MOSFETs in ultra-slim molded chip scale package designs
December 19, 2012 // Paul Buckley
Alpha and Omega Semiconductor Limited (AOS) has released a family of low on-resistance 8 V, 20 V, and 30 V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of 0.3 mm to provide a solution for ultra-slim designs.
Compared to existing CSP solutions the new family reduces package height by 50% and improves the overall mechanical robustness of the package. The performance enhancements offered by the MCSP technology, make these new devices ideal for the latest ultra-portable applications such as smart phones, tablet PCs, ultrabooks, and other mobile hand-held devices.
The proprietary MCSP packaging technology encapsulates AOS' low on-resistance MOSFET silicon in a protective Green (halogen-free) molding compound. The resulting product provides a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products. The new family of MCSP devices offers major performance benefits and at the same time can easily replace industry standard CSP devices by offering the same footprint, pin-out, and pitch.
The new portfolio of MCSP products includes n- and p-channel devices with VDS ratings from 8 V to 30 V in package options of 0.97 mm x 0.97 mm and 1.57 mm x 1.57 mm. AOC2414, AOC2421, and AOC2422 have guaranteed ultra-low on-resistance rated at 1.2 VGS which helps designers to simplify drive circuitry, lower power consumption and extend battery life in ultra-portable applications.
Availability and Pricing
All mentioned devices are available in production quantities with a lead-time of 12 weeks. The unit price for 1,000 pieces ranges from $0.23 to $0.30, depending on the device.
More information about the MCSP devices at www.aosmd.com/search?q=MCSP
Failed merger talks won't stop Dialog
July 23, 2014
AMS, formerly known as Austriamicrosystems, and Dialog Semiconductor couldn't agree the terms of a merger, which feels like ...
XCore architecture attracts Bosch investment
Steep growth for thermoelectric energy harvesting, says Infinergia Consulting
AMS, Dialog merger talks fail
MIT wrist-robot adds extra fingers
Li-ion batteries market for EVs to quadruple in a decade
July 22, 2014
Worldwide revenues from Li-ion batteries for all consumer EVs will grow from $5.7 billion in 2014 to $24.1 billion in 2023, ...
Monolithic Power Systems signs with Avnet Memec
Thoughts on energy harvesting for wearable equipment
Will laser ignition replace the venerable spark plug?
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
- Exploring the Business Model Evolution of High-Tech Equipment Manufacturers
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.