Optimized RF Silicon-On-Insulator (SOI) drives monolithic integration of multi-band radios 
Fully certified FlexRay transceiver enables ESD robust in-vehicle communication
IoT will be next silver screen, says media exec
Hard drives to hit billion-dollar mark by 2017 in video-surveillance applications, says IHS
Li-ion energy storage technology helps make smart grid for Pellworm Island even smarter
Data Fusion: the next frontier of software integration
“Prototype to Production”, the new Digi-Key trademark
STMicro signs memory design agreement with Rambus
X-FAB optimizes 180nm process for portable analog applications
Small cells gaining traction in cellular nets 
Touch screen technology goes behind the display
Supporting Multicore SoCs in critical embedded systems
Commercial fleet telematics in government sector to hit 1.6 billion USD by 2018
Smartphone based patient monitoring is set to impact medical equipment OEMs 
Excelsys with IMCA Electronics for distribution in Turkey
LTE module for packet processing for 4G
October 21, 2010 // Phil Ling
At 4G World, Kontron unveiled its second generation of AdvancedMC packet processor modules featuring the Cavium Networks OCTEON II CN6335 MIPS64 6-core processor. Kontron claims the module has already garnered interest from 4G network equipment vendors seeking a faster time to deployment using standards based hardware platforms such as AdvancedTCA and MicroTCA.
Platform design considerations for the Kontron AM4211 include using it as an eNodeB and LTE network element component or, in combination with full-scale AdvancedTCA blades, as a co-processor Network Interface Card (NIC).
The module can be scaled across both MicroTCA (Picostation, Microstation to Macrostation) and 14-slot AdvancedTCA platforms. The new features of the CN6335 processor on the Kontron AM4211 support 1x 10GbE to the front and software configurable interfaces to the Fabric with either 2x PCIe x4 or SRIO which expands its application usage when configuring systems in combination with standards based third-party Digital Signal Processing (DSP) AMCs.
This next generation packet processor module is said to offer compatible evolution and can meet numerous market requirements when designing high performance 4G network elements, including - increased data plane performance with twice the performance per Watt over existing alternatives; high density computing (9GHz) within a stringent thermal budget (< 40W on 12VDC).
It is interoperable with third party AMCs based on DSP and FPGA. With direct connectivity to FPGA/DSP AMCs in a MicroTCA platform, it is described as a complete solution for MAC processing and L3-L7 processing on single chip, achieving a high throughput of up to 15M packets per second (pps).
For more information, visit www.kontron.com
-
Technology News
Optimized RF Silicon-On-Insulator (SOI) drives monolithic integration of multi-band radios
June 19, 2013
STMicroelectronics has developed a silicon-on-insulator (SOI) CMOS process that can integrate all the RF functions of multi-band ...
-
Technology News
Fully certified FlexRay transceiver enables ESD robust in-vehicle communication
-
Technology News
IoT will be next silver screen, says media exec
-
Market News
Hard drives to hit billion-dollar mark by 2017 in video-surveillance applications, says IHS
-
Technology News
Li-ion energy storage technology helps make smart grid for Pellworm Island even smarter
-
Feature Articles
Data Fusion: the next frontier of software integration
June 19, 2013
In the last few years, the functionality of our mobile devices has come so far that consumers now treat them more like personal ...
-
Business News
“Prototype to Production”, the new Digi-Key trademark
-
Business News
STMicro signs memory design agreement with Rambus
-
Technology News
X-FAB optimizes 180nm process for portable analog applications
Technical papers
Filter Wizard
Check out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFER
Read more
The SoCKIT evaluation kit is Arrow's latest development tool, featuring an Altera Cyclone V SoC with a dual-core ARM Cortex-A9 MPCore processor integrated within its 28nm FPGA fabric.
Altera SoCs allow embedded system developers to differentiate their end product with customized hardware and software, and extend the product lifecycle through hardware and software updates in the field. This month, Arrow Electronics is giving away five SoCKIT evaluation kits featuring Altera’s ARM-Based SoCs, worth €249 each, together with the free entrance to one of Arrow’s SoC workshops organized throughout Europe.
And the winners are...
In our previous reader offer, Freescale Semiconductor was giving away five IMX6Q, Sabre-lite kits, worth £128.06 each.
Lucky winners include Mr. X. Salada Sole from the UK, Mrs A. Peric from Germany, Mr Z. Janosy from Hungary, Mr D. Gacina from Croatia and Mr B. Boris from France. All should be receiving their packages soon. Let's wish them some interesting findings with their projects.
Read more
Design centers
Automotive
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.
Follow us