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Modular system integration on flexible film substrates

June 08, 2012 // By Christof Landesberger, Erwin Yacoub-George and Karlheinz Bock

Modular system integration on flexible film substrates

The development of flexible electronic systems has become an important field of research in industry and at research institutions worldwide.


The main objectives are the integration of different electronic components and functionalities like batteries, displays, microcontroller ICs, sensors and passive components on a flexible substrate. The first motivation for a flex-to-flex integration concept is the potentially free form factor, which allows placing of film based systems on curved surfaces or in very thin housings.

Read the full article on page 42 of our June digital edition.

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