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Leaded laminate copper-moly-copper base packages dissipates heat from high power compound semiconductor devices

June 14, 2012 // Julien Happich

Leaded laminate copper-moly-copper base packages dissipates heat from high power compound semiconductor devices

The LL family of leaded laminate copper-moly-copper (CMC) base packages from StratEdge dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).


These packages handle applications through 6 GHz for use in RF radios for communications, radar, and high power millimeter-wave signals. The series includes two laminate power packages, both with a ratio of 1:3:1 CMC, which provides a good thermal match for alumina-based materials and a GaN chip. The LL802302 is 20.32x9.91mm wide with 2 leads and a raised lid with an epoxy seal. This is a flange package with a bolt hole on each end so the package can be bolted to the printed circuit board. The LL362302 is a flangeless, fully hermetic version of the LL802302 package, and has a flat ceramic lid. StratEdge offers both flange and flangeless styles to accommodate manufacturing processes to either bolt down or solder the package. Hermeticity is especially critical in aerospace and defense applications.


Visit StratEdge at www.stratedge.com

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