Memory cube group issues initial draft specs
August 15, 2012 // Rick Merritt
The Hybrid Memory Cube Consortium released to its members an initial draft of interface specifications for its 3-D DRAM memory stack. The group is now in final review of the specs with plans to release them publicly near the end of the year.
The group has so far defined two specifications—an interface protocol and a short-reach physical layer channel. The PHY is optimized for use connecting a memory cube and chips sitting multiple inches of printed circuit board traces away in a networking system.
The group will also define an ultra short reach PHY. It aims to extend less than three inches and is optimized to connect the cube with die, probably on a single multi-chip module.
Only members can get access to the initial drafts and provide input on them until the review process is complete and the specs are made public at the end of the year. The group is still open to accepting new members.
The group is led by Micron and Samsung. Other members include Altera, ARM, Hewlett-Packard, IBM, Microsoft, Open-Silicon, SK Hynix and Xilinx.
The spec is primarily targeted at high-performance networking, industrial, and test and measurement applications. IBM has also suggested it will use the cubes for high-end servers. The cubes contain both DRAM memory chips and a memory controller.
Previously, Micron said it will deliver 2 and 4 Gbyte versions of the cubes in early 2013, providing aggregate bi-directional bandwidth of up to 160 Gbytes/second.
Separately, the Jedec standards group is working on a follow on to the 12.8 Gbit/second Wide I/O interface that targets mobile applications processors. The so-called HB-DRAM or HBM effort is said to target a 120-128 Gbyte/second interface and is led by the Jedec JC-42 committee including representatives from Hynix and other companies.
Micrel's 10 criteria for choosing a MEMS foundry
April 18, 2014
Micrel Inc. (San Jose, Calif.) has prepared an article that lays out the 10 criteria to help guide someone in the choice ...
Superconducting qbits made immune to quasiparticle energy loss
The Filter Wizard: Just add a transistor
Mobile display revenues soar, leaving TV behind
European organic PV project aims for material gains
Nanomaterial-packed cathode extends range of EV lithium-sulfur batteries
April 17, 2014
Researchers at the USA's Department of Energy Pacific Northwest National Laboratory have developed a metal organic framework ...
Wearable computing market on 78% CAGR through 2018
OLED TV shipment delays stall OLED material growth
BMW updates navigation via mobile radio connection
- USB 5V 2.5A Output, 42V Input Synchronous Buck with Cable Drop Compensation
- Measurement applications across multiple test platforms
- Supplying DC input power to string inverters
- Supplying DC input power for HEV testing
InterviewHeartbleed challenges the Internet of Thing
The Heartbleed security bug is a key example of the fundamental security challenge for the Internet of Things says Green Hills Software as it launches a new security group.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Arrow Electronics is giving away ten XMC1200 lighting application kits, worth 100 Euros each, for EETimes Europe's readers to win.
Each kit combines Infineon’s brightness and colour control XMC1200 CPU board to drive flicker free LED dimming and colour changing, together with a colour LED card and a white LED card.
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.