Leti and EV Group open common lab on wafer bonding technologies
The lab, which continues more than 10 years of collaboration between the two organizations, is focusing on hardware, software and process development.
“Like all common labs that Leti creates with its partners, this project is designed to produce specific, practical solutions that address current and future market requirements,” said Laurent Malier, CEA-Leti CEO. “This collaboration is targeting results that will make 3D TSV integration more efficient and cost effective and open new areas of wafer bonding using covalent bonding at room temperature.”
“Bringing these approaches to high-volume manufacturing with reliable wafer bonding requires innovative fabrication processes,” said Fabrice Geiger, head of Leti’s Silicon Technology division. “The new equipment and process technology developed within the common lab will allow exciting possibilities, especially for heterogeneous materials stacks, that require very low-temperature wafer bonding.”
Visit the CEA-Leti at www.leti.fr.
Visit the EV Group at www.EVGroup.com
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