MOSFETs in ultra-slim molded chip scale package designs
December 19, 2012 // Paul Buckley
Alpha and Omega Semiconductor Limited (AOS) has released a family of low on-resistance 8 V, 20 V, and 30 V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of 0.3 mm to provide a solution for ultra-slim designs.
Compared to existing CSP solutions the new family reduces package height by 50% and improves the overall mechanical robustness of the package. The performance enhancements offered by the MCSP technology, make these new devices ideal for the latest ultra-portable applications such as smart phones, tablet PCs, ultrabooks, and other mobile hand-held devices.
The proprietary MCSP packaging technology encapsulates AOS' low on-resistance MOSFET silicon in a protective Green (halogen-free) molding compound. The resulting product provides a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products. The new family of MCSP devices offers major performance benefits and at the same time can easily replace industry standard CSP devices by offering the same footprint, pin-out, and pitch.
The new portfolio of MCSP products includes n- and p-channel devices with VDS ratings from 8 V to 30 V in package options of 0.97 mm x 0.97 mm and 1.57 mm x 1.57 mm. AOC2414, AOC2421, and AOC2422 have guaranteed ultra-low on-resistance rated at 1.2 VGS which helps designers to simplify drive circuitry, lower power consumption and extend battery life in ultra-portable applications.
Availability and Pricing
All mentioned devices are available in production quantities with a lead-time of 12 weeks. The unit price for 1,000 pieces ranges from $0.23 to $0.30, depending on the device.
More information about the MCSP devices at www.aosmd.com/search?q=MCSP
Micrel's 10 criteria for choosing a MEMS foundry
April 18, 2014
Micrel Inc. (San Jose, Calif.) has prepared an article that lays out the 10 criteria to help guide someone in the choice ...
Superconducting qbits made immune to quasiparticle energy loss
The Filter Wizard: Just add a transistor
Mobile display revenues soar, leaving TV behind
European organic PV project aims for material gains
Nanomaterial-packed cathode extends range of EV lithium-sulfur batteries
April 17, 2014
Researchers at the USA's Department of Energy Pacific Northwest National Laboratory have developed a metal organic framework ...
Wearable computing market on 78% CAGR through 2018
OLED TV shipment delays stall OLED material growth
BMW updates navigation via mobile radio connection
- USB 5V 2.5A Output, 42V Input Synchronous Buck with Cable Drop Compensation
- Measurement applications across multiple test platforms
- Supplying DC input power to string inverters
- Supplying DC input power for HEV testing
InterviewHeartbleed challenges the Internet of Thing
The Heartbleed security bug is a key example of the fundamental security challenge for the Internet of Things says Green Hills Software as it launches a new security group.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Arrow Electronics is giving away ten XMC1200 lighting application kits, worth 100 Euros each, for EETimes Europe's readers to win.
Each kit combines Infineon’s brightness and colour control XMC1200 CPU board to drive flicker free LED dimming and colour changing, together with a colour LED card and a white LED card.
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.