New WLCSP packaged PLD offers benefits for low density PLD designs
September 06, 2011 // Paul Buckley
Lattice Semiconductor Corporation has begun shipping samples of the company’s MachXO2 PLD family using a 2.5 mm x 2.5 mm 25-ball Wafer Level Chip Scale Package (WLCSP). The MachXO2 devices now claim to combine a small footprint with the industry’s lowest power and most feature rich low density PLDs.
Built on a low power 65 nm process featuring embedded Flash technology, the MachXO2 family delivers a 3X increase in logic density, a 10X increase in embedded memory and more than a 100X reduction in static power compared to previous generations. With the industry’s most robust PLD functionality, ultra low power and new WLCSP packaging, the MachXO2 devices can now address applications previously not accessible to PLDs.
The MachXO2 family leads the industry in providing the lowest power and highest functionality of any PLD family. Now Lattice is extending its lead in the low density PLD market by offering a portfolio of small footprint die/package combinations for the MachXO2 family to be made available throughout 2011, including:
- A 2.5 mm x 2.5 mm 25-ball WLCSP, shipping immediately: Die size-defined BGA with 0.4mm solder ball pitch, providing 19 user I/O in a 6.1 mm2 footprint
- A 3.2 mm x 3.2 mm 49-ball WLCSP: Die size-defined BGA with 0.4 mm solder ball pitch, providing 40 user I/O in a 9.8 mm2 footprint
- A 4 mm x 4 mm 64-ball ucBGA: Saw singulated BGA with 0.4 mm solder ball pitch, providing 45 user I/O in a 16.0 mm2 footprint
- A 8 mm x 8 mm 132-ball ucBGA: Saw singulated BGA with 0.5 mm solder ball pitch, providing up to 105 user I/O in a 64.0 mm2 footprint
“We have combined aggressive packaging technologies to deliver some of the smallest PLD footprints ever in the programmable logic industry. When these footprints are combined with the superior functionality and ultra-low power available on the MachXO2 devices, we are able to address a new class of applications not previously available to SRAM-based PLDs,” said Shakeel Peera, Director of Marketing for Silicon and Solutions at Lattice Semiconductor. “There is little doubt that consumer device connectivity and space constraints are moving in opposite directions. These new MachXO2 devices will enable new possibilities for digital logic designers focused on these space constrained applications, without having to sacrifice flexibility or programmability.”
MachXO2 LCMXO2-1200ZE devices in the 25 WLCSP are now available as engineering samples, with production devices scheduled to be available by Q4 2011. All other ultra-low footprint packages mentioned in this news release will be sampling by the end of 2011. Pricing for the LCMXO2-1200ZE 25WLCSP is $0.80 in 500KU volume.
More information about the Lattice MachXO2 PLD family at http://www.latticesemi.com/machxo2/tiny.
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Internet of Things (IoT) manufacturer Ciseco has launched the Raspberry Pi ‘Wireless Inventors Kit’ (RasWIK), featuring 88 pieces to provide everything a Pi owner needs to follow a series of step-by-step projects or to create their own wireless devices, without the need for configuration or even writing code.
RasWIK has been designed to be highly accessible, demystifying the dark art of wireless and enabling anyone with basic computing skills to begin building wireless devices with a Raspberry Pi. You can create anything from a simple traffic light, to a battery monitor, or even a temperature gauge that sends data to the Xively IoT cloud so billions can access the data.This month, Ciseco is giving away twelve Raspberry Pi Wireless Inventors kits, worth £49.99 each for EETimes Europe's readers to win.
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In our previous reader offer, Farsens was giving away five kits for EEtimes Europe readers to evaluate its FenixVortex, Kineo and X1 wireless, battery free sensor tags.
Lucky winners include Mr A. Neil from the UK, Mr. E. Delvaux from Belgium, Mr Lengal from the Czech Republic, Mr H. Bijlsma from the Netherlands, and Mr G. Pfaff from Germany. All should be receiving their packages soon. Lets wish them some interesting findings with their projects.
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