Infineon, Fuji agree on HybridPACK 2 automotive power module specs
May 09, 2012 // Christoph Hammerschmidt
Fuji Electric and chip manufacturer Infineon Technologies agreed to extend the supplier base for power modules deployed in automotive hybrid and electrical vehicles (HEV). At the PCIM Europe trade show in Nuremberg, the two companies announced their agreement on a joint common footprint for automotive IGBT power modules using Infineon's Hybrid PACK 2 power module. In response to the need for supply security for HEV power modules, the companies agreed on the size of the module, the position of pin-outs, the use of the pin-finned copper base plate and on other mechanical features.
The agreement comprises the HybridPACK 2 module, the FS800R07A2E3 featuring 650V/800A. It effectively makes the IGBT power modules from these two vendors interchangeable. For customers in the automotive industry, the move translates into a second-source option for the power modules in question, doing away with the undesired dependence from a single vendor.
Infineon developed its power modules HybridPACK 2 for direct liquid-cooled systems as common in hybrid vehicles and electrical vehicles. According to Infineon, the HybridPACK 2 modules offer the industry's smallest footprint at the given high power density. This is approximately 20 percent smaller than other modules on the market, the company claims.
Today's electronic control systems for full hybrid cars and electrical vehicles equal the size of two standard shoe boxes, weighing an average of 30 kilos. A system with HybridPACK 2 power module technology is only about the third its size and only weighs approximately 20 kilos compared to other state-of-the-art solutions. The pin-finned copper base plate in HybridPACK 2 not only enhances thermal performance, but also increases reliability.
The HybridPACK 2 modules of Infineon are available in high-volume. Fuji plans to have power modules with HybridPACK 2 footprint available as of 2013.
The automation obituaries
January 27, 2015
What will humans soon have in common with horses? Obsoletion in the work place, if a video on YouTube by CGP Grey is anything ...
TSVs to split more chips: re-integration is the focus
Analog, embedded drive TI upwards in 2014
Maxim exits consumer MEMS, touch sensors
Algorithm indicates the electricity consumption of individual appliances
Graphene enables electrical control light emitter energy flows
January 27, 2015
Scientists from Europe's Graphene Flagship have demonstrated active, in-situ electrical control of energy flow from erbium ...
ARM backs printed electronics startup
Infineon takes the lead in auto semiconductors
Harman continues shopping spree with two software takeovers
- Sensing Elements for Current Measurements
- Investigating Die attach Failure in IGBTs using Power Cycling Tests
- Power Semiconductor Failure Diagnosis using Thermal Characterization and Power Cycling
- Top 5 Trends in Product Development and Test Engineering
InterviewCEO interview: Bosch's IoT startup is all about the system
Thorsten Mueller, CEO of Bosch Connected Devices and Solutions GmbH (Reutlingen, Germany), has been guiding the latest startup subsidiary of Robert Bosch GmbH since 2013 when he started the initiative ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
To ensure you have a good start in 2015, Freescale is giving away five of its QorIQ TWR-LS1021A Tower system modules, worth USD269 each, for EETimes Europe's readers to win.
The module is the most feature-rich and high-performance Tower system offered by Freescale, enabling compatibility and interoperability with the growing list of Tower expansion modules, offering an easily accessible...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.