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Medium power transistors come in 2×2-mm leadless DFN package

Medium power transistors come in 2×2-mm leadless DFN package

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By eeNews Europe



Ideally suited for general-purpose power-sensitive applications in mobile, automotive, industrial and household appliances, the DFN2020-3 (SOT1061) packaging can save up to 80 percent more space on the PCB compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 A. When mounted on state-of-the-art 4-layer PCBs, its thermal performance matches much bigger standard SMD packages and allows P tot levels of up to 1.1 W in a tiny footprint.

Driven by miniaturization in chip design, NXP’s ultra-compact medium power transistors offer design engineers a flexible power transistor solution for designs focusing on space saving, energy efficiency, and low heat dissipation. All NXP medium power transistors are automotive-qualified according to AEC-Q101.

For further information: www.nxp.com.

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