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Optimise Thermal Management of ChiP Products

March 20, 2014 // Gary Gill, Vicor // 0 comments

Optimise Thermal Management of ChiP Products Download White Paper 979Ko

Vicor's new ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as through the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency. The latest white paper from Vicor describes a model of the thermal performance of the ChiP plaform and looks at the range of online design tools available to help designers optimise the thermal performance of their systems.


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This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.

Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for direct mounting on a NEMA 17 motor. Pre-programmed and pre-configured with all operating parameters to support standard 1.5A (peak) motors, the TMCM-1043 board uses Trinamic´s single-axis TMC2660 stepper motor driver IC, which integrates a motor pre-driver and power MOSFETs.

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