Nanotechnology switches back to vacuum transistors at low voltage
July 03, 2012 // Peter Clarke
Researchers at the University of Pittsburgh have come up with a device structure that allows a switch back to vacuum, in contrast to the solid-state, as the medium for electron transport in transistors.
The team is proposing a MOS vertical structure with a triple layer of metal/silicon dioxide/silicon exposed on the side by a deep trench. The metal and silicon layers form the anode and cathode of the device, separated by the insulating silicon dioxide, and the electron transport occurs in the vertical direction through the vacuum.
The work is discussed in a research paper entitled Metal-oxide-semiconductor field effect transistor with a vacuum channel, published in Nature Nanotechnology July 1.
The work represents a return to the roots of electronics. The solid-state transistor was invented in 1947 as a replacement for the bulky, unreliable vacuum tube. Vacuum tube style electronics in miniature made using solid-state semiconductor manufacturing techniques have been tried before, but the concept has struggled to overcome requirements for high voltage and issue of compatibility with the incumbent solid-state CMOS technology.
A team under Hong Koo Kim, principal investigator on the project and a Professor in the University of Pittsburgh's Swanson School of Engineering, has redesigned the structure of the vacuum electronic device. With the assistance of PhD candidate Siwapon Srisonphan and postdoctoral fellow Yun Suk Jung Kim and his team discovered that electrons trapped inside a semiconductor at the interface with an oxide or metal layer can be easily extracted out into the air. The electrons at the material interface form a sheet of charges, a two-dimensional electron gas and Kim found that the Coulombic repulsion of the electrons for each other enables the easy emission of electrons out of the silicon.
This allows the creation of a low-voltage device in which the electrons travel ballistically in air in a nanometer-scale channel without any collisions or scattering.
The channel length is of the order of 20-nm and the team measured a transconductance of 20-nS per micron and an on/off ratio of 500 and turn-on gate voltage of 0.5-V under ambient conditions, according to the paper's abstract.
"The emission of this electron system into vacuum channels could enable a new class of low-power, high-speed transistors, and it's also compatible with current silicon electronics, complementing those electronics by adding new functions that are faster and more energy efficient due to the low voltage," said Professor Kim, in a statement.
Nature Nanotechnology article
-
Technology News
Floating surge stopper provides unlimited overvoltage protection
May 17, 2013
Protecting sensitive electronic circuitry from voltage transients is an essential part of any system be it automotive, industrial, ...
-
Technology News
Altera to integrate Enpirion power interfaces into its FPGAs
-
Technology News
Automation CAN group plans permanent interoperability test capability
-
Feature Articles
Opening up new user-interaction scenarios with Time-of-Flight measurements
-
Technology News
Goepel electronic initiates Cooperation Network with EMS companies
-
Market News
The number of charging stations for electrical vehicles is expected to soar by 20220, study says
May 17, 2013
The number of electric vehicle charging stations is set to soar globally by 2020, supporting a shift in driving away from ...
-
Market News
In automotive lighting, LEDs still lacks of horsepower, study says
-
Technology News
Ultra-low-power SoC supports world's smallest Bluetooth location stickers
-
Business News
Imec and Renesas collaborate on ultra-low power short range radios
Technical papers
Filter Wizard
Linear video channel
READER OFFER
Read more
The development platform for i.MX 6Quad from element14 (built to the Freescale SABRE Lite design) is an evaluation platform featuring the powerful i.MX 6Q, a multimedia application processor with Quad ARM Cortex-A9 cores at 1.2 GHz from Freescale Semiconductor.
This month, Freescale and element14 are giving away five such platforms, worth £128.06 each, for EETimes Europe's readers to win. The platform helps evaluate the rich set of peripherals and includes a 10/100/Gb Ethernet port, SATA-II, HDMI v1.4, LVDS, parallel RGB interface, touch screen interface, analog headphone/microphone, micro TF and SD card interface, USB, serial port, JTAG, camera interface, and input keys for Android.
And the winners are...
In our previous reader offer, Pico Technology was giving away one of its recently launched PicoScope 3207B, a 2-channel USB 3.0 oscilloscope worth 1451 Euros. Lucky winner Mr L. Sanchez-Gonzalez from Spain should be receiving his PicoScope 3207B soon. Let's wish them some interesting findings with his projects.
Read more
Design centers
Automotive
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.
Floating surge stopper provides unlimited overvoltage protection
Altera to integrate Enpirion power interfaces into its FPGAs
Automation CAN group plans permanent interoperability test capability
Opening up new user-interaction scenarios with Time-of-Flight measurements
Goepel electronic initiates Cooperation Network with EMS companies
The number of charging stations for electrical vehicles is expected to soar by 20220, study says
In automotive lighting, LEDs still lacks of horsepower, study says
Ultra-low-power SoC supports world's smallest Bluetooth location stickers
Imec and Renesas collaborate on ultra-low power short range radios
European Semiconductor Distribution Market shows sequential recovery in Q1/CY13
Omron appoints TME to strengthen presence in Eastern Europe
Avnet Supply Chain Solutions launches RaBET Tool in Europe
sureCore receives £250K SMART Award to prototype its low power SRAM technology
Amantys partners Fuji Electric to launch IGBT gate drivers for wind and solar markets
Cambridge Nanotherm starts mass manufacturing of thermal management substrate

Follow us