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NEC joins IBM's global chip process partnership

September 11, 2008 //

IBM Corp. (Armonk, N.Y.) and NEC Electronics Corp. (Kawasaki, Japan) have announced they have entered into a multi-year joint development agreement under which they will develop next-generation semiconductor process technology.


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LONDON IBM Corp. (Armonk, N.Y.) and NEC Electronics Corp. (Kawasaki, Japan) have announced they have entered into a multi-year joint development agreement under which they will develop next-generation semiconductor process technology.

Under the agreement, NEC Electronics will participate in a joint development project for the next-generation core CMOS process, at the 32-nm node, and in advanced fundamental research for leading-edge semiconductor technologies of the future.

NEC is joining Chartered Semiconductor Manufacturing Ltd., Freescale Semiconductor Inc., Infineon Technologies AG, Samsung Electronics Co. Ltd., STMicroelectronics NV and Toshiba Corp. in the Common Platform Alliance.NEC Electronics will be the eighth major semiconductor manufacturer represented in the IBM joint development alliance aimed to further advance performance and power improvements for next generation silicon technologies.

"As the 'scaling' of semiconductors to ever smaller feature sizes continues, the cost of conducting basic research and development and the associated capital investment continues to rise," said Gary Patton, vice president, IBM Semiconductor Research & Development Center, in a statement. "Our unique collaborative model for semiconductor research and development helps to mitigate individual investment while allowing for increased design complexity, shortened time-to-market and quicker integration of next-generation process materials and technology nodes."

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