Print  |  Send  |   

Optimise Thermal Management of ChiP Products

March 20, 2014 // Gary Gill, Vicor // 0 comments

Optimise Thermal Management of ChiP Products Download White Paper 979Ko

Vicor's new ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as through the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency. The latest white paper from Vicor describes a model of the thermal performance of the ChiP plaform and looks at the range of online design tools available to help designers optimise the thermal performance of their systems.


All White Papers


Submit a white paper

Follow us

Fast, Accurate & Relevant for Design Engineers only!

Technical papers     

Linear video channel

READER OFFER

Read more

This month, Oscium is giving away three of its iMSO-204L dual analogue iOS oscilloscopes, worth USD400 each. Designed with native Lightning compatibility, the iMSO-204L transforms the iPad, iPhone, and iPod touch into an ultra-portable, two-channel oscilloscope.

Since Apple changed its connector, Oscium has been working to bring native compatibility to its customers. The third generation of handheld engineering tools from Oscium, the iMSO-204L is the solution to the connector change, featuring two analogue and four digital channels, capable of 50 MSPS at a 5MHz bandwidth, and with a resolution varying from 200ns/div to 10s/div.

MORE INFO AND LAST MONTH' WINNERS...

Design centers     

Automotive
Infotainment Making HDTV in the car reliable and secure

December 15, 2011 | Texas instruments | 222901974

Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.

 

You must be logged in to view this page

Login here :