Modular system integration on flexible film substrates
June 08, 2012 // By Christof Landesberger, Erwin Yacoub-George and Karlheinz Bock
The development of flexible electronic systems has become an important field of research in industry and at research institutions worldwide.
The main objectives are the integration of different electronic components and functionalities like batteries, displays, microcontroller ICs, sensors and passive components on a flexible substrate. The first motivation for a flex-to-flex integration concept is the potentially free form factor, which allows placing of film based systems on curved surfaces or in very thin housings.
Read the full article on page 42 of our June digital edition.All news
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This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
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Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.