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Low profile SMT wire to board system combines space savings with high current capability

November 18, 2013 // Paul Buckley

Low profile SMT wire to board system combines space savings with high current capability

Distributor TTI, Inc., has introduced a Molex ultra-low profile SMT wire-to-board system.


Pico-Lock has a side positive-lock design and is 2.0 mm high when mated, which enables space savings, yet the design's 1.50 mm pitch can accommodate up to 3.0 A.  The combination of low-profile, high current capability and secure mating makes Pico-Lock suitable for many applications including LED/LCD PC/TV displays, gaming machines, smart meters, factory automation equipment, power supplies, security and surveillance systems, tablets and notebooks, automotive infotainment systems/interior electronics and LED lamps and transformers,

Pico-Lock’s side positive locking design is robust, featuring a wide solder tab which wraps up into the header and around the housing for secure PCB retention and mechanical system stability. Mating this small, slim system is easy, thanks to a guide rib on the housing which ensures correct polarization. Pico-Lock also has top friction locks for additional mating assurance and visual mating confirmation.

Rated up to 3.0 A for high signal-line current capability, Pico-Lock features gold-plated copper alloy contacts for durability and reliable electrical performance. Operating temperature range is -25degC to +85degC.  The Pico-Lock system is manufactured from RoHS and low-halogen compliant materials and is available now in 6, 7, 8 and 10 inch circuit sizes.  

Visit TTI at www.ttieurope.com

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