Intel FinFETs may need SOI to shrink
June 08, 2012 // Peter Clarke
Intel's 22-nm FinFETs show physical variability according to cross-sectional photographs from engineering consultancy Chipworks Inc., (Ottawa, Ontario) and EDA company Gold Standard Simulations Ltd., (GSS) has attempted to model electrical characteristics of various examples.
GSS has already done some TCAD simulation of FinFETs and posted findings in a blog that discussed the fact that at 22-nm Intel's FinFETs are trapezoidal rather than rectangular in cross-section (see Intel's FinFETs are less fin and more triangle).
The latest GSS blog seeks to compare the on-current of differently-shaped FinFETs. It points out that in logic applications multiple fins are connected in parallel, resulting in an averaging of their characteristics, but in SRAM circuits the variability of a single fin is a key characteristic and performance limiter.
TEM images of three Intel FinFETs with the GARAND simulation domain overlaid. Source: GSS
The characteristic dimensions of three FinFETs were fed into the GSS Garand simulator and it revealed that at 22-nm, nature appears to have worked to Intel's advantage. "Despite significant differences in the shape of the three fins, the difference in the on-current is within a 4 percent range," the blog states.
"Compared with process variation across the chip or across the wafer 4 percent is small. But it is additional variation," Professor Asenov told EE Times. He added that the simulation revealed that the FinFET process technology is complex and difficult to implement, partly because of the lack of a planarization process that can level-up shallow trench isolation oxides between transistors. One result of this is that bulk FinFET heights can vary, he said.All news
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