ON Semiconductor reveals industry's lowest capacitance ESD protection for high bandwidth interfaces
May 11, 2011 // Paul Buckley
ON Semiconductor has released a new device for integrated electrostatic discharge (ESD) protection for use in notebooks, tablets, and external storage devices.
The new ESD7004 is specifically designed to preserve signal integrity in high speed applications such as USB 3.0 (5 gigabits per second, Gb/s) and eSATA (up to 6 Gb/s). The device breaks the current industry capacitance barrier offering an ultra low 0.4 pF rating, while maintaining low ESD clamping voltage.
As high speed interfaces exceed 5 Gb/s, a few tenths of a picofarad capacitance can have a major effect on the signal integrity of the data being transmitted. By lowering the capacitance down to 0.4 pF typical, 0.5 pF maximum, the ESD7004 offers an ESD protection solution that has virtually no effect on eye diagrams of USB 3.0 at 5 Gb/s and eSATA at 6 Gb/s. In addition, these parts maintain less than 1 db insertion loss at over 8 GHz during S21 measurements, ensuring negligible effect on high speed data transmission.
Utilizing ON Semiconductor's patented ESD protection silicon which incorporates innovative isolation techniques, the ESD7004 offers extremely low clamping voltages and fast response time during ESD events. These designs boast clamping voltages at 11.4 V or less during Transmission Line Pulse (TLP) ±8 amperes (A) testing which safeguards chipsets using small geometries and low voltage tolerances, common for high speed datalines. An ESD rating of 15 kV contact per the IEC61000-4-2 standard and low turn on resistance during ESD events ensures that the most sensitive chipsets will be safe from ESD threats.
This ESD7004 is offered in the uDFN 2.5 mm x 1.0 mm x 0.5 mm 10-pin package which integrates four lines of protection in a flow through routing pinout that enable board designers to route traces easily with minimal impact to impedance matching. Budgetary pricing for this device is $0.097 per unit in 10,000 unit quantities.
Visit ON Semiconductor at www.onsemi.com.
3D Sound Labs cracks user-centric surround sound
April 27, 2015
French startup 3D Sound Labs is now taking pre-orders for its Neoh headphones which it claims produce a truly immersive, ...
Carbon-nanotube sensor detects rotting meat
Wireless charging gets universal antenna
European Space Agency to send ultracapacitors into orbit
A clean MIPS slate for academia
Design win; IDT meets IKEA
April 24, 2015
Integrated Device Technology, Inc. (IDT) has disclosed that IKEA has chosen IDT’s wireless power transmitters to embed in ...
Eurotech to offload its cloud offering to iNebula
Electric vehicles: Driving range decides
Samsung details its flex display
- Smart Capacitive Design Tips
- Wireless MCUs and IoT
- Battery Management System Tutorial
- Deciding if Automated Test is right for your Company
InterviewInfineon: CAN FD success goes at the expense of FlexRay
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay. ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, DecaWave is offering EETimes Europe's readers the chance to win two TREK1000 kits to evaluate its Ultra-Wideband (UWB) indoor location and communication DW1000 chip in different real-time location system topologies.
Worth €947, the kit allow designers to prove a concept within hours and have a prototype ready in days. Based on the two-way ranging scheme, the kit lets you test...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.