Print  |  Send  |   

Optimise Thermal Management of ChiP Products

March 20, 2014 // Gary Gill, Vicor // 0 comments

Optimise Thermal Management of ChiP Products Download White Paper 979Ko

Vicor's new ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as through the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency. The latest white paper from Vicor describes a model of the thermal performance of the ChiP plaform and looks at the range of online design tools available to help designers optimise the thermal performance of their systems.


All White Papers


Submit a white paper

Follow us

Fast, Accurate & Relevant for Design Engineers only!

Technical papers     

Linear video channel

READER OFFER

Read more

This month, Future Electronics has 20 of Intersil's ISL8203MEVAL2Z evaluation boards to give away to EETimes Europe's readers. Worth 95 US dollars, the board was designed to demonstrate the performance of the ISL8203M dual step-down power module which integrates a PWM controller, synchronous switching MOSFETs, inductors, and passives all in a 9.0x6.5x1.83mm package.

The ISL8203M is rated for dual 3A output current or 6A current sharing operation with an input range of 2.85V to 6V. Each of the two channels employs the current mode pulse width modulation scheme for fast transient response and pulse-by-pulse current limiting.

MORE INFO AND LAST MONTH' WINNERS...

Design centers     

Automotive
Infotainment Making HDTV in the car reliable and secure

December 15, 2011 | Texas instruments | 222901974

Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.

 

You must be logged in to view this page