Fully certified FlexRay transceiver enables ESD robust in-vehicle communication
IoT will be next silver screen, says media exec
Hard drives to hit billion-dollar mark by 2017 in video-surveillance applications, says IHS
Li-ion energy storage technology helps make smart grid for Pellworm Island even smarter
Data Fusion: the next frontier of software integration
“Prototype to Production”, the new Digi-Key trademark
STMicroelectronics signs memory design agreement with Rambus
X-FAB optimizes 180nm process for portable analog applications
Small cells gaining traction in cellular nets 
Touch screen technology goes behind the display
Supporting Multicore SoCs in critical embedded systems
Commercial fleet telematics in government sector to hit 1.6 billion USD by 2018
Smartphone-based patient monitoring is set to impact medical equipment OEMs 
Excelsys with IMCA Electronics for distribution in Turkey
On the photonics roadmap: chip-to-chip and intra-chip interconnects
July 20, 2012 // By Julien Happich
The CEA-LETI annual review that took place late June was an opportunity to catch up with the state-of-the-art in microsystems and microelectronics.
Among the many lectures running in parallel, my bet was that a whole afternoon session on photonics would fill-up my curiosity on the topic. The different presenters all acknowledged that copper alone would not suffice to match the speed and data density required by future generations of consumer devices, with data streams expected in the TeraFLOPS range.
Read the full article on page 10 of our July/August digital edition.
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Technology News
Fully certified FlexRay transceiver enables ESD robust in-vehicle communication
June 19, 2013
Infineon Technologies is expanding its portfolio of LIN and CAN automotive communications ICs with its first FlexRay transceiver, ...
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Technology News
IoT will be next silver screen, says media exec
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Market News
Hard drives to hit billion-dollar mark by 2017 in video-surveillance applications, says IHS
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Technology News
Li-ion energy storage technology helps make smart grid for Pellworm Island even smarter
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Feature Articles
Data Fusion: the next frontier of software integration
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Business News
“Prototype to Production”, the new Digi-Key trademark
June 18, 2013
Digi-Key has received registered trademarks for the phrases, “Prototype to Production®” and “From Prototype to Production®” ...
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Business News
STMicroelectronics signs memory design agreement with Rambus
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Technology News
X-FAB optimizes 180nm process for portable analog applications
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Feature Articles
Small cells gaining traction in cellular nets
Technical papers
Filter Wizard
Check out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
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READER OFFER
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The SoCKIT evaluation kit is Arrow's latest development tool, featuring an Altera Cyclone V SoC with a dual-core ARM Cortex-A9 MPCore processor integrated within its 28nm FPGA fabric.
Altera SoCs allow embedded system developers to differentiate their end product with customized hardware and software, and extend the product lifecycle through hardware and software updates in the field. This month, Arrow Electronics is giving away five SoCKIT evaluation kits featuring Altera’s ARM-Based SoCs, worth €249 each, together with the free entrance to one of Arrow’s SoC workshops organized throughout Europe.
And the winners are...
In our previous reader offer, Freescale Semiconductor was giving away five IMX6Q, Sabre-lite kits, worth £128.06 each.
Lucky winners include Mr. X. Salada Sole from the UK, Mrs A. Peric from Germany, Mr Z. Janosy from Hungary, Mr D. Gacina from Croatia and Mr B. Boris from France. All should be receiving their packages soon. Let's wish them some interesting findings with their projects.
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Automotive
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.
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