MEMS packaging market to reach USD2.3B by 2016, says Yole Développement
April 04, 2012 // Julien Happich
In its new report “MEMS Packaging”, Yole Développement analyzed the packaging, assembly & test requirements of MEMS, application by application, it also focused on MEMS package substrates.
According to the market research firm, the MEMS packaging market is growing twice as fast as the IC packaging market, with a CAGR of 20% in terms of package unit shipments. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come. There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators.
According to the report, there is no doubt that MEMS content is growing faster than standard IC content. In terms of how the packaging is involved, it's all about orchestrating the assembly of MEMS sensor and their related ASIC inside a module. But this is costly: packaging, assembly, test and calibration steps account for nearly 35% to 60% of a total MEMS packaged modules cost. MEMS types of packaging are more complex than most standard IC packages because they require System-in-Package type of assembly. Additionally, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.
Imagination positions itself for 802.11ah for the Internet of Things
July 24, 2014
Imagination Technologies has developed a low power configurable radio architecture for the wide range of existing and emerging ...
Smartwatches suck, says Pebble backer
Broadcom cuts 2,500 jobs to exit cellular market
Photographic method to survey magnetic field
Signal Integrity guru puts comprehensive SI training online
Failed merger talks won't stop Dialog
July 23, 2014
AMS, formerly known as Austriamicrosystems, and Dialog Semiconductor couldn't agree the terms of a merger, which feels like ...
Peregrine Semiconductor and RF Micro Devices settle all litigation
Atomic clock based on a chip-scale frequency comb
RFID tags track honey bees
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
- Exploring the Business Model Evolution of High-Tech Equipment Manufacturers
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.