC), according to a report in the Economic Times of India. The amount of equity Infineon will take has yet to be determined.
The paper quotes HSMC top manager Devendra Verma saying that the German semiconductor manufacturer will "definitively" take "some equity" in the Indian company. According to Verma, the amount of Infineon's stake will be finalized during the ongoing negotiations, which are expected to be finalized within the coming six weeks.
An Infineon spokesperson declined to acknowledge the statement directly. "We always said that the financial terms of our licensing agreement with HSMC are yet to be negotiated," he said. "There are many options, including an equity holding - eventually."
According to Economic Times, HSMC is presently in talks with financial institutions and state governments to raise funds for the first of its two planned semiconductor manufacturing sites in India, with the exact location still under discussion. Possible locations are Karnataka, Chennai or Hyderabad, Verma said. Decisive factors are, besides incentives from state governments, resources like water and electric power. The first fab to be built is planned to produce 8-inch wafers. This site will require investments of approximately $1 billion. In addition, HSMC plans to erect a second fab, intended to process 12-inch wafers, which will require another $3.2 to $3.5 billions of investment.
Two weeks ago, HSMC had announced that it will license process technologies for standard CMOS chips as well as for RF and embedded flash devices from Infineon. In addition, Infineon will offer expertise and support for setting up the fabs and crank up production. However, Infineon hitherto avoided the impression it was interested in a direct investment into HSMC.
Visteon concept marries data security and connectivity
October 21, 2014
Automotive supplier Visteon plans to extends its fame as a designer of unconventional, innovative car dashboards. At electronica, ...
Webinar covers ASIC design for MEMS
Utilities keen to own cellular networks
Spansion expands MCUs with IoT on its radar
European plastic electronics industry flexes its muscles
Graphene aerogels promise enhanced energy storage performance
October 21, 2014
Lawrence Livermore researchers have turned to graphene aerogel to develop an enhanced electrical energy storage solution ...
R&S demos 5G test setup
Global chip capex to rise 11% in 2014
"New" MEMS evolution coming, predicts Yole
- 5 Best Practices for Designing Flexible Test Stations
- Intelligent PLCs Expand the Internet of Things
- Solutions for Millimeter Wave Wireless Backhaul
- Enter Linduino
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Oscium is giving away three of its iMSO-204L dual analogue iOS oscilloscopes, worth USD400 each. Designed with native Lightning compatibility, the iMSO-204L transforms the iPad, iPhone, and iPod touch into an ultra-portable, two-channel oscilloscope.
Since Apple changed its connector, Oscium has been working to bring native compatibility to its customers. The third generation...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.