Package-on-Package capability now available as a low volume option
June 11, 2012 // Julien Happich
Escatec has added Package-on-Package (PoP) capability to its production facilities at Heerbrugg in Switzerland. PoP enables one BGA package, such as a memory chip, to be soldered on top of another BGA, such as a processor.
Martin Muendlein, ESCATEC's Engineering Manager, explained, "Until now, PoP has only been used in high volume applications such as mobile phones, where it provides high density packaging, low power and high performance. We believe that we are one of the first contract manufacturers in Europe to offer this as a low volume option to customers. It is ideal for customers wanting to make portable devices that need high performance processors and where space is tight. We already have one customer wanting to use PoP for their next generation of a hand held terminal."
The company has invested in a special dipping unit for its new Siplace assembly line that will enable it to do PoP. The dipping unit wets about 50% of each ball of the Ball Grid Array with paste/flux. Before reflow, both components are stacked on each other and then both are soldered in one process step. During the soldering the upper device sinks down so that, in the final assembly, there is virtually no gap between the two stacked chips. Verification of accurate bonding between the layers of the PoP stack is checked using X-Ray inspection. The darker balls are from the upper BGA and the lighter balls are from the lower BGA.
Visit Escatec at www.escatec.comAll news
The future of custom ASICs
February 26, 2015
With the prevailing view that Moore's Law is slowing Donnacha O’Riordan, director of services strategy for S3 Group, gives ...
Save me from the overbearing analytics of IoT
5 trends to watch at Mobile World Congress
Infineon: CAN FD success goes at the expense of FlexRay
Who will partner LG to stimulate OLED TV sector?
Printed NFC tags detect opened goods
February 25, 2015
Thin Film Electronics ASA, a long-time pioneer of organic electronics, has announced a near-field communications (NFC) passive ...
Geo selects S3 DAC IP for video processor
Nanoscale defect detection focuses on lowering solar panel costs
Flexible organic circuit makes fever alarm
- Software-Defined Radio Handbook
- A Four-Quadrant DC/DC Switching Regulator Smoothly Transitions from Positive to Negative Output Voltages for FPGA and Other Applications
- LED Driver with Integrated Spread Spectrum Reduces EMI without Adding Flicker
- Accelerate SDN and NFV with Off-the-Shelf Software
InterviewInfineon: CAN FD success goes at the expense of FlexRay
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay. ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
To ensure you have a good start in 2015, Freescale is giving away five of its QorIQ TWR-LS1021A Tower system modules, worth USD269 each, for EETimes Europe's readers to win.
The module is the most feature-rich and high-performance Tower system offered by Freescale, enabling compatibility and interoperability with the growing list of Tower expansion modules, offering an easily accessible...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.