Infineon, Fuji agree on HybridPACK 2 automotive power module specs
May 09, 2012 // Christoph Hammerschmidt
Fuji Electric and chip manufacturer Infineon Technologies agreed to extend the supplier base for power modules deployed in automotive hybrid and electrical vehicles (HEV). At the PCIM Europe trade show in Nuremberg, the two companies announced their agreement on a joint common footprint for automotive IGBT power modules using Infineon's Hybrid PACK 2 power module. In response to the need for supply security for HEV power modules, the companies agreed on the size of the module, the position of pin-outs, the use of the pin-finned copper base plate and on other mechanical features.
The agreement comprises the HybridPACK 2 module, the FS800R07A2E3 featuring 650V/800A. It effectively makes the IGBT power modules from these two vendors interchangeable. For customers in the automotive industry, the move translates into a second-source option for the power modules in question, doing away with the undesired dependence from a single vendor.
Infineon developed its power modules HybridPACK 2 for direct liquid-cooled systems as common in hybrid vehicles and electrical vehicles. According to Infineon, the HybridPACK 2 modules offer the industry's smallest footprint at the given high power density. This is approximately 20 percent smaller than other modules on the market, the company claims.
Today's electronic control systems for full hybrid cars and electrical vehicles equal the size of two standard shoe boxes, weighing an average of 30 kilos. A system with HybridPACK 2 power module technology is only about the third its size and only weighs approximately 20 kilos compared to other state-of-the-art solutions. The pin-finned copper base plate in HybridPACK 2 not only enhances thermal performance, but also increases reliability.
The HybridPACK 2 modules of Infineon are available in high-volume. Fuji plans to have power modules with HybridPACK 2 footprint available as of 2013.
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