New Products
Intel, ST announce flash memory joint venture
The move is due to see 8,000 employees move to a new, but as yet unnamed, Swiss-headquartered joint-venture in NOR and NAND flash memory that will also encompass developments in chalcogenide phase-change memory.
For Intel (Santa Clara, Calif.) and STMicroelectronics (Geneva, Switzerland) flash memory mainly includes the NOR variety of nonvolatile memory, often used for program storage in mobile equipment. Intel has a NAND flash memory joint-venture with Micron Technology Inc. (Boise, Idaho) called IM Flash Technologies Inc.
The new company would combine R&D, manufacturing and marketing assets drawn from Intel and STMicroelectronics businesses which last year generated approximately $3.6 billion in combined annual revenue.
Under the terms of the agreement STMicroelectronics will sell its flash memory assets, including its share in a Chinese joint-venture with Hynix Semiconductor Inc. and other NOR resources, to the new company while Intel will sell its NOR assets and resources.
In return Intel gets a 45.1 percent equity ownership stake and a $432 million cash payment at close. STMicroelectronics is due to receive a 48.6 percent equity ownership stake and a $468 million cash payment at close. At the same time Francisco Partners will invest $150 million in cash for convertible preferred stock representing a 6.3 percent ownership interest, subject to adjustment in certain circumstances.
"The new company will be positioned to service customers with all of the elements necessary to deliver current and next-generation non-volatile memory technologies, while allowing ST to redefine its participation in flash memory," said Carlo Bozotti, STMicroelectronics' president and CEO, and non-executive chairman designate of the new company, in a statement.
"The new memory company will have the people, scale and technology leadership to meet the needs of customers requiring leading-edge products in this highly competitive marketplace," said Paul Otellini, Intel president and CEO, in the same statement.
"From the outset, the company will be a leading supplier of flash memory solutions for wireless communications," said Brian Harrison, named to become the CEO of the new company at the close of the transaction and currently vice president and general manager of Intel's Flash Memory Group.
"We will be able to offer customers complete solutions with NOR- and NAND-based technologies, which we believe will provide significant opportunities for growth and the potential to develop products for many new application areas and geographic regions." The transaction is subject to regulatory approvals and customary closing conditions and is expected to occur in the second half of 2007.
The new company, to be managed by Brian Harrison as CEO-designate and Mario Licciardello, currently corporate vice president of ST's Flash Memories Group as COO-designate, will be headquartered in Switzerland and incorporated in the Netherlands with nine main research and manufacturing locations around the world and approximately 8,000 employees.
The integration of STMicroelectronics' and Intel's parallel research programs on phase-change memory is also expected to bring the benefits of advanced flash memory technology to potential customers more quickly and efficiently.
Related articles:
ST still in negotiations over flash memory spinoff
Intel to sample phase change memory in 1H 2007
Spansion beats out Intel in handset flash memory
- Future Electronics launches FAI Electronics for improved customer support
- CMOS timing startup raises $2.3 million
- HP releases OpenFlow code for its switches
- Qualcomm, Ericsson demo LTE-to-3G handover
- Graphene institute in Manchester to be funded with £70 million by UK Government
- Nexeon's battery technology claims double triumph at environmental awards
- Advanced mixed-signal process design kit from X-FAB enhanced with Silicon Frontline's post-layout extraction software
- Broadband signal analyzers reduce average cost of signal analysis capability by 55%
- 1-kW industrial quality DC/DC converter offers convection cooling
- LED lighting to drive USD 10bn power supply market in 2016
- Intel makes way for Ivy Bridge by phasing out 25 CPUs
- Shrinking memory bits a million times through antiferromagnetically coupled atoms
- Energy efficient 100-W LED light bulb uses only 12 W
- Analyst claims Windows on ARM will not be much of a success
- Intel, Samsung 'smell blood in the water'
- Nokia's Lumia 900 to lead Windows Phone resurgence
- HokieSpeed, the supercomputer for the masses
- Texas Instruments shows off Pico HD projector that fits into a smartphone
- Osram creates gallium-nitride LED chips on silicon wafers
- Nanometer-thin film enables highest permittivity capacitors
- High-Speed, Real-Time Recording Systems
- Organic solar cells and OLEDs - A comparison of two competing approaches
- USB-Based Thermocouple Temperature Monitor with Cold Junction Compensation
- TTEthernet Scalable Real-Time Ethernet Platform
- IGBT Modules: Data Sheet Comparisons and the Pitfalls of such Comparisons
This month Keithley Instruments is giving away two of its Model 2200 power supplies, worth 735 Euros each, for EETimes Europe's readers to win. The Model 2200-20-5: 20V, 5A, 100W on offer is one of five general-purpose programmable DC power supplies recently launched by the company, designed for source measurement instruments for component, module, and device characterization and test applications.
Part of the Series 2200 family, the unit’s voltage output accuracy is specified at 0.03% and its current output accuracy is 0.05%. The supply’s high output (1mV) and measurement (0.1mA) resolution makes it well-suited for characterizing low power circuits and devices in applications such as measuring idle mode and sleep mode currents to confirm devices can meet today’s ever-more-challenging goals for energy efficiency.
And the winners are:
In our previous reader offer, EPC was giving away ten of its EPC9002 development board kits, worth USD 95 each.
Lucky winners include I. Blythe and C. Hardman from the UK, M. Casartelli and D. Cogliati from Italy, C. Cossio from Spain, W. Milarch from Germany, r. Milewicz from Poland, M. Prascak from Slovakia, A. Raidl from Austria and M. Taslakov from Bulgaria.
All should be receiving their kits soon. Let's wish them some interesting findings with their projects.
NXP Semiconductors
Intel
ARM
Freescale
Linear Technology
Android
LTE
LED
Texas Instruments
IBM
Smartphones
Semiconductor
STMicroelectronics
Analog
MEMS
Wireless
Battery
Maxim Integrated Products
Power Management
Samsung
Analog Devices
TSMC
SoC
Smartphone
Vishay Intertechnology
Solar
Power
IMS Research
FPGA
ABI Research
This site contains articles under license from EETimes Group , a division of United Business Media LLC.



Organic photovoltaics offer greener benefits to provide solar cell
In this news analysis article EE Times Europe Power Management's editor, Paul Buckley quizzes Dr. Martin Pfeiffer, co-founder and CTO of Heliatek GmbH, a global leader and Heliatek's CEO, Thibaud Le Seguillon, ...
