Optimise Thermal Management of ChiP Products
March 20, 2014 // Gary Gill, Vicor // 0 commentsDownload White Paper 979Ko
Vicor's new ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as through the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency. The latest white paper from Vicor describes a model of the thermal performance of the ChiP plaform and looks at the range of online design tools available to help designers optimise the thermal performance of their systems.
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To ensure you have a good start in 2015, Freescale is giving away five of its QorIQ TWR-LS1021A Tower system modules, worth USD269 each, for EETimes Europe's readers to win.
The module is the most feature-rich and high-performance Tower system offered by Freescale, enabling compatibility and interoperability with the growing list of Tower expansion modules, offering an easily accessible and interchangeable suite of capabilities and features to support rapid prototyping as well as software development programs.Built around the QorIQ LS1021A processor, incorporating dual ARM Cortex-A7 cores running up to 1GHz and delivering more than 5,000 Coremarks of performance, the TWR-LS1021A is engineered to enable a wide range of applications, from IoT gateways to industrial controllers, secure access points and asset management systems. MORE INFO AND LAST MONTH' WINNERS...
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