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On the photonics roadmap: chip-to-chip and intra-chip interconnects

July 20, 2012 // By Julien Happich

On the photonics roadmap: chip-to-chip and intra-chip interconnects

The CEA-LETI annual review that took place late June was an opportunity to catch up with the state-of-the-art in microsystems and microelectronics.

Among the many lectures running in parallel, my bet was that a whole afternoon session on photonics would fill-up my curiosity on the topic. The different presenters all acknowledged that copper alone would not suffice to match the speed and data density required by future generations of consumer devices, with data streams expected in the TeraFLOPS range.

Read the full article on page 10 of our July/August digital edition.

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This month, FTDI Chip is giving away six MCU development board packages complete with a dedicated compiler (including a full integrated development environment).

Worth Euro 315 each, the packages include a credit card sized Clicker 2 board for the FT90X 32-bit MCU supplied alongside a powerful dedicated compiler from MikroElektronika.


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