Layer-by-layer 3D selective silicon deposition could cut micro- and nanomanufacturing costs
June 26, 2012 // Julien Happich
Researchers at KTH Microsystem Technology hope to bring mass innovation capabilities to smaller companies and markets with a new approach to MEMS manufacturing, akin to 3D printing.
Production of silicon micro- and nano-sensors such as MEMSs with today's technologies requires a full-scale clean-room laboratory costing millions of euros – facilities that few organisations can afford. Researchers at KTH Microsystem Technology have demonstrated a manufacturing concept that could pave the way toward simple, inexpensive “printing” of 3D silicon structures. The new manufacturing technology consists of a layer-by-layer process for defining 3D patterns in silicon, using focused ion beam writing followed by silicon deposition. The layered 3D silicon structures are defined by repeating these two steps over and over, followed by a final etching step in which the excess silicon material is dissolved away. The researchers note, however, that the system has so far only been tested manually on relatively simple structures, and that more development lies ahead to implement the concept in a manufacturing tool called a 3D printer.
“In a future manufacturing process, the structure would first be designed in a 3D drawing programme. The drawing is then sent to a 3D printer that recreates the structure in silicon, layer by layer from the bottom up,” explains Frank Niklaus, Associate Professor at KTH Microsystem Technology.
In 2011, Frank Niklaus received a grant of EUR 1.5 million (about SEK 15 million) from the European Research Council for his research on new manufacturing paradigms for micro- and nanosystems. Now the researchers are working to refine the process on a larger scale, and they plan to develop a 3D printer that enables the creation of complex 3D silicon nanostructures. The next step is to commercialise the manufacturing technology in collaboration with partners from industry.
With such a tool, KTH Microsystem Technology wants to enable smaller companies and organisations to advance sensors and other technologies beyond multi-million markets currently addressed with MEMS fabs.
Visit KTH Microsystem Technology at www.kth.seAll news
Network testing via smartphone
October 17, 2014
The RANAdvisor Handheld multi-technology radio access network (RAN) analysis solution from JDSU helps wireless network professionals ...
Breakthrough for drive batteries? Ultra-fast battery charges in 2 minutes
When the steering wheel is a computer
Bluetooth beacons nowhere precise enough, says BeSpoon
2D material underpins world’s thinnest electric generator
National Instruments joins CROWD for 5G wireless networks research
October 16, 2014
5G wireless networks will represent a major departure from today's wireless networking structures in terms of bandwidth, ...
Irlynx teams with Leti to develop IR sensor on CMOS
Chip testers meet at VOICE 2015 - Call for Papers
LEDs face power-saving rival based on carbon nanotubes
- 5 Best Practices for Designing Flexible Test Stations
- Intelligent PLCs Expand the Internet of Things
- Solutions for Millimeter Wave Wireless Backhaul
- Enter Linduino
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Oscium is giving away three of its iMSO-204L dual analogue iOS oscilloscopes, worth USD400 each. Designed with native Lightning compatibility, the iMSO-204L transforms the iPad, iPhone, and iPod touch into an ultra-portable, two-channel oscilloscope.
Since Apple changed its connector, Oscium has been working to bring native compatibility to its customers. The third generation...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.