Package-on-Package capability now available as a low volume option
June 11, 2012 // Julien Happich
Escatec has added Package-on-Package (PoP) capability to its production facilities at Heerbrugg in Switzerland. PoP enables one BGA package, such as a memory chip, to be soldered on top of another BGA, such as a processor.
Martin Muendlein, ESCATEC's Engineering Manager, explained, "Until now, PoP has only been used in high volume applications such as mobile phones, where it provides high density packaging, low power and high performance. We believe that we are one of the first contract manufacturers in Europe to offer this as a low volume option to customers. It is ideal for customers wanting to make portable devices that need high performance processors and where space is tight. We already have one customer wanting to use PoP for their next generation of a hand held terminal."
The company has invested in a special dipping unit for its new Siplace assembly line that will enable it to do PoP. The dipping unit wets about 50% of each ball of the Ball Grid Array with paste/flux. Before reflow, both components are stacked on each other and then both are soldered in one process step. During the soldering the upper device sinks down so that, in the final assembly, there is virtually no gap between the two stacked chips. Verification of accurate bonding between the layers of the PoP stack is checked using X-Ray inspection. The darker balls are from the upper BGA and the lighter balls are from the lower BGA.
Visit Escatec at www.escatec.comAll news
Skyworks to buy PMC-Sierra for $2 billion
October 07, 2015
Analog and RF chip vendor Skyworks Solutions Inc. will pay $2 billion in cash to acquire to acquire network and storage mixed-signal ...
Teardown: ADI provides force touch controller in iPhone
Teardown: Knowles wins microphone slots in iPhone 6S
Two-Wheelers will get connected, too
Searchable 4K mobile imaging soon a commodity
Virtual reality: a real driver for GPUs, says ARM
October 06, 2015
AMD has just announced its collaboration with Oculus and Dell to equip Oculus Ready PCs with AMD Radeon GPUs. The beefed ...
Lossy Adesto preps IPO
u-blox and Cohda Wireless partner on V2X
Elon Musk targets high-volume solar panel dominance
- Determine Balancing Current for the LTC3305 Lead-Acid Battery Balancer
- 3 Ways to Simplify Medical Device Testing
- Thread Networking Protocol Simplifies Connecting “Things” in the Home and Beyond
- High Voltage CMOS Amplifier Enables High Impedance Sensing with a Single IC
InterviewMEMS platforms are way to go, says Bosch's Finkbeiner
In the two years since we last interviewed Stefan Finkbeiner, CEO of Bosch Sensortec, the company has taken over from STMicroelectronics as the leading global supplier of MEMS components. Here he explains ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, LabNation is giving away three of its SmartScope open source USB oscilloscopes, worth 229 Euros each, for EETimes Europe's readers to win.
Successfully funded through Kickstarter last year, the SmartScope is claimed to be the world's first test equipment designed to run on multiple operating systems and platforms such as smartphones, tablets and PCs. It is powered directly from... MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.