Modular system integration on flexible film substrates
June 08, 2012 // By Christof Landesberger, Erwin Yacoub-George and Karlheinz Bock
The development of flexible electronic systems has become an important field of research in industry and at research institutions worldwide.
The main objectives are the integration of different electronic components and functionalities like batteries, displays, microcontroller ICs, sensors and passive components on a flexible substrate. The first motivation for a flex-to-flex integration concept is the potentially free form factor, which allows placing of film based systems on curved surfaces or in very thin housings.
Read the full article on page 42 of our June digital edition.All news
Do head-up displays lead the wrong way to safety?
June 30, 2015
In vehicles, head-up displays (HUDs) have been developed to reduce driver distraction and help drivers to keep their eyes ...
ZF sets course to driver assistance
Advanced packaging to boost photolithography market, says Yole
Nanogenerator harvests energy from rolling tires
Tactical panoramic video ball creeps in
Conductive ink turns textiles into stretchable electronics
June 29, 2015
University of Tokyo researchers have developed an ink that can be printed on textiles in a single step to form highly conductive ...
Apple Watch tear down reveals European chips
GlobalFoundries’ FD-SOI revolution
Exploring through-wall presence detection
- The 400XAC Series: Two Major Advantages that Simplify Functional Testing
- A Smart Way to Drive ECU Consolidation
- Autonomous Driving: An Eye on the Road Ahead
- Getting Security Right in Wireless Sensor Networks
InterviewCEO interview: Cadence is about enablement, collaboration
EDA companies are being asked to provide expertise from the circuit- to the system-level observes Lip-Bu Tan, CEO of EDA software vendor Cadence Design Systems Inc. Covering such a breadth of endeavour ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Future Electronics has 20 of Intersil's ISL8203MEVAL2Z evaluation boards to give away to EETimes Europe's readers. Worth 95 US dollars, the board was designed to demonstrate the performance of the ISL8203M dual step-down power module which integrates a PWM controller, synchronous switching MOSFETs, inductors, and passives all in a 9.0x6.5x1.83mm package.
The ISL8203M is rated for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.